Patents by Inventor Yi-Jeng WANG

Yi-Jeng WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240145908
    Abstract: An electronic package and a manufacturing method thereof are provided, in which an electronic element is disposed on a carrier structure, and an antenna structure is stacked on the carrier structure via conductors, where at least one through hole is formed on and penetrating through the antenna structure, and an insulating support body is formed between the carrier structure and the antenna structure, so that the insulating support body is correspondingly formed at the through hole and/or an edge of the antenna structure, and the through hole is free from being filled up by the insulating support body, such that the through hole has an air medium. The design of the through hole allows the characteristic of the dielectric constant of air being 1 to be utilized so as to reduce the signal loss and the signal offset, thereby facilitating the signal transmission of the antenna body.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Yi-Chun LAI, Hsuan-Jen WANG, Rung-Jeng LIN
  • Publication number: 20160012393
    Abstract: In a parcel delivery method and system, a server continuously receives recipient geographic position information (GPI) from a recipient terminal associated with and carried by a recipient, and unmanned aerial vehicle (UAV) GPI from a UAV loaded with a to-be-delivered parcel via a communication network, and transmits, to the UAV, destination information, which is the recipient GPI that is last received by the server. The UAV transports, based on the destination information from the server, the parcel to an unloading position where the recipient terminal is located.
    Type: Application
    Filed: March 23, 2015
    Publication date: January 14, 2016
    Inventors: Guan-Wu WANG, Yi-Hung CHEN, Yi-Jeng WANG, Wen-Chung LIU