Abstract: A method according to the present disclosure includes forming a plurality of transistors in a first wafer and forming a memory array in a second wafer. A first surface of the first wafer includes a first plurality of bonding pads electrically coupled to the transistors. The memory array includes a plurality of ferroelectric tunnel junction (FTJ) stacks. A second surface of the second wafer includes a second plurality of bonding pads electrically coupled to the FTJ stacks. The method also includes performing a thermal treatment to the FTJ stacks in the second wafer, and after the performing of the thermal treatment, bonding the first surface of the first wafer with the second surface of the second wafer. The transistors are coupled to the memory cells through the first plurality of bonding pads and the second plurality of bonding pads.

Abstract: A method according to the present disclosure includes forming a bottom electrode layer over a substrate, forming an insulator layer over the bottom electrode layer, depositing a semiconductor layer over the bottom electrode layer, depositing a ferroelectric layer over the semiconductor layer, forming a top electrode layer over the ferroelectric layer, and patterning the bottom electrode layer, the insulator layer, the semiconductor layer, the ferroelectric layer, and the top electrode layer to form a memory stack. The semiconductor layer includes a plurality of portions with different thicknesses.

Abstract: A method for providing drug recommendation includes: calculating a plurality of relative cell viabilities respectively corresponding to a plurality of candidate drugs based on viable cell counts of a patient's circulating tumor cell (CTC)-derived organoid cultures and viable cell counts of the CTC-derived organoid cultures respectively reacted with the candidate drugs; and providing drug recommendation of the candidate drugs based on the relative cell viabilities. A device for providing drug recommendation is also provided.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes one or more interconnect wires and vias arranged within one or more interconnect dielectric layers over a substrate. Further, a bottom electrode is disposed over the one or more interconnect wires and vias and comprises a first material having a first work function. A top electrode is disposed over the bottom electrode and comprises a second material having a second work function. The first material is different than the second material, and the first work function is different than the second work function. An anti-ferroelectric layer is disposed between the top and bottom electrodes.

Abstract: The present disclosure relates to an integrated chip including a first metal layer over a substrate. A second metal layer is over the first metal layer. An ionic crystal layer is between the first metal layer and the second metal layer. A metal oxide layer is between the first metal layer and the second metal layer. The first metal layer, the second metal layer, the ionic crystal layer, and the metal oxide layer are over a transistor device that is arranged along the substrate.

Abstract: A graphical indicator is provided. The graphical indicator includes a plurality of header blocks and a plurality content blocks. The header blocks include N first header blocks and (M?1) second header blocks. Each of the content blocks has a data micro-graphic. The N first header blocks are disposed at a first row of an indicator matrix. Each of the (M?1) second header blocks is disposed at (M?1) rows other than the first row of the indicator matrix. Each of the N first header blocks has a header micro-graphic. Furthermore, one or more target second header blocks in the (M?1) second header blocks do not have the header micro-graphic, and each of a plurality of remaining second header blocks other than the one or more target second header blocks in the (M?1) second header blocks has the header micro-graphic.

Abstract: An automatic processing device for liquid samples includes a sample region, a control module, an image identification device and a centrifuge. The sample region is configured to accommodate a plurality of centrifuge tubes. The control module includes a mechanical module. The mechanical module is configured to unscrew or tighten upper caps of the centrifuge tubes, and is configured to draw liquid from the centrifuge tubes or discharge liquid to the centrifuge tubes. The image identification device is coupled to the control module. The centrifuge is coupled to the control module. The centrifuge is configured to accommodate the centrifuge tubes and perform centrifugal treatment.

Abstract: A graphical indicator is provided. The graphical indicator includes a plurality of header blocks and a plurality content blocks. The header blocks include N first header blocks and (M?1) second header blocks. Each of the content blocks has a data micro-graphic. The N first header blocks are disposed at a first row of an indicator matrix. Each of the (M?1) second header blocks is disposed at (M?1) rows other than the first row of the indicator matrix. Each of the N first header blocks has a header micro-graphic. Furthermore, one or more target second header blocks in the (M?1) second header blocks do not have the header micro-graphic, and each of a plurality of remaining second header blocks other than the one or more target second header blocks in the (M?1) second header blocks has the header micro-graphic.

Abstract: A stand device includes a base, a supporting component and a carrying component. The supporting component is pivotally disposed to the base along a first axis. The carrying component is pivotally disposed to the supporting component along a second axis, and slidably disposed to the supporting component in a first direction. The stand device is switchable between a first state and a second state. In the first state, the extending direction of the supporting component is parallel to the extending direction of the base, and the extending direction of the carrying component is parallel to the extending direction of the supporting component. In the second state, the extending direction of the supporting component is staggered to the extending direction of the base, and the extending direction of the carrying component is staggered to the extending direction of the supporting component.

Abstract: An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.

