Patents by Inventor Yew Teck Yap

Yew Teck Yap has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7094062
    Abstract: A land grid array connector includes a housing having a plurality of passageways therethrough and a conductive contact provided in each passageway. A recess is formed in each passageway. Each contact has a deformable portion having a tip provided at an end thereof. The deformable portion is capable being in an undeformed position and in a deformed position. When a lateral force is placed on the deformable portion of each contact, at least a portion of the tip is maintained within the recess. The recess is sized and configured to limit lateral deflection of the tip upon deformation of the deformable portion in a lateral direction.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: August 22, 2006
    Assignee: Molex Incorporated
    Inventors: Samuel C. Ramey, Lily T. C. Chang, Yew Teck Yap
  • Patent number: 6918789
    Abstract: A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components preferably includes upper and lower housing formed from an insulative material, with cavities formed therein that receive terminal assemblies. The upper and lower housings are formed with internal cavities that extend in different directions. These cavities are aligned together when the upper and lower housings are assembled together to define a plurality of internal cavities that extend through the first and second connector components. Each cavity contains a terminal assembly with differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer shell. The exterior surfaces of the connector components are plated with a conductive material so that the connector components serve as grounds for the differential signal terminals.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: July 19, 2005
    Assignee: Molex Incorporated
    Inventors: Harold Keith Lang, Kent E. Regnier, Emanuel G. Banakis, David R. Schmidgall, Yew Teck Yap
  • Patent number: 6832936
    Abstract: A terminal module is provided for use in an electrical connector. The module includes a plurality of conductive terminals arranged in a generally parallel side-by-side array. Each terminal includes a pair of opposite end sections. A pair of holding sections are located respectively adjacent to and inside the end sections. A central section is located between the holding sections. A dielectric plastic housing is overmolded about the holding sections leaving the opposite end sections exposed. The overmolded housing leaves a substantial portion of the central section exposed.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: December 21, 2004
    Assignee: Molex Incorporated
    Inventors: Kirk B. Peloza, Kent Regnier, Yew Teck Yap
  • Publication number: 20040161974
    Abstract: A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components preferably includes upper and lower housing formed from an insulative material, with cavities formed therein that receive terminal assemblies. The upper and lower housings are formed with internal cavities that extend in different directions. These cavities are aligned together when the upper and lower housings are assembled together to define a plurality of internal cavities that extend through the first and second connector components. Each cavity contains a terminal assembly with differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer shell. The exterior surfaces of the connector components are plated with a conductive material so that the connector components serve as grounds for the differential signal terminals.
    Type: Application
    Filed: May 6, 2003
    Publication date: August 19, 2004
    Inventors: Harold Keith Lang, Kent E. Regnier, Emanuel G. Banakis, David R. Schmidgall, Yew Teck Yap
  • Publication number: 20040077221
    Abstract: A terminal module is provided for use in an electrical connector. The module includes a plurality of conductive terminals arranged in a generally parallel side-by-side array. Each terminal includes a pair of opposite end sections. A pair of holding sections are located respectively adjacent to and inside the end sections. A central section is located between the holding sections. A dielectric plastic housing is overmolded about the holding sections leaving the opposite end sections exposed. The overmolded housing leaves a substantial portion of the central section exposed.
    Type: Application
    Filed: October 17, 2002
    Publication date: April 22, 2004
    Inventors: Kirk B. Peloza, Kent E. Regnier, Yew Teck Yap
  • Patent number: 6722898
    Abstract: An improved termination assembly for multiple grounds of a multi-wire cable is disclosed. The assembly includes a U-shaped retention clip that engages with a termination portion of a ground terminal housed in a connector housing. The clip has at least one notch formed in an edge thereof which is used to locate a drain, or ground, wire in place on the clip in position for soldering the drain wire to the clip. The termination portion may be provided with an opening aligned with one of the notches of the clip so that two drain wires of the cable may be oriented above the signal wires of the cables in similar positions to impose a measure of mechanical uniformity on the termination.
    Type: Grant
    Filed: October 17, 2002
    Date of Patent: April 20, 2004
    Assignee: Molex Incorporated
    Inventors: Kirk B. Peloza, Yew Teck Yap, Timothy E. Purkis, Jose H. Chavez, Jr.
  • Publication number: 20030073331
    Abstract: An improved termination assembly for multiple grounds of a multi-wire cable is disclosed. The assembly includes a U-shaped retention clip that engages with a termination portion of a ground terminal housed in a connector housing. The clip has at least one notch formed in an edge thereof which is used to locate a drain, or ground, wire in place on the clip in position for soldering the drain wire to the clip. The termination portion may be provided with an opening aligned with one of the notches of the clip so that two drain wires of the cable may be oriented above the signal wires of the cables in similar positions to impose a measure of mechanical uniformity on the termination.
