Patents by Inventor Yi-Chen Chou

Yi-Chen Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240164121
    Abstract: A transparent panel and a display device are provided. The transparent panel includes a substrate, a touch sensing module, and an organic photovoltaic module. The substrate has a first surface and a second surface opposite to the first surface. The touch sensing module is disposed on the first surface of the substrate. The organic photovoltaic module is disposed on the second surface of the substrate. An average visible transmittance of the transparent panel is greater than 70%.
    Type: Application
    Filed: January 12, 2023
    Publication date: May 16, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chun-Che Tsao, Yi-Chen Chou
  • Publication number: 20240158643
    Abstract: An optical coating material, an optical film and an optical substrate are provided. The optical coating material includes 15 wt % to 40 wt % of resin, 1 wt % to 10 wt % of nano-dispersion solution and 40 wt % to 70 wt % of organic solvent. The resin is at least one selected from a group consisting of polyurethane acrylate resin, epoxy resin, acrylate resin and acrylic polyol resin. The nano-dispersion solution includes nanoparticles. The nanoparticles includes aluminum oxide, zirconium oxide, titanium oxide or silicon oxide.
    Type: Application
    Filed: January 12, 2023
    Publication date: May 16, 2024
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Te-Chao Liao, Chun-Che Tsao, Yi-Chen Chou
  • Patent number: 11950431
    Abstract: A magnetic tunnel junction (MTJ) device includes two magnetic tunnel junction elements and a magnetic shielding layer. The two magnetic tunnel junction elements are arranged side by side. The magnetic shielding layer is disposed between the magnetic tunnel junction elements. A method of forming said magnetic tunnel junction (MTJ) device includes the following steps. An interlayer including a magnetic shielding layer is formed. The interlayer is etched to form recesses in the interlayer. The magnetic tunnel junction elements fill in the recesses. Or, a method of forming said magnetic tunnel junction (MTJ) device includes the following steps. A magnetic tunnel junction layer is formed. The magnetic tunnel junction layer is patterned to form magnetic tunnel junction elements. An interlayer including a magnetic shielding layer is formed between the magnetic tunnel junction elements.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: April 2, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Wei Chen, Hui-Lin Wang, Yu-Ru Yang, Chin-Fu Lin, Yi-Syun Chou, Chun-Yao Yang
  • Publication number: 20230305037
    Abstract: A sensing electronic device includes a substrate, and a reference voltage control unit. The sensing array is arranged on the substrate, and includes a first sensing electrode and a second sensing electrode. The reference voltage control unit is electrically connected to the sensing array. In an operation period, the reference voltage control unit has a first voltage, the first sensing electrode has a second voltage, and the second sensing electrode has a third voltage, wherein a difference between the first voltage and the second voltage is different from a difference between the first voltage and the third voltage.
    Type: Application
    Filed: February 23, 2023
    Publication date: September 28, 2023
    Inventors: Chao-Yin KUO, Yi-Chen CHOU, Wen-Hsiang LIAO
  • Publication number: 20230131409
    Abstract: A method for producing a coating layer with scratch resistance and flex resistance, a laminated structure, and a coating composition are provided. The method includes coating the coating composition on a plastic substrate and performing a curing operation on the coating composition to form a cured coating layer. The coating composition includes a polyhedral oligomeric silsesquioxane, a multifunctional epoxy resin, a cationic light initiator, and an organic solvent, and the polyhedral oligomeric silsesquioxane has a cage-like structure. The curing operation has a baking temperature that is within a range from 75° C. to 200° C., a baking time that is within a range from 30 s to 120 s, and an UV curing energy that is within a range from 250 mJ/cm2 to 1,250 mJ/cm2.
    Type: Application
    Filed: July 22, 2022
    Publication date: April 27, 2023
    Inventors: TE-CHAO LIAO, CHUN-CHE TSAO, Yi-Chen Chou
  • Publication number: 20230066802
    Abstract: An electrical connector is provided that includes an insulative body, an upper terminal module, and a lower terminal module. The upper terminal module and the lower terminal module are provided to the insulative body. The upper terminal module includes a plurality of upper terminals and an upper insulative frame, the plurality of upper terminals include multiple upper signal terminals and at least one upper ground terminal. Each upper terminal has an upper vertical segment, an upper horizontal segment and an upper bending segment connected between the upper vertical segment and the upper horizontal segment, the upper vertical segment has a first upper held portion and an upper soldering portion, the upper horizontal segment has a second upper held portion and an upper cantilevered arm portion. The upper insulative frame has a first embedding portion which embeds the first upper held portion and a second embedding portion which embeds the second upper held portion.
