Abstract: A memory apparatus includes an address decoding circuit configured to output a test redundancy address based on an address that is transmitted from a memory controller; and a redundancy address check circuit configured to determine whether the test redundancy address is replacing a failed address, in order to perform an ECC test operation by using the test redundancy address.

Abstract: A memory apparatus includes an address decoding circuit configured to output a test redundancy address based on an address that is transmitted from a memory controller; and a redundancy address check circuit configured to determine whether the test redundancy address is replacing a failed address, in order to perform an ECC test operation by using the test redundancy address.

Abstract: Provided is an artificial intelligence overtopping prediction device including first and second pressure measurement parts 103 and 105 configured to measure a collision pressure of waves colliding with a marine structure 10 and a pressure of waves introduced into a road surface 20, an overtopping alert part 109 configured to collect images around the overtopping prediction device 100 and output an alert sound, an information collection and control part 107 including a drone storage 170 configured to fly the drone 202, and a collection controller 160 configured to control the overtopping prediction device 100, receive and store the wave pressure information and the overtopping amount information, and transmit the information to an overtopping prediction system 500 to predict and generate overtopping prediction information, and a frame part 101 including a support frame 110. Also, disclosed herein is an overtopping prediction system using the artificial intelligence overtopping prediction device 100.

Abstract: A semiconductor system includes a controller configured to output parity information that includes an expected value at which an error correction code (ECC) encoding operation has been performed on an address in a test mode of a semiconductor device and configured to receive failure information. The semiconductor system also includes the semiconductor device configured to store an internal parity generated by performing the ECC encoding operation on the address that is input in a normal mode of the semiconductor device and configured to output the failure information generated by comparing the parity information and an output parity generated from the internal parity that is stored in the semiconductor device in the test mode.

Abstract: A memory apparatus includes an address decoding circuit configured to output a test redundancy address based on an address that is transmitted from a memory controller; and a redundancy address check circuit configured to determine whether the test redundancy address is replacing a failed address, in order to perform an ECC test operation by using the test redundancy address.

Abstract: A semiconductor device includes a read/write control circuit, a core circuit, and a data conversion circuit. The read/write control circuit generates a read strobe signal and a read address from an internal address/command signal based on an internal read command during a self-write operation, generates a write strobe signal after the read strobe signal is generated, and generates a write address from the internal address/command signal. The core circuit is synchronized with the read strobe signal to output read data stored in a bank selected by the read address and is synchronized with the write strobe signal to store write data into the bank or another bank which is selected by the write address. The data conversion circuit changes a pattern of the read data to generate the write data.

Abstract: A semiconductor device includes a read/write control circuit, a core circuit, and a data conversion circuit. The read/write control circuit generates a read strobe signal and a read address from an internal address/command signal based on an internal read command during a self-write operation, generates a write strobe signal after the read strobe signal is generated, and generates a write address from the internal address/command signal. The core circuit is synchronized with the read strobe signal to output read data stored in a bank selected by the read address and is synchronized with the write strobe signal to store write data into the bank or another bank which is selected by the write address. The data conversion circuit changes a pattern of the read data to generate the write data.