Patents by Inventor Yi Rong

Yi Rong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980101
    Abstract: Disclosed are a thermoelectric device and a manufacturing mold and manufacturing method thereof. The thermoelectric device includes at least one set of thermoelectric arm unit, wherein a first thermoelectric arm is provided with a first upper surface and a first lower surface opposite to the first upper surface; a second thermoelectric arm is provided with a second upper surface and a second lower surface opposite to the second upper surface; the second thermoelectric arm is seamlessly bonded with the first thermoelectric arm via an insulating adhesive layer; the first upper surface is flush with the second upper surface, and a first spacing groove is formed between adjacent positions of the first upper surface and the second upper surface; the first lower surface is flush with the second lower surface, and a second spacing groove is formed between adjacent positions of the first lower surface and the second lower surface.
    Type: Grant
    Filed: July 6, 2022
    Date of Patent: May 7, 2024
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Hailong He, Chunping Niu, Hongrui Ren, Yi Wu, Mingzhe Rong
  • Patent number: 11972971
    Abstract: A wafer lift pin system is capable of dynamically modulating or adjusting the flow of gas into and out of lift pins of the wafer lift pin system to achieve and maintain a consistent pressure in supply lines that supply the gas to the lift pins. This enables the wafer lift pin system to precisely control the speed, acceleration, and deceleration of the lift pins to achieve consistent and repeatable lift pin rise times and fall times. A controller and various sensors and valves may control the gas pressures in the wafer lift pin system based on various factors, such as historic rise times, historic fall times, and/or the condition of the lift pins. This enables smoother and more controlled automatic operation of the lift pins, which reduces and/or minimizes wafer shifting and wafer instability, which may reduce processing defects and maintain or improve processing yields.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chen Chen, Yi-Fam Shiu, Cheng-Lung Wu, Yang-Ann Chu, Jiun-Rong Pai
  • Publication number: 20240104943
    Abstract: A method for detecting an interior condition of a vehicle is provided to use a camera device and a radar device to acquire images and point cloud datasets with respect to an interior space of the vehicle. A computing device generates a synthesized image based on the images and the point cloud datasets, obtains a skeleton feature dataset and a facial feature dataset with respect to a living object in the synthesized image, and determines the interior condition of the vehicle based on the skeleton feature dataset and the facial feature dataset.
    Type: Application
    Filed: December 15, 2022
    Publication date: March 28, 2024
    Applicant: Automotive Research & Testing Center
    Inventors: Yi-Feng SU, Zi-Rong DING, Meng-Jiang HE
  • Publication number: 20240103097
    Abstract: The present disclosure provides a direct current (DC) transformer error detection apparatus for a pulsating harmonic signal, including a DC and pulsating harmonic current output module and an external detected input module, where the DC and pulsating harmonic current output module outputs a DC and a DC superimposed pulsating harmonic current to an internal sampling circuit and a self-calibrated standard resistor array; and the internal sampling circuit converts the input DC and the input DC superimposed pulsating harmonic current into a voltage signal, and sends the voltage signal to an analog-to-digital (AD) sampling and measurement component through a front-end conditioning circuit and a detected input channel. The DC transformer error detection apparatus can complete self-calibration for measurement of the DC and the pulsating harmonic signal on a test site.
    Type: Application
    Filed: August 17, 2022
    Publication date: March 28, 2024
    Inventors: Xin Zheng, Wenjing Yu, Tao Peng, Yi Fang, Ming Lei, Hong Shi, Ben Ma, Li Ding, Wei Wei, Linghua Li, He Yu, Tian Xia, Yingchun Wang, Sike Wang, Dongri Xie, Xin Wang, Bo Pang, Xianjin Rong
  • Publication number: 20240098870
    Abstract: The present disclosure discloses a thermal plasma treatment method for sulfur hexafluoride (SF6) degradation. In the thermal plasma treatment method for SF6 degradation, Ar is input into a thermal plasma generator as a carrier gas; annular electrodes are electrically connected to a direct current power supply to generate an arc plasma region in the presence of the carrier gas Ar; to-be-reacted SF6 and to-be-reacted H2 in a predetermined ratio are input into the arc plasma region to generate hydrogen radicals as well as fluorine radicals, and the hydrogen radicals and the fluorine radicals are bonded with each other to generate HF to inhibit the self-recovery reaction of SF6; and final products include HF and elemental S.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Inventors: Hao SUN, Mingzhe RONG, Yi WU, Yunshun GUO, Hu LONG
  • Publication number: 20240085634
    Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: AuthenX Inc.
    Inventors: Chun-Chiang YEN, Po-Kuan SHEN, Sheng-Fu LIN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
  • Publication number: 20240089000
    Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 14, 2024
    Applicant: AuthenX Inc.
