Abstract: The present invention relates to transporter peptides that can bind to a transferrin receptor (TfR). The transporter peptides can be conjugated covalently or noncovalently to an effector agent to form a transporter peptide conjugate, or a nucleic acid encoding the transporter peptides and an effector agent is expressed to form a recombinant transporter peptide conjugate. The transporter peptide conjugate and the recombinant transporter peptide conjugate deliver the effector agent to a target by binding to a TfR. Binding of the transporter peptides to transferrin receptors on cells of a tissue barrier induces transcytosis of the cells, thereby transporting the transporter peptide conjugate across the tissue barrier. The transporter peptides can serve as a drug delivery system and used for treatment of central nervous system (CNS) diseases.

Abstract: An audio and visual equipment and a method are provided. The audio and visual equipment includes a terminal device including a display. A user interface is displayed by the display. The user interface selectively displays one of a background selection page for selecting a background image, a stack layout selection page for selecting a layout pattern, a presentation selection page for selecting a presentation image, and an object rotation control page for controlling a position of an augmented reality object image. The terminal device provides a control signal according to a selection of the user interface. The terminal device receives a composite image associated with the selection of the user interface. The composite image is displayed by the display. The composite image includes at least one predetermined stacking sequence formed by a person image, the background image, and the at least one of the augmented reality object image and the presentation image.

Abstract: A method for forming a high electron mobility transistor is disclosed. A mesa structure having a channel layer and a barrier layer is formed on a substrate. The mesa structure has two first edges extending along a first direction and two second edges extending along a second direction. A passivation layer is formed on the substrate and the mesa structure. A first opening and a plurality of second openings connected to a bottom surface of the first opening are formed and through the passivation layer, the barrier layer and a portion of the channel layer. In a top view, the first opening exposes the two first edges of the mesa structure without exposing the two second edges of the mesa structure. A metal layer is formed in the first opening and the second openings thereby forming a contact structure.

Abstract: A semiconductor structure includes a first device and a second device. The first device includes: a first gate structure formed over an active region and a first air spacer disposed adjacent to the first gate structure. The second device includes: a second gate structure formed over an isolation structure and a second air spacer disposed adjacent to the second gate structure. The first air spacer and the second air spacer have different sizes.

Abstract: A method includes forming a first fin and a second fin protruding from a frontside of a substrate, forming a gate stack over the first and second fins, forming a dielectric feature dividing the gate stack into a first segment engaging the first fin and a second segment engaging the second fin, and growing a first epitaxial feature on the first fin and a second epitaxial feature on the second fin. The dielectric feature is disposed between the first and second epitaxial features. The method also includes performing an etching process on a backside of the substrate to form a backside trench, and forming a backside via in the backside trench. The backside trench exposes the dielectric feature and the first and second epitaxial features. The backside via straddles the dielectric feature and is in electrical connection with the first and second epitaxial features.

Abstract: An outlier IC detection method includes acquiring first measured data of a first IC set, training the first measured data for establishing a training model, acquiring second measured data of a second IC set, generating predicted data of the second IC set by using the training model according to the second measured data, generating a bivariate dataset distribution of the second IC set according to the predicted data and the second measured data, acquiring a predetermined Mahalanobis distance on the bivariate dataset distribution of the second IC set, and identifying at least one outlier IC from the second IC set when at least one position of the at least one outlier IC on the bivariate dataset distribution is outside a range of the predetermined Mahalanobis distance.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate, a channel layer, a barrier layer, a compound semiconductor layer, a gate electrode, and a stack of dielectric layers. The channel layer is disposed on the substrate. The barrier layer is disposed on the channel layer. The compound semiconductor layer is disposed on the barrier layer. The gate electrode is disposed on the compound semiconductor layer. The stack of dielectric layers is disposed on the gate electrode. The stack of dielectric layers includes layers having different etching rates.