    Type: Application
    Filed: July 19, 2022
    Publication date: March 2, 2023
    Applicant: Molex, LLC
    Inventors: Ting Chang TSENG, Venkatesan MANICKAM, Yi-Chen CHOU
  • Publication number: 20220181167
    Abstract: A manufacturing method of a package structure including the following steps is provided. A carrier is provided. An anti-warpage structure is formed on the carrier. And a redistribution layer is formed on the carrier. In the normal direction of the carrier, a warpage trend of the anti-warpage structure is opposite to a warpage trend of the redistribution layer.
    Type: Application
    Filed: November 11, 2021
    Publication date: June 9, 2022
    Applicant: Innolux Corporation
    Inventors: Yi-Hung Lin, Wen-Hsiang Liao, Cheng-Chi Wang, Yi-Chen Chou, Fuh-Tsang Wu, Ker-Yih Kao
  • Patent number: 11150189
    Abstract: A method of manufacturing a light source carrier with at least one light source, including: providing a substrate with a plurality of light source groups disposed thereon, wherein each light source group includes the at least one light source; irradiating a first light upon one of the light source groups through a first mask; capturing a photoluminescent light emitted by the one of the light source groups to acquire data; comparing the data with a reference to determine whether the one of the light source groups is qualified; providing a carrier; and transferring the one of the light source groups from the substrate to the carrier if the one of the light source groups is qualified.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: October 19, 2021
    Assignee: INNOLUX CORPORATION
    Inventors: Wan-Ting Ke, Allen Tseng, Wen-Hsiang Liao, Yi-Chen Chou
  • Publication number: 20130162789
    Abstract: An endoscope including a tube, a wafer-level imaging module, a holder and a light source is provided. The wafer-level imaging module is coupled to a distal end of the tube. The holder is disposed to house the wafer-level imaging module. The light source is bonded on the surface of the holder.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: HIMAX IMAGING LIMITED
    Inventors: Yi-Chen Chou, Yung-Che Chung
  • Publication number: 20130165749
    Abstract: An endoscope including a tube and a distal section is provided. The distal section, coupled to a distal end of the tube, includes a left wafer-level image sensor, disposed to capture at least one left image, and a right wafer-level image sensor, disposed to capture at least one right image. Wherein, the captured left image and right image are processed as a 3D image.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: HIMAX IMAGING LIMITED
    Inventors: Yi-Chen Chou, Yung-Che Chung
  • Publication number: 20130162767
    Abstract: An endoscope, tied-in a display device, including a tube, a distal section and a handling section is provided. The distal section, coupled to a distal end of the tube, includes a first wafer-level image sensor which is disposed to capture at least one first image. The handling section, coupled to a proximal end of the tube, includes a transmitter which transmits the first image to the display device via a wireless connection.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: HIMAX IMAGING LIMITED
    Inventors: Yi-Chen Chou, Yung-Che Chung
  • Publication number: 20130165752
    Abstract: The invention is directed to an endoscope having a wafer-level imaging module (WLM) and a light source bonded on a substrate. The endoscope also includes a holder, to which the substrate with the bonded WLM and the bonded light source is attached.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: HIMAX IMAGING LIMITED
    Inventor: Yi-Chen Chou
  • Publication number: 20130165750
    Abstract: The invention is directed to an endoscope having a distal section coupled to a distal end of a tube, and a wire disposed in the tube, wherein a distal end of the wire is fixed at a distal point of the tube. The endoscope also includes a handling section coupled to a proximal end of the tube. The wire slidingly passes through a sliding point that is situated between the distal point and the proximal end of the wire, such that the wire is constrained at the sliding point. A proximal end of the wire is capable of being pulled to bend the tube.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicant: HIMAX IMAGING LIMITED
    Inventor: Yi-Chen Chou
  • Publication number: 20130165751
    Abstract: The invention is directed to a waterproof endoscope having a wafer-level imaging module (WLM) bonded on a substrate. The endoscope also includes a holder, which has a groove formed into an inner surface of the holder. First glue is filled in the groove, and second glue is applied at a junction between the holder and the tube.
    Type: Application
    Filed: December 22, 2011
    Publication date: June 27, 2013
    Applicants: HIMAX TECHNOLOGIES LIMITED, HIMAX IMAGING LIMITED
    Inventors: Yi-Chen Chou, Kai-Cheng Wang
  • Publication number: 20080116252
    Abstract: A storage box capable of separating food from soup comprises a water proof hollow box made of a paper cardboard for storing wet food. The paper cardboard is a further comprises a substrate layer provided with a protective insulating layer for preventing the infiltration of water and germs. There is further a water filtering layer on predetermined location on a surface of the protective insulating layer, whereby the food and the soup can be separated when the carton box is torn properly. It can also added with a tearing piece adjacent to the water filtering layer, whereby the filtering layer will automatically eject soup from the box through when the tearing piece is torn.
    Type: Application
    Filed: November 20, 2006
    Publication date: May 22, 2008
    Inventor: Yi-Chen Chou