Patents by Inventor Yi-Hsin Liu

Yi-Hsin Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240128214
    Abstract: An integrated circuit structure includes an aluminum pad layer on a dielectric stack, a passivation layer covering the aluminum pad layer, and an aluminum shield layer including aluminum routing patterns disposed directly above an embedded memory area and embedded in the dielectric stack. The aluminum shield layer is electrically connected to the uppermost copper layer through a plurality of tungsten vias. The plurality of tungsten vias is embedded in the dielectric stack.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Aaron Chen, Chi Ren, Yi Hsin Liu
  • Patent number: 11901318
    Abstract: An integrated circuit structure includes a substrate with a circuit region thereon and a copper interconnect structure disposed on the substrate. The copper interconnect structure includes an uppermost copper layer covered by a dielectric layer. An aluminum pad layer is provided on the dielectric layer. A metal layer is provided on the circuit region and is located between the uppermost copper layer and the aluminum pad layer.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: February 13, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Aaron Chen, Chi Ren, Yi Hsin Liu
  • Publication number: 20230168214
    Abstract: A preparation method of monolayer two-dimensional materials, including the following steps: providing a metal acetate dihydrate, with a general formula M(CH3COO)2.2H2O, in which M may be metal ion cadmium or zinc. Dissolving the metal acetate dihydrate in ethylene diamine and heating to 60° C. for two hours to form a metal cation precursor solution. Providing a chalcogen element powder, in which the chalcogen element powder is selected from sulfur, selenium, or tellurium. Dissolving the chalcogen element powder and sodium borohydride in ethylene diamine, and standing at room temperature for 24 hours to form a chalcogenide-amine precursor solution. Mixing the metal cation precursor solution with the chalcogenide-amine precursor solution to form a mixed solution. Transferring the mixed solution in a high temperature autoclave for reaction to form the monolayer two-dimensional materials.
    Type: Application
    Filed: February 11, 2022
    Publication date: June 1, 2023
    Inventors: YI-HSIN LIU, KAI-CHUN CHUANG, CHI LI, SHENG-CHIH HSU
  • Publication number: 20220262749
    Abstract: An integrated circuit structure includes a substrate with a circuit region thereon and a copper interconnect structure disposed on the substrate. The copper interconnect structure includes an uppermost copper layer covered by a dielectric layer. An aluminum pad layer is provided on the dielectric layer. A metal layer is provided on the circuit region and is located between the uppermost copper layer and the aluminum pad layer.
    Type: Application
    Filed: January 28, 2021
    Publication date: August 18, 2022
    Inventors: Aaron Chen, CHI REN, YI HSIN LIU
  • Publication number: 20160282274
    Abstract: The present invention disclosed a mesoporous silica thin film with perpendicular nanochannels on a substrate, a process of forming the same and the application in surface-enhanced Raman spectroscopy. Furthermore, a gold nanoparticle array on a mesoporous silica material with perpendicular nanochannels and the process of forming the same is also present in the invention.
    Type: Application
    Filed: March 3, 2016
    Publication date: September 29, 2016
    Inventors: Chung-Yuan Mou, Kun-Che Kao, Tzu-Ying Chen, Yi-Wen Wang, Yi-Hsin Liu
  • Patent number: 9115724
    Abstract: A blade structure and ceiling fan having the same are disclosed. The blade structure includes a blade root, a blade tip, and a first vertex and a second vertex between the blade root and the blade tip. The blade bends from blade root to the first vertex, the blade tip and then bends from the blade tip to the second vertex and back to the blade root to form a hollow structure. The ceiling fan with the blade structure not only provides air modulating function but also has unique modeling.
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: August 25, 2015
    Assignee: PAN AIR ELECTRIC CO., LTD.
    Inventors: Chui-Yuan Chen, Yi-Hsin Liu
  • Patent number: 9025830
    Abstract: A liveness detection method comprising: receiving plural pictures of a video stream comprising a face and an adjacent background; determining motion of the face and the background, the motion determined over the plural pictures; comparing the motion between the face and the background; and determining whether the face corresponds to an actual, live user or an image of the user based on the comparison, the determinations performed by a processor.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: May 5, 2015
    Assignee: Cyberlink Corp.
    Inventors: Chih-Chao Ma, Yi-Hsin Liu
  • Publication number: 20140270412
    Abstract: A liveness detection method comprising: receiving plural pictures of a video stream comprising a face and an adjacent background; determining motion of the face and the background, the motion determined over the plural pictures; comparing the motion between the face and the background; and determining whether the face corresponds to an actual, live user or an image of the user based on the comparison, the determinations performed by a processor.
    Type: Application
    Filed: May 29, 2014
    Publication date: September 18, 2014
    Applicant: Cyberlink Corp.
    Inventors: Chih-Chao Ma, Yi-Hsin Liu
  • Publication number: 20130188840
    Abstract: A liveness detection method comprising: receiving plural pictures of a video stream comprising a face and an adjacent background; determining motion of the face and the background, the motion determined over the plural pictures; comparing the motion between the face and the background; and determining whether the face corresponds to an actual, live user or an image of the user based on the comparison, the determinations performed by a processor.
    Type: Application
    Filed: January 20, 2012
    Publication date: July 25, 2013
    Applicant: CYBERLINK CORP.
    Inventors: Chih-Chao Ma, Yi-Hsin Liu