    Inventors: Sheng-Fu LIN, Po-Kuan SHEN, Chun-Chiang YEN, Yi-Ting LU, Jun-Rong CHEN, Jenq-Yang CHANG, Mao-Jen WU
  • Patent number: 11923225
    Abstract: A method includes initiating a gas flow of a first gas parallel to a wall of an interface module to create an air curtain across an opening defined in the wall. The method includes moving an interface door to reveal the opening, wherein the air curtain restrains a second gas within the interface module from passing through the opening. The method includes transferring a semiconductor wafer through the opening and moving the interface door to cover the opening. The method includes halting the gas flow of the first gas after moving the interface door to cover the opening.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
    Inventors: Yi-Fam Shiu, Cheng-Lung Wu, Yang-Ann Chu, Hsu-Shui Liu, Jiun-Rong Pai
  • Patent number: 11915957
    Abstract: A multiple die container load port may include a housing with an opening, and an elevator to accommodate a plurality of different sized die containers. The multiple die container load port may include a stage supported by the housing and moveable within the opening of the housing by the elevator. The stage may include one or more positioning mechanisms to facilitate positioning of the plurality of different sized die containers on the stage, and may include different portions movable by the elevator to accommodate the plurality of different sized die containers. The multiple die container load port may include a position sensor to identify one of the plurality of different sized die containers positioned on the stage.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hung Huang, Cheng-Lung Wu, Yi-Fam Shiu, Yu-Chen Chen, Yang-Ann Chu, Jiun-Rong Pai
  • Publication number: 20230394651
    Abstract: A defect detecting apparatus and method are provided. The defect detecting apparatus receives an image to be tested. The defect detecting apparatus detects the image to be tested through a defect detecting model to generate an anomaly score corresponding to the image to be tested, and the defect detecting model is generated based on the training of a generative adversarial network and a plurality of normalized loss functions. The defect detecting apparatus compares the anomaly score with an anomaly score threshold to determine whether the image to be tested is a defective image.
    Type: Application
    Filed: June 7, 2023
    Publication date: December 7, 2023
    Inventors: Yung-Hui LI, Kai-Lin YANG, Yi-Rong LIN
  • Patent number: 11815095
    Abstract: A power saving vacuuming pump system is based on complete-bearing-sealing and dry-large-pressure-difference root vacuuming root pumps includes an input valve at an input end of a vacuum space for receiving gas mixture of saturation water vapor and non-condensed air from a condenser of a power plant; a first root vacuum pump connected to the input valve for receiving gas mixture from the input valve and then compressing the gas mixture; a second root vacuum pump connected to the first root vacuum pump for receiving gas mixture from the first root vacuum pump and then compressing the gas mixture. Inner connection walls between the vacuum chamber and the two bearing chambers are installed respective bearings which are installed to be around the driving shaft, and thus all the vacuum chamber and the two bearing chambers are tightly sealed. The vacuum chamber is completely dried so as to prevent from internal emulsion.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: November 14, 2023
    Assignees: ELIVAL CO., LTD
    Inventors: Raymond Zhou Shaw, Yi Rong, Bin Wu
  • Patent number: 11608829
    Abstract: A structure comprising a rotor body, the rotor body including a rotor shaft arranged on one end face of the rotor body, a sub-shaft cavity opened in the rotor shaft, and locating keyways symmetrically opened on both sides inside the sub-shaft cavity; a sub-shaft arranged on the other end face of the rotor body, and sub-shaft locating keyways symmetrically opened on both sides of the sub-shaft.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: March 21, 2023
    Assignee: OVG VACUUM TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Yi Rong, Yue Li, Miaole Shen
  • Patent number: 11441564
    Abstract: A driving structure of a three-axis multi-stage Roots pump comprises a pump body, wherein a gear end cover is mounted at one side of the pump body, an air outlet end moving bearing air sealing unit is mounted on the other side of the pump body, and the bearing end cover is mounted on the pump at the side of the pump body; a driving axis, a first driven axis and a second driven axis are further provided inside the pump body, and the driving axis is connected with the first driven axis and the second driven axis through the gear, respectively; and both ends of the driving axis, the first driven axis and the second driven axis are movably connected to an air inlet end gear mechanical seal driving unit and an air outlet end moving bearing air sealing unit, respectively.
    Type: Grant
    Filed: December 7, 2019
    Date of Patent: September 13, 2022
    Assignee: OVG VACUUM TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Yi Rong, Yue Li, Miaole Shen
  • Publication number: 20220165880
    Abstract: A high voltage device includes: a semiconductor layer, a well, a body region, a gate, a source, a drain, and a drift oxide region. The semiconductor layer is formed on a substrate, wherein the semiconductor layer has at least one trench. The well is formed in the semicoducotor layer. The body region is formed in the well. The gate is formed on the well, and is in contact with the well. The source and the drain are located below, outside, and at different sides of the gate, in the body region and the well respectively. The drift oxide region is formed on a drift region, wherein a bottom surface of the drift oxide region is higher than a bottom surface of the trench.