Abstract: A semiconductor mixed material comprises an electron donor, a first electron acceptor and a second electron acceptor. The first electron donor is a conjugated polymer. The energy gap of the first electron acceptor is less than 1.4 eV. At least one of the molecular stackability, ?-?*stackability, and crystallinity of the second electron acceptor is smaller than the first electron acceptor. The electron donor system is configured to be a matrix to blend the first electron acceptor and the second electron acceptor. The present invention also provides an organic electronic device including the semiconductor mixed material.

Abstract: A method for manufacturing a semiconductor device is described. The method includes the following steps. A low-dimensional material (LDM) layer is formed on a semiconductor substrate, wherein the LDM layer includes sublayers stacked upon one another. A plasma treatment is performed to the LDM layer to transform at least one sublayer into an oxide layer, wherein the plasma treatment is performed under a temperature equivalent to or lower than about 80 degrees Celsius. At least one electrode is disposed over the oxide layer.

Abstract: A live broadcasting recording equipment, a live broadcasting recording system and a live broadcasting recording method are provided. The live broadcasting recording equipment includes a camera, a processing device, and a terminal device. The camera captures images to provide photographic data. The processing device executes background removal processing on the photographic data to generate a person image. The terminal device communicates with the processing device and has a display. The processing device executes multi-layer processing to fuse the person image, a three-dimensional virtual reality background image, an augmented reality object image, and a presentation image, and generate a composite image. After an application gateway of the processing device recognizes a login operation of the terminal device, the processing device outputs the composite image to the terminal device, so that the display of the terminal device displays the composite image.

Abstract: An input device for an information handling system ay detect an adjustment to a position of a damping medium of a linear magnetic ram of the input device. The input device may generate haptic feedback based on the detected adjustment to the position of the damping medium of the linear magnetic ram of the input device.

Abstract: A system and method for maximizing bandwidth in an uplink for a 5G communication system is disclosed. Multiple end devices generate image streams. A gateway is coupled to the end devices. The gateway includes a gateway monitor agent collecting utilization rate data of the gateway and an image inspector collecting inspection data from the received image streams. An edge server is coupled to the gateway. The edge server includes an edge server monitor agent collecting utilization rate data of the edge server. An analytics manager is coupled to the gateway and the edge server. The analytics manager is configured to determine an allocation strategy based on the collected utilization rate data from the gateway and the edge server.

Abstract: An electronic device includes a processor, a battery, a charging circuit, a controller, and an arithmetic logic unit. The processor is capable of operating at a preset frequency or a low frequency. The charging circuit is electrically connected to an external power supply and a battery and transmits a disconnection signal and to be powered by the battery when the external power supply and the charging circuit are changed from a connected state to a disconnected state. The controller is configured to transmit a first control signal when the external power supply and the charging circuit are changed from the connected state to the disconnected state. The arithmetic logic unit is configured to transmit a frequency reduction signal to the processor according to the disconnection signal and the first control signal, so that the processor reduces the preset frequency to the low frequency and operates at the low frequency.

Abstract: An electronic device includes a processor, a battery, a charging circuit, a controller, and an arithmetic logic unit. The processor is capable of operating at a preset frequency or a low frequency. The charging circuit is electrically connected to an external power supply and a battery and transmits a disconnection signal and to be powered by the battery when the external power supply and the charging circuit are changed from a connected state to a disconnected state. The controller is configured to transmit a first control signal when the external power supply and the charging circuit are changed from the connected state to the disconnected state. The arithmetic logic unit is configured to transmit a frequency reduction signal to the processor according to the disconnection signal and the first control signal, so that the processor reduces the preset frequency to the low frequency and operates at the low frequency.

