Patents by Inventor Yi Huang

Yi Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135078
    Abstract: Systems, methods, and computer programs products are described for optimizing circuit synthesis for implementation on an integrated circuit. A register transfer level code description of logic behavior of a circuit. The register transfer level code description is converted into structurally defined circuit designs for multiple types of components and feature size technologies. A floor plan of each structurally defined circuit design is generated. A physically simulated circuit is created for each floor plan. A range of operating conditions is swept over to analyze power, performance, and area of each physically simulated circuit.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Inventors: Chao-Chun Lo, Boh-Yi Huang, Chih-yuan Stephen Yu, Yi-Lin Chuang, Chih-Sheng Hou
  • Publication number: 20240137671
    Abstract: An image sensor chip with depth information is provided. The image sensor chip includes an SPAD array, a time-to-digital converter module, a storage circuit, and a data processing circuit. The SPAD array includes a plurality of image sensor units, and each of the image sensor units includes a plurality of SPAD units and a decision circuit, wherein each of the SPAD units outputs a photon detection result within a scan period, and the decision circuit generates an image-sensing signal based on the photon detection results. The time-to-digital converter module generates a plurality of first time data in response to the image-sensing signals. The storage circuit stores the first time data temporarily. The data processing unit reads the first time data from the storage circuit and generates a plurality of second time data in response to the first time data.
    Type: Application
    Filed: March 27, 2023
    Publication date: April 25, 2024
    Inventors: Chen-Yi LEE, Hsi-Hao HUANG, Tzu-Yun HUANG
  • Publication number: 20240136401
    Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having a first semiconductor material. A second semiconductor material is disposed on the first semiconductor material and a passivation layer is disposed on the second semiconductor material. A first doped region and a second doped region extend through the passivation layer and into the second semiconductor material. A silicide is arranged within the passivation layer and along tops of the first doped region and the second doped region.
    Type: Application
    Filed: January 5, 2024
    Publication date: April 25, 2024
    Inventors: Yin-Kai Liao, Sin-Yi Jiang, Hsiang-Lin Chen, Yi-Shin Chu, Po-Chun Liu, Kuan-Chieh Huang, Jyh-Ming Hung, Jen-Cheng Liu
  • Publication number: 20240137927
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may monitor for one or more semi-persistent scheduling (SPS) transmissions according to one or more SPS configurations. The UE may generate a set of feedback bits associated with the SPS transmissions, the feedback bits scheduled for transmission in a first set of uplink symbols. The UE may receive control signaling that changes an availability of the first set of uplink symbols for transmission of the set of feedback bits, and then defer transmission of the set of feedback bits to a second set of uplink symbols. The UE may determine whether to transmit at least a portion of the set of feedback bits in the second set of uplink symbols, and may transmit at least the portion of the set of feedback bits in the second set of uplink symbols and communicate in accordance with the determining.
    Type: Application
    Filed: April 4, 2022
    Publication date: April 25, 2024
    Inventors: Yan ZHOU, Konstantinos DIMOU, Yi HUANG, Tao LUO, Mostafa KHOSHNEVISAN, Kazuki TAKEDA
  • Patent number: 11966530
    Abstract: A touchpad module includes a base plate, a touch member and at least one pressure sensing module. The touch member is located over the base plate. The touch member includes a touch plate and a touch sensitive circuit board. The pressure sensing module is arranged between the base plate and the touch member. The pressure sensing module includes a pressure sensor and a miniature supporting plate. The pressure sensor is installed on the miniature supporting plate. The pressure sensor is electrically connected with the touch sensitive circuit board through the miniature supporting plate. While the touch member is pressed in response to an external pressing force, the pressing force exerted on the touch member is sensed by the at least one pressure sensing module, and the pressure sensing module generates a pressure sensing signal.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: April 23, 2024
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Wei-Chiang Huang, Chao-Wei Lee, Hsueh-Chao Chang, Sian-Yi Chiu
  • Patent number: 11963997
    Abstract: The present disclosure provides an anti-tumor polypeptide Bax-BH3, a fluorescent polymeric nanomicelle, a preparation method and use thereof, belonging to the technical field of medicines. The anti-tumor polypeptide Bax-BH3 has an amino acid sequence set forth in SEQ ID No: 1; the fluorescent polymeric nanomicelle includes the anti-tumor polypeptide Bax-BH3 and a polymer carrier; and the polymer carrier is a block copolymer RGD-PHPMA-b-Poly(MMA-alt-(Rhob-MA)). In the present disclosure, the anti-tumor polypeptide Bax-BH3 has desirable biocompatibility and biological activity; and the fluorescent polymeric nanomicelle encapsulates the anti-tumor polypeptide Bax-BH3 by the block copolymer RGD-PHPMA-b-Poly(MMA-alt-(Rhob-MA)), with high encapsulation rate and drug loading, and good release performance.