    Type: Application
    Filed: February 7, 2022
    Publication date: May 26, 2022
    Inventors: Tsung-Yi Huang, Kun-Huang Yu, Ying-Shiou Lin, Chu-Feng Chen, Chung-Yu Hung, Yi-Rong Tu
  • Patent number: 11339783
    Abstract: A pump housing structure of a three-axis multi-stage Roots pump is provided, comprising a first-stage pump housing, a second-stage pump housing and a third-stage pump housing, wherein the first-stage pump housing is provided with a first center axial hole, a first left axial hole and a first right axial hole; a fixed bearing end cover is mounted on the side of the first-stage pump housing, three fixed bearing chambers are provided on the surface of the fixed bearing end cover; the second-stage pump housing is provided with a second center axial hole, a second left axial hole and a second right axial hole, the third-stage pump housing is provided with a third center axial hole, a third left axial hole and a third right axial hole, and the end surface at the outer side of the third-stage pump housing is fixedly mounted with a non-driving end bearing end cover. The present invention can accommodate and fix three axes through three fixed bearing chambers, respectively.
    Type: Grant
    Filed: December 7, 2019
    Date of Patent: May 24, 2022
    Assignee: OVG VACUUM TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Yi Rong, Yue Li, Miaole Shen
  • Patent number: 11320036
    Abstract: A transmission structure of motor connection of roots pump comprises a shaft sleeve, a motor shaft cavity is opened inside the shaft sleeve, and the inner circle of the motor shaft cavity is concentrically meshed with the excircle of the motor shaft; a fixed bolt mounting cavity is opened on the outer surface of the shaft sleeve, a bolt through-hole is opened in the fixed bolt mounting cavity, the shaft sleeve is fixedly connected with the gear seat through a hexagon bolt, and the gear seat and the shaft sleeve rotate synchronously at the same shaft center; a gear is fixedly connected with the gear seat with a bolt, the gear seat is fixed to the pump shaft through a first keyway under the fitting between the first keyway and a first shaft key, and the pump shaft and the motor shaft are coaxially arranged at the center.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: May 3, 2022
    Assignee: OVG VACUUM TECHNOLOGY (SHANGHAI) CO., LTD
    Inventors: Yi Rong, Yue Li, Miaole Shen
  • Publication number: 20210372404
    Abstract: A power saving vacuuming pump system is based on complete-bearing-sealing and dry-large-pressure-difference root vacuuming root pumps includes an input valve at an input end of a vacuum space for receiving gas mixture of saturation water vapor and non-condensed air from a condenser of a power plant; a first root vacuum pump connected to the input valve for receiving gas mixture from the input valve and then compressing the gas mixture; a second root vacuum pump connected to the first root vacuum pump for receiving gas mixture from the first root vacuum pump and then compressing the gas mixture. Inner connection walls between the vacuum chamber and the two bearing rooms are installed respective bearings which are installed to be around the driving shaft, and thus all the vacuum chamber and the two bearing rooms are tightly sealed. The vacuum chamber is completely dried so as to prevent from internal emulsion.
    Type: Application
    Filed: August 12, 2021
    Publication date: December 2, 2021
    Inventors: Raymond Zhou Shaw, Yi RONG, Bin Wu
  • Publication number: 20210195697
    Abstract: A thin film heater includes a heat conductive layer, a heat insulation layer and a heat generation layer. The heat generation layer is disposed between the heat conductive layer and the heat insulation layer. The thermal conductivity of the heat conductive layer is greater than or equal to three times the thermal conductivity of the heat insulation layer.
    Type: Application
    Filed: February 14, 2020
    Publication date: June 24, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Wei YAO, Hsiao-Fen WEI, Yu-Ching LIN, Yi-Rong LIN, Kai-Ming CHANG, Yen-Shu LEE
  • Patent number: 11038077
    Abstract: A chip package includes a chip, a sidewall structure that has a first light-shielding layer, a second light-shielding layer, and a cover. The chip has a light emitter and a light receiver that are located on a top surface of the chip. The sidewall structure is located on the top surface of the chip and has two aperture areas. The light emitter and the light receiver are respectively located in the two aperture areas. The sidewall structure surrounds the light emitter and the light receiver, and at least one surface of the sidewall structure has the first light-shielding layer. The second light-shielding layer is located between the chip and the sidewall structure. The cover is located on a surface of the sidewall structure facing away from the chip, and at least covers the light receiver and the sidewall structure that surrounds the light receiver.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: June 15, 2021
    Assignee: XINTEC INC.
    Inventors: Yen-Shih Ho, Po-Han Lee, Chien-Min Lin, Yi-Rong Ho
  • Patent number: D1021239
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: April 2, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Qiu Rong Ma, Yi Mu Yang, Ling-Yuan Liou