Abstract: The present invention is to provide a waterproof connector with a gluing plane coated by waterproof glue, which includes an isolation base having a gluing plane formed at a rear end thereof, a plurality of first and second connection terminals each having a rear end exposed out of the gluing plane and an isolation sheet positioned between the first and second connection terminals; a metal casing for allowing the gluing plane to be positioned therein near a back opening thereof while the isolation base is inserted into the metal casing via the back opening; and a waterproof glue layer formed by coating a waterproof glue along where the gluing plane and an inner surface of the metal casing are abutted with each other. Thus, when the waterproof glue is hardened to form the waterproof glue layer, cracks between the metal casing and the isolation base are fully and watertightly filled.

Abstract: The present invention is to provide a waterproof connector having internally concealed grounding pin, which includes an outer housing having an isolation layer covered on a metal frame thereof by injection molding to form at least one grounding part exposed to a first accommodating space therein and at least one outer grounding pin exposed out of the isolation layer; an inner casing made of metal material and having at least one inner grounding pin abutted against the grounding part when the inner casing is mounted inside the outer housing; a terminal block formed by plastic integrally, having a plurality of connection terminals passing therethrough, and mounted inside the inner casing; and a waterproof glue layer watertightly filled in the rear ends of the outer housing and inner casing. Since the inner grounding pin is fully concealed inside the outer housing, the moisture can no more pass through the connector accordingly.

Abstract: The present invention is to provide a waterproof connector having internally concealed grounding pin, which includes an outer housing having an isolation layer covered on a metal frame thereof by injection molding to form at least one grounding part exposed to a first accommodating space therein and at least one outer grounding pin exposed out of the isolation layer; an inner casing made of metal material and having at least one inner grounding pin abutted against the grounding part when the inner casing is mounted inside the outer housing; a terminal block formed by plastic integrally, having a plurality of connection terminals passing therethrough, and mounted inside the inner casing; and a waterproof glue layer watertightly filled in the rear ends of the outer housing and inner casing. Since the inner grounding pin is fully concealed inside the outer housing, the moisture can no more pass through the connector accordingly.

Abstract: The present invention is to provide a waterproof connector with a gluing plane coated by waterproof glue, which includes an isolation base having a gluing plane formed at a rear end thereof, a plurality of first and second connection terminals each having a rear end exposed out of the gluing plane and an isolation sheet positioned between the first and second connection terminals; a metal casing for allowing the gluing plane to be positioned therein near a back opening thereof while the isolation base is inserted into the metal casing via the back opening; and a waterproof glue layer formed by coating a waterproof glue along where the gluing plane and an inner surface of the metal casing are abutted with each other. Thus, when the waterproof glue is hardened to form the waterproof glue layer, cracks between the metal casing and the isolation base are fully and watertightly filled.

Abstract: The present invention is to provide a card insert/eject mechanism, which includes an insulating seat formed with a receiving space and a track groove; a metal housing covering the receiving space and track groove and having a position-limiting resilient plate at a bottom surface thereof; a sliding block slidable along the track groove and laterally provided with a pushing portion that extends into the receiving space thereby, when an electronic card pushes the pushing portion, the sliding block is moved against rear end of the insulating seat; a resilient element provided in the track groove for applying a force to rear end of the sliding block; and a release bar disposed in the track groove for releasing the position-limiting resilient plate and enabling the sliding block to push the electronic card out of the receiving space, so as to effectively solve the insecure card engagement problem in conventional push-push connectors.

Abstract: The present invention is to provide a card insert/eject mechanism, which includes an insulating seat formed with a receiving space and a track groove; a metal housing covering the receiving space and track groove and having a position-limiting resilient plate at a bottom surface thereof; a sliding block slidable along the track groove and laterally provided with a pushing portion that extends into the receiving space thereby, when an electronic card pushes the pushing portion, the sliding block is moved against rear end of the insulating seat; a resilient element provided in the track groove for applying a force to rear end of the sliding block; and a release bar disposed in the track groove for releasing the position-limiting resilient plate and enabling the sliding block to push the electronic card out of the receiving space, so as to effectively solve the insecure card engagement problem in conventional push-push connectors.