Abstract: The present disclosure provides a SARS-CoV-2 vaccine composition and use thereof. The SARS-CoV-2 vaccine composition includes a mutant SARS-CoV-2 spike protein with N-linked glycosylation in N-terminal domain or receptor binding domain, and can effectively elicit an immune response in an individual against different SARS-CoV-2 variants.

Abstract: Migrating workloads between a plurality of execution environments, including: identifying, in dependence upon on characteristics of a workload, one or more execution environments that can support the workload; determining, for each execution environment, costs associated with supporting the workload on the execution environment; selecting, in dependence upon the costs associated with supporting the workload on each the execution environments, a target execution environment for supporting the workload; and executing the workload on the target execution environment.

Abstract: Presenting workload performance in a storage system, including: receiving, via a user interface, information describing a potential change to an execution environment of the storage system; and displaying, via the user interface and in dependence upon a load model and predicted characteristics of one or more workloads executing on the storage system, predicted performance load on the storage system that would result from implementing the potential change.

Abstract: Migrating workloads between a plurality of execution environments, including: identifying, in dependence upon on characteristics of a workload, one or more execution environments that can support the workload; determining, for each execution environment, costs associated with supporting the workload on the execution environment; selecting, in dependence upon the costs associated with supporting the workload on each the execution environments, a target execution environment for supporting the workload; and executing the workload on the target execution environment.

Abstract: A purge process for a chip performed after a dry etching process is provided. The dry etching process is carried out inside a reaction chamber. The purge process is used to remove any byproducts produced by said dry etching process. The purge process includes injecting an inert gas into the reaction chamber to purge the same. Then, the gas inside the reaction chamber is exhausted. The purge process prevents the formation of defects in subsequent metal interconnect fabrication process.

Abstract: A drying process for wafers includes positioning the wafers to be dried in a cleaning device full of isopropyl alcohol (IPA) vapor and replacing moisture out of the wafers with the IPA vapor. Gas steam including the IPA vapor is exhausted from the cleaning device into a scrubber, and the scrubber has at least a solvent therein for dissolving the IPA vapor and an exhaust outlet for discharging gas mixture of the IPA vapor and the solvent. A flow rate of the solvent in the scrubber is adjusted to increase a concentration of the IPA vapor in the cleaning device and thus obtain better uniformity for drying the wafers.