Patents by Inventor Yi-Hung HOU

Yi-Hung HOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153920
    Abstract: An electronic device is disclosed. The electronic device includes a first conductive plate and a first electronic component. The first conductive plate includes a first connecting portion. The first electronic component supports the first conductive plate through the first connecting portion. The first connecting portion is electrically connected to the first electronic component and configured to buffer stress from the first conductive plate to the first electronic component.
    Type: Application
    Filed: November 9, 2022
    Publication date: May 9, 2024
    Applicants: Advanced Semiconductor Engineering, Inc., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.
    Inventors: Yi-Hung HOU, Yung-Fa CHEN, Sheng-Chia CHEN