    Type: Application
    Filed: October 17, 2002
    Publication date: April 17, 2003
    Inventors: Kirk B. Peloza, Yew Teck Yap, Timothy E. Purkis, Jose H. Chavez
  • Patent number: 6453552
    Abstract: A method of manufacturing electrical terminals and/or a terminal module is disclosed. The method includes the steps of stamping from a sheet of metal material a blank for a plurality of elongated terminals having contact portions at one end and terminal portions at the other end and joining the terminals by a tie bar intermediate the ends. The contact portions of the respective terminals are separated from each other by the stamping step. The terminal portions remain joined in the sheet of metal after the stamping step. The blank then is sheared to separate the terminal portions. The tie bar is cut to separate the terminals. In order to form a terminal module, a dielectric housing is overmolded about the terminals intermediate the ends thereof, with the tie bar being located outside the housing and removed after the overmolding process.
    Type: Grant
    Filed: January 30, 1998
    Date of Patent: September 24, 2002
    Assignee: Molex Incorporated
    Inventors: Jose H. Chavez, Jr., Gary M. Comstock, Arvind Patel, Timothy E. Purkis, Yew Teck Yap
  • Patent number: 6315608
    Abstract: A shielded connector has an outer metal shield that is formed from a metal shell. One or both free ends of the shell are upturned and abutted together so as to form an inner shielding wall. This inner shielding wall extends into the receptacle portion of the connector between pairs of designated terminals. The connector housing is molded over the free ends in order to hold them together. The inner shield wall increases capacitive coupling with the connector terminals which decreases the impedance of the connector.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: November 13, 2001
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, Yew Teck Yap, David L. Brunker
  • Patent number: 6299487
    Abstract: A connector is formed with a metal shell for use as a shield of the connector. The shell has a pair of tab members formed along its front face that are stamped to provide two metal contact points. These tabs are engaged by metal contact arms formed on a shield of an opposing connector. The metal to metal contact that results from the tab members decreases wear and abrasion and also serves as a conductive connection between the two connector shields.
    Type: Grant
    Filed: April 3, 2000
    Date of Patent: October 9, 2001
    Assignee: Molex Incorporated
    Inventors: John E. Lopata, Kirk B. Peloza, Yew Teck Yap, Timothy E. Purkis, Jose H. Chavez, Jr.
  • Patent number: 6220882
    Abstract: An IC connector is adapted for connecting an IC card having a terminal array. The connector includes a base member having a plurality of electrically conductive contacts for engaging the terminal array of the IC card. A cover is mounted on the base member for pivotal movement toward and away from one side of the base member. The cover has a receptacle means for securing the IC card thereon. The IC card is received for sliding movement relative to the cover between a preload position and a latched position. A biasing shoulder on the base member slides the IC card from its preload position to its latched position in response to closing of the cover. A latch on the base member engages the IC card in its latched position to lock the cover and IC card in a closed position on the base member.
    Type: Grant
    Filed: November 15, 1999
    Date of Patent: April 24, 2001
    Assignee: Molex Incorporated
    Inventors: George M. Simmel, Yew Teck Yap, Malgorzata M. Firlej
  • Patent number: 5934942
    Abstract: A shielded electrical connector assembly includes a dielectric housing having a module-receiving cavity. A terminal module is inserted into the cavity. A conductive shell is disposed about at least a portion of the housing. The shell includes a locking portion projecting through the housing into a position for engagement with the terminal module to lock the module in the cavity.
    Type: Grant
    Filed: December 30, 1997
    Date of Patent: August 10, 1999
    Assignee: Molex Incorporated
    Inventors: Arvind Patel, Gary M. Comstock, Yew Teck Yap
  • Patent number: 5885090
    Abstract: An electrical connector (10) includes a dielectric housing (12) having a terminal-receiving passage (14) for insertion thereinto of a terminal (16) in a given insertion direction (A). The terminal includes a first spring contact arm (22) projecting into the passage (14) for engagement by an appropriate first mating conductor. An engagement arm (26) is in line with the first spring contact arm (22) to provide an engagement shoulder for an insertion tool which forces the terminal (10) into the passage (14) of the housing. A second spring contact arm (24) is offset laterally of the insertion direction (A) from the first spring contact arm (22) out of a path for the insertion tool to the engagement arm. The second spring contact arm (24) is adapted for engagement by an appropriate second mating conductor.
    Type: Grant
    Filed: March 21, 1997
    Date of Patent: March 23, 1999
    Assignee: Molex Incorporated
    Inventors: Gary M. Comstock, Arvind Patel, Yew-Teck Yap