Abstract: The present invention is related to a novel positive electrode active material for lithium-ion battery. The positive electrode active material is expressed by the following formula: Li1.2NixMn0.8-x-yZnyO2, wherein x and y satisfy 0<x?0.8 and 0<y?0.1. In addition, the present invention provides a method of manufacturing the positive electrode active material. The present invention further provides a lithium-ion battery which uses said positive electrode active material.

Abstract: In method of manufacturing a semiconductor device, a source/drain epitaxial layer is formed, one or more dielectric layers are formed over the source/drain epitaxial layer, an opening is formed in the one or more dielectric layers to expose the source/drain epitaxial layer, a first silicide layer is formed on the exposed source/drain epitaxial layer, a second silicide layer different from the first silicide layer is formed on the first silicide layer, and a source/drain contact is formed over the second silicide layer.

Abstract: A light-emitting diode LED driver and a LED driving device including the LED driver are provided. The light-emitting diode LED driver includes a decoding circuit that receives a data signal and decodes the data signal to generate display data used to drive LEDs to emit light and display and a recovered clock signal. Further provided is an encoding circuit that encodes the decoded display data by using the recovered clock signal to generate an encoded data signal, where the data signal is encoded in a first encoding format, and the encoded data signal is encoded in a second encoding format.

Abstract: A magnetic multi-pole propulsion array system is applied to at least one external cathode and includes a plurality of magnetic multi-pole thrusters connected adjacent to each other. Each magnetic multi-pole thruster includes a propellant provider, a discharge chamber, an anode and a plurality of magnetic components. The propellant provider outputs propellant. The discharge chamber is connected with the propellant provider to accommodate the propellant. The anode is disposed inside the discharge chamber to generate an electric field. The plurality of magnetic components is respectively disposed on several sides of the discharge chamber. One of the several sides of the discharge chamber of the magnetic multi-pole thruster is applied for one side of a discharge chamber of another magnetic multi-pole thruster.

Abstract: A method of forming a semiconductor device includes forming a first conductive feature on a bottom surface of an opening through a dielectric layer. The forming the first conductive feature leaves seeds on sidewalls of the opening. A treatment process is performed on the seeds to form treated seeds. The treated seeds are removed with a cleaning process. The cleaning process may include a rinse with deionized water. A second conductive feature is formed to fill the opening.

Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.

Abstract: A display driving integrated circuit (IC) and a driving parameter adjustment method thereof are provided. The display driving IC includes a control circuit and a driving parameter determination circuit. The control circuit controls a current driving circuit and a scanning circuit according to a driving parameter, wherein the current driving circuit is suitable for driving multiple driving lines of a light emitting diode (LED) array, and the scanning circuit is suitable for driving multiple scanning lines of the LED array. The driving parameter determination circuit is coupled to the control circuit to provide the driving parameter. The driving parameter determination circuit dynamically adjusts the driving parameter for a target LED in the LED array according to a grayscale value of the target LED.

Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each with field of view through a microlens determined by optical characteristics of the microlens and locations of the microlens and openings of upper and lower mask layers. Many photodiode groups have fields of view outwardly splayed from a center-direct field of view. A diameter of openings of the upper mask layer distant from the group having a center-direct field of view is larger than openings of a photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing openings in the upper mask layer of photodiode groups with outwardly splayed fields of view larger than openings in the upper mask layer associated with photodiode groups having center-direct field of view.

Abstract: An image sensor for imaging fingerprints has multiple photodiode groups each having a field of view determined by pinholes of upper and lower mask layers and a metal layer, each field of view being through a microlens. Many photodiode groups have fields of view outwardly splayed from a group having a center-direct field of view. A diameter of pinholes of the metal layer distant from the group having a center-direct field of view have larger diameter than a pinhole of the photodiode group having a center-direct field of view. A method of matching illumination of a group of photodiodes with center-direct field of view to illumination of photodiode groups having outwardly splayed fields of view includes sizing a pinhole in the metal layer of photodiode groups with outwardly splayed fields of view larger than a pinhole associated with of photodiode groups having a center-direct field of view.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: Methods and systems for modulating a manufactured light source are disclosed. Methods and systems of the present disclosure include sensor assemblies having first and second light sensors to retrieve light spectrum data at a target location, such as from a surface in an interior space at a home, office, or commercial building, that also receives daylight exposure. The first light sensor retrieves the light spectrum data within a spectrum of the manufactured light source. The second light sensor retrieves light spectrum data outside of the spectrum of the manufactured light source, yet within the spectrum of daylight. The light spectrum data is used to define spectral characteristics at the target location, such as a ratio of daylight to the manufactured light source, phase of daylight, and average overall quantity, which are used to maximize light-associated benefits of the spectral composition for the occupants at the target location, such as humans, plants, and animals.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A near-eye display device includes (a) a display unit for displaying a display image, (b) a viewing unit for presenting the display image to the eye and transmitting ambient light from an ambient scene toward the eye, and (c) an eye imaging unit including (i) an illumination module for generating at least three infrared light beams propagating along at least three different, non-coplanar directions, respectively, (ii) a first beamsplitter interface, disposed between the display unit and the viewing unit, for merging at least a portion of each of the infrared light beams with visible display light to direct each portion toward the eye via the viewing unit, and (iii) a camera for imaging, via the viewing unit and the first beamsplitter interface, pupil of the eye and reflections of the infrared light beams incident on the eye, to form one or more images indicative of gaze direction of the eye.

