Abstract: Embodiments disclosed herein relate to a speech system for a vehicular device holder. The speech system can include a sensor base embedded with an inductive circuit chip and a surface for holding a device. The inductive circuit chip can comprise at least one identification code. The speech system may also include a mobile computing device coupled to the sensor base and configured with a local terminal application. The mobile computing device can be placed within the surface of the sensor base to transmit the at least one identification code. The speech system may also include a remote server that is configured to received the identification code from the mobile computing device, and authenticate the identification code, and transmit an acknowledge signal to the mobile computing device. The speech system may also include an input device coupled to the remote server and mobile computing device.

Abstract: A semiconductor device includes a first dielectric layer over a substrate, the first dielectric layer including a first dielectric material extending from a first side of the first dielectric layer distal from the substrate to a second side of the first dielectric layer opposing the first side; a second dielectric layer over the first dielectric layer; a conductive line in the first dielectric layer, the conductive line including a first conductive material, an upper surface of the conductive line being closer to the substrate than an upper surface of the first dielectric layer; a metal cap in the first dielectric layer, the metal cap being over and physically connected to the conductive line, the metal cap including a second conductive material different from the first conductive material; and a via in the second dielectric layer and physically connected to the metal cap, the via including the second conductive material.

Abstract: Semiconductor devices and methods of forming are provided. In some embodiments the semiconductor device includes a substrate, and a dielectric layer over the substrate. A first conductive feature is included in the dielectric layer, the first conductive feature comprising a first number of material layers. A second conductive feature is included in the dielectric layer, the second conductive feature comprising a second number of material layers, where the second number is higher than the first number. A first electrical connector is included overlying the first conductive feature.

Abstract: A method of manufacturing a device includes exposing at least one of a source/drain contact plug or a gate contact plug to a metal ion source solution during a manufacturing process, wherein a constituent metal of a metal ion in the metal ion source solution and the at least one source/drain contact plug or gate contact plug is the same. If the source/drain contact plug or the gate contact plug is formed of cobalt, the metal ion source solution includes a cobalt ion source solution. If the source/drain contact plug or the gate contact plug is formed of tungsten, the metal ion source solution includes a tungsten ion source solution.

Abstract: A method for sensing a biometric object using an electronic device includes the steps of: (a) emitting a sensing light from a backlight unit upon the biometric object contacting a sensing region on a display surface, and allowing the sensing light to pass through a color filter unit and then reach and be reflected by the biometric object to return as a reflected light; and (b) controlling arrangement of liquid crystal molecules located in a first region of a liquid crystal layer to define a first light path, and allowing the reflected light having predetermined wavelengths to pass through the color filter unit and the first light path to reach and be detected by the optical sensing unit.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: A method of building a model of defect inspection for a light-emitting diode (LED) display is adapted to be implemented by a model-building system. The model-building system stores captured images respectively of LED displays that were displaying images. Each of the captured images corresponds to a status tag that indicates a status of the image being displayed by the respective one of the LED displays. The method includes: performing data preprocessing on the captured images to result in pieces of pre-processed data that respectively correspond to the captured images; and building a model of defect inspection by using an algorithm of machine learning based on the pieces of pre-processed data and the status tags.

Abstract: A method for packaging an integrated circuit chip includes the steps of: a) providing a plurality of dies and a lead frame which includes a plurality of bonding parts each having a die pad, a plurality of leads each having an end region disposed on and connected to the die pad, and a plurality of bumps each disposed on the end region of a respective one of the leads; b) transferring each of the dies to the die pad of a respective one of the bonding parts to permit each of the dies to be flipped on the respective bonding part; and c) hot pressing each of the dies and the die pad of a respective one of the bonding parts to permit each of the dies to be bonded to the bumps of the respective bonding part.

Abstract: A display device includes a carrier, a substrate unit, a plurality of light emitting elements and a circuit unit. The carrier has a top surface and a bottom surface opposite to each other, and a peripheral surface interconnecting the top and bottom surfaces. The substrate unit is disposed on one side of the peripheral surface of the carrier. The light emitting elements are spacedly disposed on the top surface of the carrier. The circuit unit includes a plurality of circuit modules that are disposed on the substrate unit and that are electrically connected to the light emitting elements. Each of the circuit modules includes a switch control circuit and a driving circuit that are configured to control the light emitting elements.

Abstract: A display device includes a monitor and a support module including a base frame, a support frame and a driving unit. The base frame includes a base seat and a rotating seat connected to the base seat and rotatable about an axis. The support frame includes a connecting mechanism connected to the monitor, and a support member connected co-rotatably to the rotating seat and connected to the connecting mechanism. The driving unit includes a drive subunit co-rotatably secured to the rotating seat, and a control subunit mounted to the base seat, connected to the drive subunit, and being operable to drive rotation of the rotating seat about the axis via the drive subunit, thereby rotating the monitor about the axis.

