Abstract: A touch sensing device and a touch control system are provided. The touch sensing device includes a substrate, three conductive sensor pad units and a processing unit. The three conductive sensor pad units sense a touch operation and generate three corresponding sensing signals in response to the touch operation. The processing unit determines values of at least three variables according to the three sensing signals. The controlled device of the touch control system is controlled according to the values of the variables.

Abstract: An input device and an input method for a data processing device are provided. The input device includes a touch-sensitive module, an operation prompt interface and a controller. According to the input method, the input device issues a first input signal to the data processing device when a first electrical property change resulting from the keystroke or the tap is sensed in a first operation state. The input device is switched from the first operation state to a second operation state in response to a switching operation. The input device issues a second input signal to the data processing device when a second electrical property change resulting from a touch action is sensed in the second operation state.

Abstract: A wireless control system, a touch-sensitive pad structure, a touch-sensitive module and a method for manufacturing the touch-sensitive module are provided. The wireless control system includes a controlled device and a remote controller which includes the touch-sensitive module. The touch-sensitive module includes a plurality of sensor pads. The controlled device is controlled by detecting changes of physical properties of the sensor pads without touching the sensor pads.

Abstract: A touch-sensitive keypad control device for use with a controlled device is provided. The touch-sensitive keypad control device includes: a housing, a touch control device disposed in the housing, and a keypad device uncovered from the housing and disposed above the touch control device. The touch control device generates a first command for controlling the controlled device in response to a gesture of a user relative to the keypad device, and the keypad device generates a second command for controlling the controlled device in response to a level change of the keypad device relative to the housing in response to a pressing operation of a user.

Abstract: A method for forming a through wafer via hole in a semiconductor device, wherein the semiconductor device comprises a wafer having a SiC substrate with a front side and a backside, a GaN-based layer formed on the front side of the SiC substrate, and a mask structure formed on the backside of the SiC substrate defining an etching area. The etching area is first descummed A through substrate via hole is formed by etching the etching area through the SiC substrate. The mask structure is removed and the inner surface of the through substrate via hole is cleaned. The inner surface of the through substrate via hole is then descummed A through wafer via hole is formed by etching through the GaN layer in the through substrate via hole. And lastly the inner surface of the through wafer via hole is cleaned.

Abstract: A wafer edge protector is used in an inductively coupled plasma reactive ion etching instrument for the manufacturing of GaN semiconductor devices and circuits. The wafer edge protector comprises a ring clamp, which has a first inner diameter and a second inner diameter, and the ring clamp covers the edges of a wafer and a wafer carrier to clamp the wafer and the wafer carrier and to prevent damage on the edges of the wafer and the wafer carrier during the etching process.