Abstract: A method for making iridium oxide nanoparticles includes dissolving an iridium salt to obtain a salt-containing solution, mixing a complexing agent with the salt-containing solution to obtain a blend solution, and adding an oxidating agent to the blend solution to obtain a product mixture. A molar ratio of a complexing compound of the complexing agent to the iridium salt is controlled in a predetermined range so as to permit the product mixture to include iridium oxide nanoparticles.

Abstract: A heat dissipation device includes a heat sink, a centrifugal fan, and a fixing member. The centrifugal fan is enclosed and attached to a heat sink by a fixing member. Air sucked into the centrifugal fan takes away from the heat sink the accumulated heat from an electrical component of an electronic device.

Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Abstract: A heat pipe includes a sealed casing, a sealed vesicle received in the sealed casing, and a working fluid contained in the sealed vesicle. The sealed casing includes an evaporating section, a condensing section, and a connecting section connecting the evaporating section and the condensing section. The sealed vesicle is made of soft metal. The sealed vesicle comprising a heat absorbing portion attached to the evaporating section, a heat dissipating portion attached to the condensing section, and an uneven portion connecting the heat absorbing portion and the condensing section.

Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Abstract: A heat pipe includes a sealed casing, a sealed vesicle received in the sealed casing, and a working fluid contained in the sealed vesicle. The sealed casing includes an evaporating section, a condensing section, and a connecting section connecting the evaporating section and the condensing section. The sealed vesicle is made of soft metal. The sealed vesicle comprising a heat absorbing portion attached to the evaporating section, a heat dissipating portion attached to the condensing section, and an uneven portion connecting the heat absorbing portion and the condensing section.

Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.

Abstract: A heat dissipation apparatus includes a base plate and a plurality of fasteners. A plurality of mounting arms extends outwardly from the base plate. Each mounting arm defines a through hole therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a main post, a cap formed at a top of the main post, and an engaging portion formed at a bottom of the main post. A retaining thread is formed on an outer surface of the main post adjacent the engaging portion. The retaining thread matches the inner thread of the through hole of the corresponding mounting arm. The retaining thread is passable through the through hole of the mounting arm by threadingly passing the retaining thread through the inner thread of the through hole of the mounting arm whereupon the fastener remains preassembled in the through hole.

Abstract: A heat dissipation apparatus includes a heat sink and fasteners. The heat sink defines a plurality of through holes therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a bolt and a spring around the bolt. The bolt includes a main post, a cap formed on a top of the main post, and a engaging portion formed on a bottom of the main post. A retaining thread is formed on an outer surface of the main post near the engaging portion. The retaining thread matches the inner thread of the through hole. The retaining thread of the main post is configured to pass through the through hole by threading the retaining thread though the inner thread of the through hole. After the retaining thread has passed through the through hole, the retaining thread abuts a bottom surface of the heat sink.

Abstract: A heat dissipation apparatus includes a flat heat pipe and a plurality of fins stacked together. Each fin defines a substantially rectangular-shaped receiving hole therein for receiving a condenser section of the flat heat pipe and a small-sized accommodating hole therein for accommodating a solder paste. A combining sidewall extends from an edge of the receiving hole, and includes elongated top and bottom planar plates, and a short plate extending from one end of the bottom planar plate towards the top planar plate. The accommodating hole is located at a junction of the top planar plate and the short plate. The solder paste accommodated in the accommodating hole is melted to flow into the receiving hole to fill up a clearance between the flat heat pipe and the combining sidewall to combine the flat heat pipe and the fins together.

Abstract: A heat pipe includes a casing having an inner wall. A plurality of protrusions are radially formed on the inner wall of the casing. The plurality of protrusions are spaced from each other and extend longitudinally from one end of the casing to the other end of the casing. A main groove is defined between every two adjacent protrusions. The protrusions each define a plurality of first auxiliary grooves and a plurality of second auxiliary grooves being alternatively arranged with respect to each other along a longitudinal direction of the casing. The first auxiliary and the second auxiliary grooves each communicate two adjacent main grooves. The first auxiliary grooves each are inclined at an angle with respect to a longitudinal axis of the casing, and the second auxiliary grooves each are inclined at another different angle with respect to the longitudinal axis of the casing.