Abstract: A stand device includes a base, a supporting component and a carrying component. The supporting component is pivotally disposed to the base along a first axis. The carrying component is pivotally disposed to the supporting component along a second axis, and slidably disposed to the supporting component in a first direction. The stand device is switchable between a first state and a second state. In the first state, the extending direction of the supporting component is parallel to the extending direction of the base, and the extending direction of the carrying component is parallel to the extending direction of the supporting component. In the second state, the extending direction of the supporting component is staggered to the extending direction of the base, and the extending direction of the carrying component is staggered to the extending direction of the supporting component.

Abstract: A remote machining optimization system for a machine tool is provided, which includes an input unit configured to input a machining parameter including a spindle speed and a cut depth; a receiving unit configured to receive sound signals and vibration signals from the machine tool; a processing unit configured to generate a machining program with a program generating module, to modify the spindle speed and the cut depth according to the sound signals with a speed optimization module and a depth optimization module, respectively; a communication unit configured to send the machining program to the machine tool; and a storage unit configured to store the modified spindle speed and the cut depth.

Abstract: Provided is a sun protection material including a plurality of polystyrene microspheres and a plurality of refractive layers. The polystyrene microspheres have a particle size of 150 nm to 300 nm. Surfaces of the polystyrene microspheres are at least partially covered by the refractive layers. The sun protection material can scatter a light in a wavelength range between 250 nm and 400 nm. A sun protection composition containing the sun protection material also may scatter a light of a wavelength range between 250 nm and 400 nm, such that the UV protection of the sun protection composition is enhanced.

Abstract: An LED package structure includes a substrate, an electrode layer and an insulating layer in a coplanar arrangement and disposed on the substrate, an LED chip mounted on the electrode layer and the insulating layer, a phosphor sheet covering entirely a top surface of the LED chip, a first translucent layer disposed on a light emitting surface of the phosphor sheet, and a reflective housing covering the side surfaces of the LED chip and the side surfaces of the phosphor sheet. The light emitting surface has a central region and a ring-shaped region surrounding the central region. The first translucent layer covers at least 60% of an area of the ring-shaped region. A refractive index of the first translucent layer is larger than one and is smaller than that of the phosphor sheet. A top surface of the reflective housing is substantially flush with the light emitting surface.

Abstract: A vibration absorber includes a screw, a displacement adjustment member, a first spring, a second spring, a mass block, a casing, a cover and a connector. The displacement adjustment member is engaged with the screw. The mass block is located between the first spring and the second spring, wherein the mass block respectively connects the first spring and the second spring on both sides and the screw passes through the mass block. The casing encloses the screw, the displacement adjustment member, the first spring, the second spring and the mass block. The cover covers one opening of the casing. The connector covers the other opening of the casing. The first spring is located between the mass block and the displacement adjustment member and connects respectively the mass block and the displacement adjustment member. The coefficients of elasticity of both the first spring and the second spring are both non-linear.

Abstract: A non-contact dynamic stiffness measurement system includes a base, a test bar, an exciter, a force sensor, a laser Doppler velocimeter, and a controller. The force sensor is connected to the exciter and the base. The exciter is located between the test bar and the force sensor. The controller is electrically connected to the force sensor and the laser Doppler velocimeter. The test bar is detachably set in a holder of the main shaft under test. The exciter provides an electromagnetic force to the test bar. The force sensor measures the acting force of the exciter. The laser Doppler velocimeter provides a first laser beam and a second laser beam. The laser Doppler velocimeter measures a vibration response with reflected laser beams. The controller determines an equivalent main shaft stiffness value of the main shaft under test according to the acting force and the vibration response.

Abstract: A remote machining optimization system for a machine tool is provided, which includes an input unit configured to input a machining parameter including a spindle speed and a cut depth; a receiving unit configured to receive sound signals and vibration signals from the machine tool; a processing unit configured to generate a machining program with a program generating module, to modify the spindle speed and the cut depth according to the sound signals with a speed optimization module and a depth optimization module, respectively; a communication unit configured to send the machining program to the machine tool; and a storage unit configured to store the modified spindle speed and the cut depth.

Abstract: The instant disclosure provides a photoelectric semiconductor device including a substrate, a light-emitting diode chip, a converting material, an encapsulant, and a protective layer. The light-emitting diode chip is arranged on the substrate. The encapsulant has a Shore hardness of higher than D50 or a moisture-permeable value of less than 10 g/m2·24 hrs, and the converting material includes a first wavelength converting compound having a main peak wavelength in green spectrum and a second wavelength converting compound having a main peak wavelength in red spectrum which are fluorescent materials having a FWHM of equal to or less than 50 nm. The photoelectric semiconductor device provided by the instant disclosure exhibits improved NTSC, brightness and reliability.

Abstract: A white light emitting device includes an LED chip capable of emitting light with a peak wavelength of 390 to 430 nm, and a wavelength conversion layer including first, second and third fluorescent materials. The first fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The second fluorescent material is capable of being excited to emit light with a peak wavelength of 450 to 470 nm. The third fluorescent material is capable of being excited to emit light with a peak wavelength of 630 to 650 nm. Light emitted by the white light emitting device has a color temperature below 5000 K, and a general color rendering index value (Ra) and special color rendering index values (R9-R15) all greater than 90.