Patents by Inventor Yi-Hsu Wang

Yi-Hsu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12009610
    Abstract: An electrical connector configured to be assembled to a circuit board is provided. The electrical connector includes an insulating body having a base and a tongue, a plurality of terminals disposed in the insulating body, a first metal shell covering the insulating body, and a second metal shell covering the insulating body and the first metal shell. The first metal shell has a plurality of soldering feet soldered to the circuit board, and the second metal shell has a plurality of second metal pin soldered to the circuit board. The first and the second metal pin are beside the base and away from the tongue. At least one of the first metal shell and the insulating body has a supporting portion abutting against a non-conducting portion of the circuit board. The supporting portion is close to the tongue and away from the base.
    Type: Grant
    Filed: January 25, 2022
    Date of Patent: June 11, 2024
    Assignee: Advanced Connectek Inc.
    Inventors: Shu-Fen Wang, Yi Hsu
  • Publication number: 20240154015
    Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.
    Type: Application
    Filed: March 22, 2023
    Publication date: May 9, 2024
    Inventors: Jui-Lin CHEN, Hsin-Wen SU, Chih-Ching WANG, Chen-Ming LEE, Chung-I YANG, Yi-Feng TING, Jon-Hsu HO, Lien-Jung HUNG, Ping-Wei WANG
  • Patent number: 7123670
    Abstract: A method for correcting influence of frequency offset between a receiver and a transmitter by evaluating training symbols received during a preamble period. The method includes producing, based on at least one long training symbol, a first vector whose first vector angle is indicative of a fine offset between the receiver and the transmitter, producing a fine offset estimate based on the first vector angle, and multiplying, with a signal having a frequency based upon the fine offset estimate, data symbols that are received after the at least one long training symbol is received.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: October 17, 2006
    Assignee: Atheros Communications, Inc.
    Inventors: Jeffrey M. Gilbert, Teresa H. Meng, John Thomson, Yi-Hsu Wang
  • Patent number: 7088787
    Abstract: A method of scaling at a receiver representations of training signals received from a transmitter. The method includes producing a frequency domain representation of at least one long training symbol received at the receiver and a frequency domain representation of a data symbol, and scaling the frequency domain representation of the at least one long symbol based on a largest coefficient in the frequency domain representation to produce a scaled frequency domain representation of the at least one long symbol.
    Type: Grant
    Filed: September 24, 2001
    Date of Patent: August 8, 2006
    Assignee: Atheros Communications, Inc.
    Inventors: Yi-Hsu Wang, Jeffrey M. Gilbert
  • Publication number: 20030058966
    Abstract: A method for correcting influence of frequency offset between a receiver and a transmitter by evaluating training symbols received during a preamble period. The method includes producing, based on at least one long training symbol, a first vector whose first vector angle is indicative of a fine offset between the receiver and the transmitter, producing a fine offset estimate based on the first vector angle, and multiplying, with a signal having a frequency based upon the fine offset estimate, data symbols that are received after the at least one long training symbol is received.
    Type: Application
    Filed: September 24, 2001
    Publication date: March 27, 2003
    Inventors: Jeffrey M. Gilbert, Teresa H. Meng, John Thomson, Yi-Hsu Wang