Abstract: A heat pipe includes a sealed hollow casing, a wick structure lining an inner surface of the casing and a working medium contained in an interior of the casing. The casing includes an elongated main body having an elongated opening extending axially in the main body and a transparent cover fixed onto the main body and sealing the opening of the main body. The wick structure is provided by only lining an inner surface of the main body of the casing.

Abstract: A heat pipe includes a casing and a three-dimensional cross-linkage wick structure received in the casing. The three-dimensional cross-linkage wick structure has a plurality of pores therein for providing a capillary action and includes a bottom layer being attached to the casing and a plurality of protrusions extending from the bottom layer and spaced from each other. A groove is defined between two adjacent protrusions. The bottom layer has a connecting portion under the groove. The connection portion is formed between and connects with the two adjacent protrusions. The connection portions have a smaller pore size than the protrusions.

Abstract: A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the fan speed regulating device; (2) turning on one electronic system and running the fan, monitoring the electronic system; (3) reducing the speed of the fan until the electronic system is shut down, recording the fan speed; (4) getting a thermal resistance (Ri) of the thermal module when it runs in an open space with the fan running at the speed at which the electronic system is shut down; (5) repeating above four steps to get some Ri's of some other such electronic systems; (6) using the thermal analysis software to analyze the Ri's of the electronic systems and getting accurately the heat-dissipating requirement for the electronic systems.

Abstract: A heat dissipating device includes a circuit board (23), an electronic component (24) being arranged on the circuit board, a base (211) being thermally attached to the electronic component, and a plurality of fasteners (22). The circuit board defines a plurality of screw holes (230) therein. The base defines a plurality of through holes (213) corresponding to the screw holes of the circuit board. Each fastener includes a bolt (27) extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring (28) mounted around the bolt. The base forms a plurality of latch hooks (214) near each through hole. A bottom ring (222) of the coil spring is sandwiched between the latch hooks and the base.

Abstract: A method of obtaining accurately a heat-dissipating requirement for electronic systems of a same kind uses a thermal analysis software, a passed thermal module with a fan, and a fan speed regulating device. The method includes steps of: (1) connecting the fan to the fan speed regulating device; (2) turning on one electronic system and running the fan, monitoring the electronic system; (3) reducing the speed of the fan until the electronic system is shut down, recording the fan speed; (4) getting a thermal resistance (Ri) of the thermal module when it runs in an open space with the fan running at the speed at which the electronic system is shut down; (5) repeating above four steps to get some Ri's of some other such electronic systems; (6) using the thermal analysis software to analyze the Ri's of the electronic systems and getting accurately the heat-dissipating requirement for the electronic systems.

Abstract: A heat dissipating device includes a circuit board (23), an electronic component (24) being arranged on the circuit board, a base (211) being thermally attached to the electronic component, and a plurality of fasteners (22). The circuit board defines a plurality of screw holes (230) therein. The base defines a plurality of through holes (213) corresponding to the screw holes of the circuit board. Each fastener includes a bolt (27) extending through a corresponding through hole of the base and then threadly engaging into a corresponding screw hole of the circuit board, and a coil spring (28) mounted around the bolt. The base forms a plurality of latch hooks (214) near each through hole. A bottom ring (222) of the coil spring is sandwiched between the latch hooks and the base.

Abstract: A heat dissipation device includes a heat pipe having a condenser section and a layer of solid-state solder film on an exterior surface of the condenser section, a heat sink having a plurality of spaced fins, each of which has an aperture. The condenser section of the heat pipe fits into the apertures of the fins. The heat sink with the condensing section received therein is heated and the solid-state solder film melts, filling gaps between the heat pipe and the fins. A method of assembling the device is also provided.