    Type: Grant
    Filed: July 15, 2022
    Date of Patent: April 23, 2024
    Assignee: Jilin University
    Inventors: Li Xu, Yi Guo, Sijun Huang, Xi Zhang, Mingming Zhang
  • Patent number: 11967591
    Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Patent number: 11966322
    Abstract: A method, computer program product and system are provided for preloading debug information based on the presence of incremental source code files. Based on parsed input parameters to a source code debugger, a source code repository and a local storage area are searched for an incremental file. In response to the incremental file being located, a preload indicator in the incremental file, which is a source code file, is set. Based on the preload indicator being set, debug symbol data from the incremental file is merged to a preload symbol list. In response to receiving a command to examine the debug symbol data from the incremental file, the preload symbol list is searched for the requested debug symbol data.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: April 23, 2024
    Assignee: International Business Machines Corporation
    Inventors: Xiao Ling Chen, Xiao Xuan Fu, Jiang Yi Liu, Zhan Peng Huo, Wen Ji Huang, Qing Yu Pei, Min Cheng, Yan Huang
  • Publication number: 20240129064
    Abstract: Aspects described herein relate to generating multiple repetitions of an uplink signal for transmission, and transmitting the multiple repetitions of the uplink signal, wherein each repetition of the multiple repetitions includes a set of phase tracking reference signals (PTRSs). Other aspects relate to receiving the repetitions, and using the PTRSs to determine a phase difference in the repetitions for performing joint channel estimation.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 18, 2024
    Inventors: Yi HUANG, Gokul SRIDHARAN, Krishna Kiran MUKKAVILLI
  • Publication number: 20240129894
    Abstract: A positioning method and apparatus. A location management network element sends first indication information to a network device, where the first indication information is useable by the network device to measure a signal that is sent by a terminal device and that is reflected by a reflection panel. After receiving the first indication information, the network device measures the signal reflected by the reflection panel, and reports a measurement result to the location management network element. The location management network element determines a location of the terminal device based on location information of the network device, location information of the reflection panel, and the measurement result. In response to a line-of-sight (LOS) path between the terminal device and the network device being blocked, a signal on the LOS path cannot be directly transmitted and measured.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 18, 2024
    Inventors: Yingjie YU, Yi WANG, Guohua ZHOU, Su HUANG
  • Publication number: 20240127408
    Abstract: Embodiments are generally directed to an adaptive deformable kernel prediction network for image de-noising. An embodiment of a method for de-noising an image by a convolutional neural network implemented on a compute engine, the image including a plurality of pixels, the method comprising: for each of the plurality of pixels of the image, generating a convolutional kernel having a plurality of kernel values for the pixel; generating a plurality of offsets for the pixel respectively corresponding to the plurality of kernel values, each of the plurality of offsets to indicate a deviation from a pixel position of the pixel; determining a plurality of deviated pixel positions based on the pixel position of the pixel and the plurality of offsets; and filtering the pixel with the convolutional kernel and pixel values of the plurality of deviated pixel positions to obtain a de-noised pixel.
    Type: Application
    Filed: November 20, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Anbang Yao, Ming Lu, Yikai Wang, Xiaoming Chen, Junjie Huang, Tao Lv, Yuanke Luo, Yi Yang, Feng Chen, Zhiming Wang, Zhiqiao Zheng, Shandong Wang
  • Publication number: 20240127783
    Abstract: Provided are a noise cancellation method and apparatus, an electronic device, a noise cancellation earphone, and a storage medium. The method includes acquiring original sound source information; performing noise reduction (NR) processing on the original sound source information using active noise cancellation (ANC) to obtain first sound information and performing the NR processing on the original sound source information using environmental noise cancellation (ENC) to obtain second sound information; and mixing and adding the first sound information and the second sound information to obtain target sound information and playing the target sound information. In this method, the NR processing can be performed on the sound using the ANC and the ENC, thereby distinguishing environmental noise from human voice, improving the noise cancellation performance, and enabling a user to hear clearer sound.
    Type: Application
    Filed: April 3, 2023
    Publication date: April 18, 2024
    Applicant: Lanto Electronic Limited
    Inventors: Che-Yung Huang, Chi-Liang Chen, Yong-Sheng Jheng, Che-Yi HSIAO
  • Publication number: 20240122894
    Abstract: Provided is a method for coupling flavonoid-containing compounds to provide flavonoid dimers, trimers and oligomers. The method comprises contacting a flavonoid-containing compound with base in the presence of air. Flavonoid dimers, trimers and oligomers may also be useful in the treatment of diseases, such as fungal infections and diseases associated with starch hydrolase.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 18, 2024
    Applicant: National University of Singapore
    Inventors: Xin Yang, Dejian Huang, Ke Du, Yi Hui Joanne Toy
  • Publication number: 20240129071
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may generate first and second sets of feedback bits associated with first and second sets of downlink transmissions, respectively, the first and second sets of feedback bits scheduled for transmission in a first set of uplink symbols. The UE may identify, based on a change in a format associated with the first set of uplink symbols, that only a subset of the first set of uplink symbols is available for transmission of the first set of feedback bits and the second set of feedback bits. The UE may determine to defer transmission of one or both of the first set of feedback bits and the second set of feedback bits to a second set of uplink symbols based on availability of the subset of the first set of uplink symbols and on a deferment scheme.