Abstract: A chip package structure is provided. The chip package structure includes a substrate having a first surface and a second surface opposite to the first surface. The chip package structure includes a first chip structure and a second chip structure over the first surface. The chip package structure includes a protective layer over the first surface and surrounding the first chip structure and the second chip structure. A portion of the protective layer is between the first chip structure and the second chip structure. The chip package structure includes a first anti-warpage bump over the second surface and extending across the portion of the protective layer. The chip package structure includes a conductive bump over the second surface and electrically connected to the first chip structure or the second chip structure. The first anti-warpage bump is wider than the conductive bump.

Abstract: A lensed beam-splitter prism array includes a beam-splitter substrate with a plurality of planar and parallel thin-film coatings each spanning a top substrate surface and a bottom substrate surface, and making an oblique angle therebetween, and a lens form layer formed on the top surface and having a plurality of lens forms, each lens form being above one of the plurality of coatings. A method for fabricating a lensed beam-splitter prism includes bonding a plurality of substrates to form a substrate stack having a coating between each adjacent substrate pair. The method also includes forming a stack slice by applying a plurality of parallel cuts at an oblique angle with respect to each coating. Each coating spans a first stack-slice surface and a second stack-slice surface opposing the first stack-slice surface. The method also includes forming a lens form layer on the first stack-slice surface spanning one or more coatings.

Abstract: Methods and systems for modulating a manufactured light source are disclosed. Methods and systems of the present disclosure include sensor assemblies having first and second light sensors to retrieve light spectrum data at a target location, such as from a surface in an interior space at a home, office, or commercial building, that also receives daylight exposure. The first light sensor retrieves the light spectrum data within a spectrum of the manufactured light source. The second light sensor retrieves light spectrum data outside of the spectrum of the manufactured light source, yet within the spectrum of daylight. The light spectrum data is used to define spectral characteristics at the target location, such as a ratio of daylight to the manufactured light source, phase of daylight, and average overall quantity, which are used to maximize light-associated benefits of the spectral composition for the occupants at the target location, such as humans, plants, and animals.

Abstract: A near-eye display device, with coaxial eye imaging, for mounting in field of view of an eye of a user, includes a display unit for displaying a display image, a viewing unit for (i) presenting the display image to the eye based upon polarized visible light received from the display unit and (ii) transmitting ambient light from an ambient scene toward the eye, and an eye imaging unit including (a) an illumination module for generating infrared light, (b) a first polarizing beamsplitter interface, disposed between the display unit and the viewing unit, for (i) merging a polarized infrared component of the infrared light with the polarized visible light and (ii) separating from the polarized visible light a portion of the polarized infrared component reflected by the eye, and (c) a camera for forming an image of the eye based upon the polarized infrared component reflected by the eye.

Abstract: A despeckle optical system for an image projector includes a diffuser, an in-plane vibrator, a microlens array, and a vibrator driver. The in-plane vibrator is coupled to vibrate the diffuser along a vibration plane. The vibrator driver is coupled to drive the in-plane vibrator and configured to drive the in-plane vibrator at different vibration amplitudes for averaging the intensity of speckle in display light that propagates through the diffuser via the microlens array.

Abstract: A near-eye display device includes (a) a display unit having a liquid-crystal-on-silicon (LCOS) display and a first polarizing beam splitter interface for (i) reflecting illumination light from an illumination module towards the liquid-crystal-on-silicon display and (ii) transmitting display light from the LCOS display based on the illumination light, and (b) a viewing unit having an imaging objective that forms an image of the LCOS display for the pupil based on the display light, and a second polarizing beam splitter interface for (i) reflecting reflected display light from the imaging objective towards the pupil and (ii) transmitting ambient light from an ambient scene towards a pupil, the second polarizing beam splitter interface and the first polarizing beam splitter interface being orthogonal to a common plane.