Patents by Inventor Yeong Seol KWON

Yeong Seol KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pressure sensor apparatus and method for manufacturing pressure sensor apparatus and pressure sensor assembly
    Patent number: 10900855
    Abstract: Provided is a pressure sensor apparatus including a lead frame, a pressure sensing element mounted on the lead frame to measure a relative pressure between a first part and a second part, and a housing including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part, wherein the reference medium inlet hole is provided in a first surface of the housing, wherein the target medium inlet hole is provided in a second surface of the housing other than the first surface, and wherein the lead frame includes one or more insertion terminals configured to be inserted into and electrically connected to terminal holes of a wire connector.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: January 26, 2021
    Assignee: ITM SEMICONDUCTOR CO., LTD.
    Inventors: Hyuk Hwi Na, Ho Seok Hwang, Ja Guen Gu, Dong Hee Lee, Hyang Won Kang, Hyung Jin Lim, Yeong Seol Kwon
  • PRESSURE SENSOR APPARATUS AND METHOD FOR MANUFACTURING PRESSURE SENSOR APPARATUS AND PRESSURE SENSOR ASSEMBLY
    Publication number: 20190086282
    Abstract: Provided is a pressure sensor apparatus including a lead frame, a pressure sensing element mounted on the lead frame to measure a relative pressure between a first part and a second part, and a housing including a reference medium inlet hole to apply a pressure of a reference medium to the first part, and including a target medium inlet hole to apply a pressure of a target medium to the second part, wherein the reference medium inlet hole is provided in a first surface of the housing, wherein the target medium inlet hole is provided in a second surface of the housing other than the first surface, and wherein the lead frame includes one or more insertion terminals configured to be inserted into and electrically connected to terminal holes of a wire connector.
    Type: Application
    Filed: March 9, 2017
    Publication date: March 21, 2019
    Inventors: Hyuk Hwi NA, Ho Seok HWANG, Ja Guen GU, Dong Hee LEE, Hyang Won KANG, Hyung Jin LIM, Yeong Seol KWON