Patents by Inventor Yi-Cheng Chen

Yi-Cheng Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Patent number: 11955397
    Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: April 9, 2024
    Assignee: Vanguard International Semiconductor Corporation
    Inventors: Shin-Cheng Lin, Cheng-Wei Chou, Ting-En Hsieh, Yi-Han Huang, Kwang-Ming Lin, Yung-Fong Lin, Cheng-Tao Chou, Chi-Fu Lee, Chia-Lin Chen, Shu-Wen Chang
  • Publication number: 20240102934
    Abstract: A test strip detecting system includes a test strip, a test strip detecting carrier and a mobile communication apparatus. The test strip detecting carrier includes a container structure, positioning markers and colorimetric calibrating blocks, and the colorimetric calibrating blocks are embedded inside the positioning markers. The test strip is placed in the container structure and reacts with a specimen to generate color blocks. The mobile communication apparatus controls an image capture unit to capture an original image of the test strip placed in the test strip detecting carrier; detects the positioning markers in the original image to obtain a plurality of coordinates of the positioning markers; performs image coordinate calibration according to the plurality of coordinates to generate a calibrated image; and performs a colorimetric calibration for the color blocks and the colorimetric calibrating blocks according to the calibrated image so as to generate a test result.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 28, 2024
    Applicant: National Cheng Kung University
    Inventors: Yu-Cheng Lin, Wei-Chien Weng, Yi-Hsuan Chen
  • Publication number: 20240102959
    Abstract: An IC structure includes a biologically sensitive field-effect transistor (BioBET) in a semiconductor substrate, and a dielectric layer over a backside surface of the semiconductor substrate. The dielectric layer has a sensing well extending through the dielectric layer to a channel region of the BioFET. The IC structure further includes a biosensing film, a plurality of fluid channel walls, and a first heater. The biosensing film lines the sensing well in the dielectric layer. The fluid channel walls are over the biosensing film and define a fluid containment region over the sensing well of the dielectric layer. The first heater is in the semiconductor substrate. The first heater has at least a portion overlapping with the fluid containment region.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Tung-Tsun CHEN, Yi-Hsing HSIAO, Jui-Cheng HUANG, Yu-Jie HUANG
  • Publication number: 20240104032
    Abstract: The address conversion system includes a storage device, a memory bus, and a processor. The processor is configured to execute the following steps: generating a real buffer on the storage device; generating a fake buffer in a fake capacity of the storage device by a fake buffer algorithm; establishing a coupling relationship between the real buffer and the fake buffer through a coupling algorithm by the coupler of the memory bus; receiving a compressed data from a first device by the real buffer; when a second device wants to read the fake buffer, the coupler guides the second device to the real buffer through the coupling relationship for reading; transmitting the compressed data of the real buffer to the coupler by the memory bus; decompressing the compressed data into a decompressed data by the coupler; and transmitting the decompressed data to the second device by the memory bus.
    Type: Application
    Filed: May 18, 2023
    Publication date: March 28, 2024
    Inventors: Kuo-Jung WU, Yi-Cheng CHEN
  • Patent number: 11942543
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
  • Patent number: 11943373
    Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: March 26, 2024
    Assignee: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Mao Cai Li, Zong You Wang, Kai Ban Zhou, Chang Qing Yang, Hu Lan, Li Kong, Jin Song Zhang, Yi Fang Shi, Geng Liang Zhu, Qu Cheng Liu, Qiu Ping Chen
  • Patent number: 11942750
    Abstract: A laser inspection system is provided. A laser source emits a laser with a first spectrum and the laser is transmitted by a first optical fiber. A gain optical fiber doped with special ions is connected to the first optical fiber, and a light detector is provided around the gain optical fiber. When the laser with the first spectrum passes through the gain optical fiber, the gain optical fiber absorbs part of the energy level of the laser with the first spectrum, so that the laser with the first spectrum is converted to generate light with a second spectrum based on the frequency conversion phenomenon. The light detector detects the intensity of the light with the second spectrum, so that the power of the laser source can be obtained.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Chi Lee, Hsin-Chia Su, Shih-Ting Lin, Yu-Cheng Song, Fu-Shun Ho, Chih-Chun Chen
  • Patent number: 11934239
    Abstract: In an embodiment, a circuit includes: an error amplifier; a temperature sensor, wherein the temperature sensor is coupled to the error amplifier; a discrete time controller coupled to the error amplifier, wherein the discrete time controller comprises digital circuitry; a multiple bits quantizer coupled to the discrete time controller, wherein the multiple bits quantizer produces a digital code output; and a heating array coupled to the multiple bits quantizer, wherein the heating array is configured to generate heat based on the digital code output.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jui-Cheng Huang, Yi-Hsing Hsiao, Yu-Jie Huang, Tsung-Tsun Chen, Allen Timothy Chang
  • Publication number: 20240088026
    Abstract: A semiconductor device according to embodiments of the present disclosure includes a first die including a first bonding layer and a second die including a second hybrid bonding layer. The first bonding layer includes a first dielectric layer and a first metal coil embedded in the first dielectric layer. The second bonding layer includes a second dielectric layer and a second metal coil embedded in the second dielectric layer. The second hybrid bonding layer is bonded to the first hybrid bonding layer such that the first dielectric layer is bonded to the second dielectric layer and the first metal coil is bonded to the second metal coil.