    Type: Application
    Filed: April 5, 2022
    Publication date: April 18, 2024
    Inventors: Konstantinos DIMOU, Yan ZHOU, Yi HUANG, Tao LUO
  • Patent number: 11961489
    Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.
    Type: Grant
    Filed: December 11, 2022
    Date of Patent: April 16, 2024
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: De-Fu Chen, Po Lun Chen, Chun-Ta Chen, Ta-Jen Huang, Po-Tsun Liu, Guang-Ting Zheng, Ting-Yi Yi
  • Patent number: 11963213
    Abstract: Wireless communication devices, systems, and methods related to mechanisms to implement improved interference tracking over time. A BS may transmit information to a UE that allows the UE to quantize channel measurements into interference states. The UE may transmit an interference change report as triggered by an event, such as an interference metric exceeding a threshold after quantizing into the interference states. This enables the system to capture and respond to abrupt changes. Further, the interference change report may include historic interference information. The UE may include statistics based on the historic interference information. The UE may further be triggered to transmit an interference change report in response to a BS requesting it, or in response to a configured period of time elapsing. The UE may further include MCS information predicted for one or more future time periods based on historic information, which the BS may use in scheduling.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: April 16, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Jay Kumar Sundararajan, Ahmed Elshafie, Yi Huang, Wanshi Chen, Naga Bhushan, Prashanth Haridas Hande, Yeliz Tokgoz, Krishna Kiran Mukkavilli, Wei Yang, Saadallah Kassir
  • Patent number: 11961739
    Abstract: Embodiments of the present technology include semiconductor processing methods to make boron-and-silicon-containing layers that have a changing atomic ratio of boron-to-silicon. The methods may include flowing a silicon-containing precursor into a substrate processing region of a semiconductor processing chamber, and also flowing a boron-containing precursor and molecular hydrogen (H2) into the substrate processing region of the semiconductor processing chamber. The boron-containing precursor and the H2 may be flowed at a boron-to-hydrogen flow rate ratio. The flow rate of the boron-containing precursor and the H2 may be increased while the boron-to-hydrogen flow rate ratio remains constant during the flow rate increase. The boron-and-silicon-containing layer may be deposited on a substrate, and may be characterized by a continuously increasing ratio of boron-to-silicon from a first surface in contact with the substrate to a second surface of the boron-and-silicon-containing layer furthest from the substrate.
    Type: Grant
    Filed: October 5, 2020
    Date of Patent: April 16, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Yi Yang, Krishna Nittala, Rui Cheng, Karthik Janakiraman, Diwakar Kedlaya, Zubin Huang, Aykut Aydin
  • Patent number: 11963460
    Abstract: A method for manufacturing a memory device is provided. The method includes etching an opening in a first dielectric layer; forming a bottom electrode, a resistance switching element, and a top electrode in the opening in the first dielectric layer; forming a second dielectric layer over the bottom electrode, the resistance switching element, and the top electrode; and forming an electrode via connected to a top surface of the top electrode in the second dielectric layer.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Hsiang Tseng, Chih-Lin Wang, Yi-Huang Wu
  • Patent number: 11963144
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive a configuration message configuring the UE to communicate coordinated transmissions with multiple transmission reception points (TRPs) using a first coordinated transmission mode of a set of different coordinated transmission modes. The UE may receive, based on the configuration message, downlink control information including at least one indicator and receive a first coordinated transmission communicated in accordance with the first coordinated transmission mode. The UE may transmit, in accordance with a feedback configuration corresponding to the at least one indicator and the first coordinated transmission mode, a feedback message for the first coordinated transmission to at least one of the multiple TRPs.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: April 16, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Wei Yang, Yi Huang, Joseph Binamira Soriaga, Gokul Sridharan, Jay Kumar Sundararajan, Seyedkianoush Hosseini
  • Patent number: 11963186
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a base station may transmit, and a user equipment (UE) may receive, downlink control information (DCI) scheduling a physical downlink shared channel (PDSCH) and indicating a physical uplink control channel (PUCCH) repetition factor. The UE may transmit, and the base station may receive, a PUCCH that includes hybrid automatic repeat request acknowledgement feedback associated with the PDSCH. In some aspects, one or more instances of the PUCCH are transmitted across one or more uplink slots or sub-slots based at least in part on the PUCCH repetition factor indicated in the DCI. Numerous other aspects are provided.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 16, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Yi Huang, Wanshi Chen, Tingfang Ji, Hwan Joon Kwon, Peter Gaal