Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.

Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: A method includes providing a detector disposed above a semiconductor structure; identifying a portion of the semiconductor structure at a temperature substantially greater than a predetermined threshold by the detector; rotating the stage; and deriving a position of the portion of the semiconductor structure based upon the rotation of the stage.

Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.

Abstract: A semiconductor device includes a first gate structure extending along a first lateral direction. The semiconductor device includes a first interconnect structure, disposed above the first gate structure, that extends along a second lateral direction perpendicular to the first lateral direction. The first interconnect structure includes a first portion and a second portion electrically isolated from each other by a first dielectric structure. The semiconductor device includes a second interconnect structure, disposed between the first gate structure and the first interconnect structure, that electrically couples the first gate structure to the first portion of the first interconnect structure. The second interconnect structure includes a recessed portion that is substantially aligned with the first gate structure and the dielectric structure along a vertical direction.

Abstract: An identity certificate may be issued to a blockchain node. The issuance may include issuing a first identity certificate to a first terminal and receiving a second identity certificate issuance request that is from the first terminal. A second identity certificate may be issued to the first terminal, and a third identity certificate issuance request is received from the second terminal. A third identity certificate is issued to the second terminal, so that the second terminal forwards the third identity certificate to the third terminal.

Abstract: A method for predicting clinical severity of a neurological disorder includes steps of: a) identifying, according to a magnetic resonance imaging (MRI) image of a brain, brain image regions each of which contains a respective portion of diffusion index values of a diffusion index, which results from image processing performed on the MRI image; b) for one of the brain image regions, calculating a characteristic parameter based on the respective portion of the diffusion index values; and c) calculating a severity score that represents the clinical severity of the neurological disorder of the brain based on the characteristic parameter of the one of the brain image regions via a prediction model associated with the neurological disorder.

Abstract: A method of manufacturing a multicolor shoe material includes the following steps. Step S1: blank molds are provided, and a mold chamber of each of the blank molds is injected by one of the foamed materials in different colors to form unfoamed semi-finished products in different colors. Step S2: the semi-finished products are put into a foaming mold, when the foaming mold is preheated and completely closed, a ratio of a total volume of the semi-finished products to a volume of the mold chamber of the foaming mold is ranged between 0.96 and 1.04. Thus, the semi-finished products could be evenly foamed. After foaming, adjacent two of the semi-finished products could be connected by heat fusion to obtain the multicolor shoe material. Additionally, a semi-finished product and a multicolor shoe material are provided in the present invention.

Abstract: A method of manufacturing the foamed shoe material and semi-finished product including the following steps. Step S1: a foamable material is injected into a cavity of a blank mold to solidify, thereby generating a semi-finished product of the shoe material and a runner waste that are unfoamed. The runner waste could be shed for reusing directly as the foamable material without a granulating process. Step S2: the semi-finished product is cooled down and put into a cavity of the foaming mold, and the semi-finished product is evenly foamed in the cavity of the foaming mold to obtain a shoe material wherein the waste generated during the method of manufacturing the foamed shoe material could be effectively reused, and the yield rate of the shoe material thereby enhanced.

Abstract: The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.

Abstract: The instant disclosure provides a capacitor package structure including a capacitor unit, a first enclosing layer and a second enclosing layer. The capacitor unit includes a capacitor, a first conductive pin and a second conductive pin. The first enclosing layer encloses the entire capacitor, a part of the first conductive pin and a part of the second conductive pin. The second enclosing layer encloses the entire first enclosing layer, a part of the first conductive pin and a part of the second conductive pin. One of the first enclosing layer and the second enclosing layer is a package gel formed by a package material, and another one of the first enclosing layer and the second enclosing layer is a moisture and air resistant film formed by a moisture and air resistant material.

Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.

Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.

Abstract: A paper roll fixing device of a printer is provided. The paper roll fixing device includes a first supporting member and a second supporting member. The first supporting member includes a first supporting protrusion part and plural first auxiliary rollers. The second supporting member includes a second supporting protrusion part and plural second auxiliary rollers. The first supporting protrusion part and the second supporting protrusion part are inserted into two ends of a hollow shaft of a paper roll. Consequently, the paper roll is fixed in the space between the first supporting member and the second supporting member, and supported by the first auxiliary rollers and the second auxiliary rollers. Moreover, especially, the paper roll fixing device is applicable to a variety of paper rolls with different diameters.

Abstract: An electronic device with a detachable communication module is provided. The electronic device includes an electronic device casing and the communication module. The electronic device casing includes a receiving space and an opening. The communication module includes a covering plate, a fixing plate, a first circuit board, and a first connector. The covering plate has an aperture. The first connector has a connecting port. Moreover, the first circuit board is connected with a supporting member. The first connector is connected with the first circuit board. The connecting port is exposed to the aperture of the covering plate. After the first circuit board and the first connector are accommodated within the receiving space, the opening of the electronic device casing is covered by the covering plate. Moreover, by the fixing plate, the communication module is fixed on the electronic device casing.

Abstract: A sheet sensing module and a duplex scanning apparatus having the sheet sensing module are provided. The sheet sensing module includes a first sensing arm, a second sensing arm, and an electronic sensor. The first sensing arm is partially exposed to a sheet feeding channel of the duplex scanning apparatus. The second sensing arm is partially exposed to an inverting channel of the duplex scanning apparatus. When a document is transferred through the sheet feeding channel to trigger said first sensing arm or the document is transferred through the inverting channel to trigger the second sensing arm, the electronic sensor generates a sensing signal.

Abstract: A duplex scanning apparatus and a sheet-feeding control method thereof are provided. The duplex scanning apparatus includes a sheet feeding channel, a sheet transfer channel, an inverting channel, and a sheet sensing module. A first end of the inverting channel is connected to a junction between said sheet feeding channel and the sheet transfer channel. A second end of the inverting channel is connected to the sheet transfer channel. A distance between the sheet sensing module and the first end of the inverting channel is greater than a distance between the sheet sensing module and the second end of the inverting channel. When a document is transferred through the sheet sensing module at the second time, a next document is fed into the sheet feeding channel through a sheet entrance.

Abstract: A manufacturing method of antireflection substrate structure includes: providing a silicon wafer having a first rough surface; forming an antireflection optical film on the silicon wafer, wherein the antireflection optical film conformally overlays the first rough surface; performing a surface treatment on the antireflection optical film so that the antireflection optical film has a hydrophilic surface, and the hydrophilic surface is relatively far away from the silicon wafer; dropping a colloidal solution on the hydrophilic surface of the antireflection optical film, wherein the colloidal solution includes a solution and multiple nano-balls and the nano-balls are adhered onto the hydrophilic surface; and performing an etching process on the hydrophilic surface of the antireflection optical film by taking the nano-balls as an etching mask so as to form a second rough surface, wherein the roughness of the second rough surface is different from the roughness of the first rough surface.

Abstract: A printing device includes a casing, an upper cover, plural light sources, and a sensing module. The plural light sources are used for emitting plural light beams. The upper cover is connected with the casing, and rotatable relative the casing. The plural light sources are disposed on the upper cover, and arranged in a row. The sensing module is disposed under the plural light sources, and movable relative to the casing along a specified direction. After the light beams transmitted through a gap of the transfer paper are received by the sensing module, the gap is detected by the sensing module. The plural light beams emitted by the plural light sources can be projected onto any movable position of the sensing module. In other words, it is not necessary to align the sensing module and the plural light beams.