    Type: Application
    Filed: January 17, 2023
    Publication date: March 14, 2024
    Inventors: Yi Ching Ong, Wei-Cheng Wu, Chien Hung Liu, Harry-Haklay Chuang, Yu-Sheng Chen, Yu-Jen Wang, Kuo-Ching Huang
  • Patent number: 11923425
    Abstract: A method for manufacturing a device may include providing an ultra-high voltage (UHV) component that includes a source region and a drain region, and forming an oxide layer on a top surface of the UHV component. The method may include connecting a low voltage terminal to the source region of the UHV component, and connecting a high voltage terminal to the drain region of the UHV component. The method may include forming a shielding structure on a surface of the oxide layer provided above the drain region of the UHV component, forming a high voltage interconnection that connects to the shielding structure and to the high voltage terminal, and forming a metal routing that connects the shielding structure and the low voltage terminal.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yi-Cheng Chiu, Tian Sheng Lin, Hung-Chou Lin, Yi-Min Chen, Chiu-Hua Chung
  • Patent number: 11910490
    Abstract: A multi-member Bluetooth device for communicating data with a remote Bluetooth device is disclosed including: a main Bluetooth circuit and an auxiliary Bluetooth circuit. In the period during which the auxiliary Bluetooth circuit operates at a relay mode, the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device and forwards the received packets to the auxiliary Bluetooth circuit; the auxiliary Bluetooth circuit does not sniff packets issued from the remote Bluetooth device, but will switch to a sniffing mode if a signal reception quality indicator of the auxiliary Bluetooth circuit is superior to a predetermined indicator value. In the period during which the auxiliary Bluetooth circuit operates at the sniffing mode, the auxiliary Bluetooth circuit sniffs packets issued from the remote Bluetooth device and the main Bluetooth circuit receives packets transmitted from the remote Bluetooth device.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: February 20, 2024
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Chia Chun Hung, Hou Wei Lin
  • Patent number: 11910564
    Abstract: A liquid cooling device includes a thermally conductive base, a cover, and a metallic partition. The thermally conductive base has a fluid chamber and a plurality of fins. The fins are located in the fluid chamber and protrudes from an inner surface of the thermally conductive base facing the fluid chamber. Every two of the fins located adjacent to each other define a channel therebetween. Distal ends of at least part of the fins located away from the inner surface together form a covering structure partially coving the channels. The metallic partition is located between and welded to the covering structure and the cover.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: February 20, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Wei-Pin Lin, Zhong-Long Zhu, Yi-Cheng Chen
  • Publication number: 20230418621
    Abstract: An electronic system and a display method are provided. The following steps are performed by central processing units: a first central processing unit loads and checks a display firmware; a second central processing unit determines whether the electronic system is in a first connected state based on the display firmware; in response to that the electronic system is in the first connected state, the first central processing unit and the second central processing unit, together with collaborating central processing units of the central processing units, execute a first pre-defined procedure and an external device display procedure based on settings stored in a data area to display a content transmitted by the external device corresponding to the first connected state; and, in response to that the electronic system is not in the first connected state, the first central processing unit executes a second pre-defined procedure.
    Type: Application
    Filed: January 13, 2023
    Publication date: December 28, 2023
    Applicant: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yi-Cheng Chen, Yao-Ching Chiu
  • Publication number: 20230370772
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device, a first Bluetooth member device, and a second Bluetooth member device. The audio broadcasting device broadcasts BLE audio packets and transmits a predetermined volume instruction to the first Bluetooth member device and the second Bluetooth member device before broadcasting the BLE audio packets. The first Bluetooth member device parses the BLE audio packets to acquire a predetermined audio data, controls a first audio playback circuit to playback the predetermined audio data, and configures an audio volume of the first audio playback circuit in advance according to the predetermined volume instruction. The second Bluetooth member device parses the BLE audio packets to acquire the predetermined audio data, controls a second audio playback circuit to playback the predetermined audio data, and configures an audio volume of the second audio playback circuit in advance according to the predetermined volume instruction.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Applicant: Realtek Semiconductor Corp.
