Abstract: The x-ray detector comprises a plurality of closely adjacent radiation sensing arrays facing a plurality of preprocessing circuits. Bump bonds are connected directly from said sensing arrays to said preprocessing circuits. Added absorber material may be included next to the sensing arrays for converting impinging x-rays to free electrons for affecting a charge on the sensing arrays. Alternately, a scintillator may be positioned between the sensing arrays and the preprocessing circuits and sensing cells in the sensing arrays may be exposed to the scintillator.

Abstract: The x-ray imaging system comprises an x-ray source for producing an x-ray beam and an x-ray detector. The x-ray detector comprises a solid state integrated circuit having a silicon substrate and a plurality of charge storage devices. A circuit is provided for placing a charge on the charge storage devices and the integrated circuit is disposed in an x-ray permeable material. The detector is positioned in an x-ray beam such that the charge is dissipated by secondary radiation produced by interaction between the x-ray beam and the silicon substrate of the integrated circuit.