Abstract: An enclosure for a computer proofed against being accidentally opened includes a cabinet and a cover plate, the cabinet defines a first chute, the cover plate includes a first hook structure, the first hook structure cooperates with the first chute to cover the cover plate on the cabinet. The cabinet defines a groove in the first chute, the first hook structure comprises a locking portion, and the locking portion is used to engage with the groove.

Abstract: A display device includes a monitor and a support module including a base frame, a support frame and a driving unit. The base frame includes a base seat and a rotating seat connected to the base seat and rotatable about an axis. The support frame includes a connecting mechanism connected to the monitor, and a support member connected co-rotatably to the rotating seat and connected to the connecting mechanism. The driving unit includes a drive subunit co-rotatably secured to the rotating seat, and a control subunit mounted to the base seat, connected to the drive subunit, and being operable to drive rotation of the rotating seat about the axis via the drive subunit, thereby rotating the monitor about the axis.

Abstract: Methods of forming a slurry and methods of performing a chemical mechanical polishing (CMP) process utilized in manufacturing semiconductor devices, as described herein, may be performed on semiconductor devices including integrated contact structures with ruthenium (Ru) plug contacts down to a semiconductor substrate. The slurry may be formed by mixing a first abrasive, a second abrasive, and a reactant with a solvent. The first abrasive may include a first particulate including titanium dioxide (TiO2) particles and the second abrasive may include a second particulate that is different from the first particulate. The slurry may be used in a CMP process for removing ruthenium (Ru) materials and dielectric materials from a surface of a workpiece resulting in better WiD loading and planarization of the surface for a flat profile.

Abstract: The current disclosure describes techniques of protecting a metal interconnect structure from being damaged by subsequent chemical mechanical polishing processes used for forming other metal structures over the metal interconnect structure. The metal interconnect structure is receded to form a recess between the metal interconnect structure and the surrounding dielectric layer. A metal cap structure is formed within the recess. An upper portion of the dielectric layer is strained to include a tensile stress which expands the dielectric layer against the metal cap structure to reduce or eliminate a gap in the interface between the metal cap structure and the dielectric layer.

Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Abstract: A metal-oxide semiconductor module includes multiple metal-oxide semiconductor components separated from one another by at least one first trench. Each of the metal-oxide semiconductor components includes a heavily doped semiconductor layer which includes a drain region, an epitaxial layer which is formed with an indentation such that the drain region is partially exposed from the epitaxial layer, and a metallic patterned contact unit. The epitaxial layer also includes a source region and a gate region that are spaced-apart formed therein. The metallic patterned contact unit includes source, gate, and drain patterned contacts which are electrically connected to the source, gate, and drain regions, respectively. A light-emitting diode display device including the metal-oxide semiconductor module is also disclosed.

Abstract: The invention discloses a clamping activation method, applicable to an electric clamping device with wireless charging, the electric clamping device comprising a body and a wireless charging module, a control unit, and an electric clamping assembly, all disposed inside the body. The clamping activation method comprises: the control unit receiving a signal generated by the wireless charging module; the control unit activating the electric clamping assembly to clamp the electronic device according to the signal; and the control unit activating the wireless charging module to charge the electronic device. As such, the electric clamping device can automatically clamp the electronic device without installing additional sensing elements or switches.

Abstract: A semiconductor cleaning solution for cleaning a surface of a semiconductor device, and a method of use and a method of manufacture of the cleaning solution are disclosed. In an embodiment, a material is polished away from a first surface of the semiconductor device and the first surface is cleaned with the cleaning solution. The cleaning solution may include a host having at least one ring. The host may have a hydrophilic exterior and a hydrophobic interior.

Abstract: An electronic apparatus includes a flexible display device and a roller. The flexible display device includes a driving substrate, a display layer on the driving substrate, and a front protective layer covering the display layer. The flexible display device has an end portion fixed to the roller. The roller includes a holding groove, a receiving slot, and a retraction assembly. The holding groove is recessed from an external surface of the roller. The end portion is in the holding groove. The flexible display device further includes a main body portion outside the holding groove. A thickness of the end portion is less than a thickness of the main body portion. The receiving slot is recessed from the external surface. The retraction assembly is disposed in the receiving slot. When the retraction assembly abuts against the flexible display device, the retraction assembly is pressed into the receiving slot.

Abstract: A chemical mechanical polishing (CMP) system includes a polishing pad configured to polish a substrate. The CMP system further includes a heating system configured to adjust a temperature of the polishing pad. The heating system comprises at least one heating element spaced apart from the polishing pad. The CMP system further includes a sensor configured to measure the temperature of the polishing pad.