    Inventors: Yu Hsuan LIU, Yung Chieh LIN, Qing GU, Bi WEI, Yi-Cheng CHEN
  • Patent number: 11818555
    Abstract: A Bluetooth audio broadcasting system includes: an audio broadcasting device, a first Bluetooth member device, and a second Bluetooth member device. The audio broadcasting device broadcasts BLE audio packets and transmits a volume adjusting instruction to the first Bluetooth member device and the second Bluetooth member device after they receive the BLE audio packets. The first Bluetooth member device parses the BLE audio packets to acquire a predetermined audio data, controls a first audio playback circuit to playback the predetermined audio data, and adjusts an audio volume of the first audio playback circuit according to the volume adjusting instruction. The second Bluetooth member device parses the BLE audio packets to acquire the predetermined audio data, controls a second audio playback circuit to playback the predetermined audio data, and adjusts an audio volume of the second audio playback circuit according to the volume adjusting instruction.
    Type: Grant
    Filed: December 16, 2021
    Date of Patent: November 14, 2023
    Assignee: REALTEK SEMICONDUCTOR CORP.
    Inventors: Yu Hsuan Liu, Yung Chieh Lin, Qing Gu, Bi Wei, Yi-Cheng Chen
  • Patent number: 11809337
    Abstract: Disclosed is a graphics processing device including a main SoC, a performance-enhancing SoC, and an external circuit that is set outside any of the two SoCs. The main SoC includes: a first graphics processing unit (GPU) dividing to-be-processed data into a first input part and a second input part, and processing the first output part to generate first output data; and a first transceiver circuit forwarding the second input part to the performance-enhancing SoC via the external circuit, and then receiving second output data via the external circuit and forwarding it. The performance-enhancing SoC includes: a second transceiver circuit receiving the second input part via the external circuit and outputting the second output data to the main SoC via the external circuit; and a second GPU receiving the second input part from the second transceiver circuit and processing this part to provide the second output data for the second transceiver.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: November 7, 2023
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Yi-Cheng Chen, Hsu-Jung Tung
  • Patent number: 11808560
    Abstract: A measuring equipment, applied to carry a workpiece to be measured, includes a main base and a positioning device. The main base includes a measuring center axis. The positioning device includes at least two positioning elements. Each of the at least two positioning elements is disposed movably on the main base, and each of the at least two positioning elements is moved with respect to the measuring center axis. An identical distance is there from each of the at least two positioning elements to the measuring center axis. Each of the at least two positioning elements is used for the workpiece to contact and to be positioned to the measuring center axis.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: November 7, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yi-Cheng Chen, Yi-Chia Hsu, Chia-Ching Lin, Chih-Chieh Chao
  • Patent number: 11770784
    Abstract: A multi-member Bluetooth device for communicating data with a source Bluetooth device acting as a master in a first piconet. The multi-member Bluetooth device includes a main Bluetooth circuit acting as a slave in the first piconet and as a master in a second piconet, and an auxiliary Bluetooth circuit acting as a slave in the second piconet. The main Bluetooth circuit generates a first slave clock and a second main clock according to a first main clock generated by the source Bluetooth device, with which both the first slave clock and the second main clock are synchronized. The auxiliary Bluetooth circuit generates a second slave clock and a third slave clock according to the second main clock, with which both the second slave clock and the third slave clock are synchronized. The auxiliary Bluetooth circuit sniffs Bluetooth packets transmitted through the first piconet from the source Bluetooth device.
    Type: Grant
    Filed: August 17, 2022
    Date of Patent: September 26, 2023
    Assignee: Realtek Semiconductor Corp.
    Inventors: Yi-Cheng Chen, Kuan-Chung Huang, Hung-Chuan Chang, Chin-Wen Wang
  • Patent number: 11770583
    Abstract: A power-saving method for an HDMI device is provided. The method includes detecting color depth information of video data from an HDMI source which is connected to the HDMI port, deriving a horizontal length for each line by fragment of a picture frame according to the color depth information, generating a plurality of synchronization signals according to the horizontal length for each line by fragment, and powering on the HDMI port, according to the synchronization signals, for a predetermined time period to obtain encrypted information from the HDMI source, and powering off the HDMI port after the predetermined time period.
    Type: Grant
    Filed: July 21, 2022
    Date of Patent: September 26, 2023
    Assignee: MEDIATEK INC.
    Inventors: You-Tsai Jeng, Chia-Hao Chang, Yi-Cheng Chen, Kai-Wen Yeh, Kuo-Chang Cheng, Chi-Chih Chen, Szu-Hsiang Lai, Chin-Lung Lin, Kai-Wen Cheng, Te-Chuan Wang, Ko-Yin Lai, Keng-Lon Lei, Tai-Lai Tung