Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a pushing piece configured to provide a supporting surface to sustain the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.

Abstract: A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.

Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface attached to the second surface of the electronic device.

Abstract: A printed circuit board assembly includes a printed circuit board, an electronic device, a holder and a heat-dissipation device. The printed circuit board includes a first through hole. The electronic device includes a first surface and a second surface opposite to each other, and a pin passing through the first through hole of the printed circuit board and inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device, and an opening disposed on the supporting surface to receive the pin of electronic device passing therethrough. The holder is configured to provide an accommodation space between the supporting surface and the printed circuit board. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.

Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is secured to the printed circuit board and disposed between the printed circuit board and the electronic device. The holder includes a pushing piece configured to provide a supporting surface to sustain the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface thermally coupled with the second surface of the electronic device.

Abstract: A printed circuit board assembly includes a printed circuit board, at least one electronic device, a holder and a heat-dissipation device. The printed circuit board includes at least one first through hole. The electronic device includes a first surface, a second surface and at least one pin. The first surface and the second surface are opposite to each other, and the pin passes through the first through hole of the printed circuit board and is inserted on the printed circuit board. The holder is disposed between the printed circuit board and the electronic device. The holder includes a supporting surface sustaining the first surface of the electronic device. The heat-dissipation device includes a heat-dissipation surface attached to the second surface of the electronic device.

Abstract: A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.

Abstract: A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element.

Abstract: A heat-dissipating module for use in an electric device includes a circuit board, at least one heat-generating element, and at least one heat-conducting element. The circuit board has a first surface, a second surface and at least one perforation. The heat-conducting element is disposed in the perforation. The heat-conducting element includes a base and a sidewall. The heat-generating element is disposed on the base or the sidewall of the heat-conducting element so that the heat by the heat-generating element is conducted to the second surface of the circuit board through the heat-conducting element.

Abstract: A modular heat-dissipating device includes an electronic device, a cold plate and a heat-dissipating base. The electronic device includes a casing, a covering plate and a circuit board. The circuit board is disposed within the casing. Plural electronic components are disposed on the circuit board. The cold plate, the casing and the covering plate are combined together to define a sealed space. The cold plate includes plural first fixing structures. The heat-dissipating base is selected from an air-cooling member or a liquid-cooling member. Each of the air-cooling member and the liquid-cooling member includes a first slab under the cold plate and plural second fixing structures corresponding to the first fixing structures. The air-cooling member and the liquid-cooling member are normalized. The heat generated by the electronic device is transmitted to the first slab through the cold plate, and then dissipated away by the air-cooling member or the liquid-cooling member.

Abstract: A circuit module to be mounted on a system board having multiple through holes is disclosed. The circuit module includes a circuit board, multiple SIP connectors and multiple sheathing elements. Each of the SIP connectors includes a connecting part disposed at a first end thereof and fixed on the circuit board and an insertion part disposed at a second end thereof. Each of the sheathing elements includes a plurality of clamping arms and a receiving portion. The receiving portion is defined by the clamping arms for receiving the insertion part of a corresponding SIP connector. The insertion part is clamped by the clamping arms such that the sheathing element is fixed on the SIP connector. The sheathing element is sustained against a surface of the system board after the insertion part is inserted into a corresponding through hole of the system board, so that the support area between the SIP connector and the system board is increased.

Abstract: A power module fabrication method and structure thereof is disclosed.

Abstract: An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.

Abstract: An electronic device with dual heat dissipating structures use in an electronic system is disclosed. The electronic device comprises the circuit board having the first and second heat producing surfaces, the major and auxiliary heat dissipating structures disposed on the first and second heat producing surfaces of the circuit board respectively, and the connective portion connecting the auxiliary heat dissipating structure and the major heat dissipating structure. The second heat producing surface of the circuit board is a high-temperatured area relative to the first heat producing surface of the circuit board in the electronic system, thereby the heat produced by the second heat producing surface of the circuit board can be conducted to the major heat dissipating structure through the auxiliary heat dissipating structure and the connective portion for heat dissipation.

Abstract: An assembling structure of electronic devices for an electronic product is provided. The assembling structure includes a first circuit board, a second circuit board having higher thermal conductivity than the first circuit board and at least one high-power electronic device mounted thereon, and a connecting element for electrically coupling the first circuit board with the second circuit board.

Abstract: A packing structure of a switching power supply is used for enhancing heat-dissipating effect. The packing structure includes a printed circuit board, a transformer, an inductor having an inductive winding, a converter placed on a pad of the printed circuit board, wherein the pad is electrically connected to a secondary winding of the transformer and the inductive winding, and a metal cover directly covered on the converter.

Abstract: A packing structure of a switching power supply is used for enhancing heat-dissipating effect. The packing structure includes a printed circuit board, a transformer, an inductor having an inductive winding, a converter placed on a pad of the printed circuit board, wherein the pad is electrically connected to a secondary winding of the transformer and the inductive winding, and a metal cover directly covered on the converter.