Patents by Inventor Yi-Ying HUANG

Yi-Ying HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11980864
    Abstract: A method of operating an integrated circuit includes using a first switching device to couple a bio-sensing device to a first signal path, generating, using the bio-sensing device, a bio-sensing signal on the first signal path in response to an electrical characteristic of a sensing film, using a second switching device to couple a temperature-sensing device to a second signal path, and generating, using the temperature-sensing device, a temperature-sensing signal on the second signal path in response to a temperature of the sensing film. The first and second switching devices, the bio-sensing device, the temperature-sensing device, and the sensing film are components of a sensing pixel of a plurality of sensing pixels of the integrated circuit.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD
    Inventors: Tung-Tsun Chen, Yi-Shao Liu, Jui-Cheng Huang, Chin-Hua Wen, Felix Ying-Kit Tsui, Yung-Chow Peng
  • Publication number: 20240153998
    Abstract: A method for the selective formation of epitaxial layers is described herein. In the method, epitaxial layers are deposited to form source and drain regions around a horizontal gate all around (hGAA structure). The method includes co-flowing a combination of chlorinated silicon containing precursors, antimony containing precursors, and n-type dopant precursors. The resulting source and drain regions are selectively grown from crystalline nanosheets or nanowires of the hGAA structure over the non-crystalline gate structure and dielectric layers. The source and drain regions are predominantly grown in a <110> direction.
    Type: Application
    Filed: December 11, 2023
    Publication date: May 9, 2024
    Inventors: CHEN-YING WU, Abhishek DUBE, Yi-Chiau HUANG
  • Publication number: 20240137875
    Abstract: A method for adjusting time-averaged (TA) parameters of a transmitting (TX) power of a radio module includes: obtaining at least one message of the at least one other radio module or at least one message of the radio module; determining a scenario of the TX power of the radio module according to the at least one message of the at least one other radio module or the at least one message of the radio module; determining whether the scenario is different from a predetermined scenario of the TX power of the radio module; and in response to the scenario being different from the predetermined scenario, adjusting the TA parameters according to the scenario.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 25, 2024
    Applicant: MEDIATEK INC.
    Inventors: Yi-Ying Huang, Yi-Hsuan Lin, Han-Chun Chang
  • Patent number: 11956261
    Abstract: A detection method for a malicious domain name in a domain name system (DNS) and a detection device are provided. The method includes: obtaining network connection data of an electronic device; capturing log data related to at least one domain name from the network connection data; analyzing the log data to generate at least one numerical feature related to the at least one domain name; inputting the at least one numerical feature into a multi-type prediction model, which includes a first data model and a second data model; and predicting whether a malicious domain name related to a malware or a phishing website exists in the at least one domain name by the multi-type prediction model according to the at least one numerical feature.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 9, 2024
    Assignee: Acer Cyber Security Incorporated
    Inventors: Chiung-Ying Huang, Yi-Chung Tseng, Ming-Kung Sun, Tung-Lin Tsai
  • Patent number: 11948796
    Abstract: One or more embodiments described herein relate to selective methods for fabricating devices and structures. In these embodiments, the devices are exposed inside the process volume of a process chamber. Precursor gases are flowed in the process volume at certain flow ratios and at certain process conditions. The process conditions described herein result in selective epitaxial layer growth on the {100} planes of the crystal planes of the devices, which corresponds to the top of each of the fins. Additionally, the process conditions result in selective etching of the {110} plane of the crystal planes, which corresponds to the sidewalls of each of the fins. As such, the methods described herein provide a way to grow or etch epitaxial films at different crystal planes. Furthermore, the methods described herein allow for simultaneous epitaxial film growth and etch to occur on the different crystal planes.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: April 2, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Yi-Chiau Huang, Chen-Ying Wu, Abhishek Dube, Chia Cheng Chin, Saurabh Chopra
  • Publication number: 20240105879
    Abstract: A light-emitting diode and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, an LED wafer is provided. The LED wafer includes a substrate and a light-emitting semiconductor stacking structure positioned on the surface of the substrate. The light-emitting semiconductor stacking structure includes a first type semiconductor layer, an active layer, and a second type semiconductor layer from a side of the substrate. Second, dicing lanes are defined on the upper surface of the LED wafer. Third, dicing is performed along the dicing lanes of the substrate using a laser. The laser is focused on the lower surface of the substrate to form a surface hole and focused inside the substrate to form an internal hole. The diameter of the surface hole is greater than the diameter of the internal hole. Fourth, the LED wafer is separated into LED chips along the dicing lanes.
    Type: Application
    Filed: November 29, 2023
    Publication date: March 28, 2024
    Applicant: Quanzhou sanan semiconductor technology Co., Ltd.
    Inventors: TSUNG-MING LIN, CHUNG-YING CHANG, YI-JUI HUANG, YU-TSAI TENG
  • Publication number: 20240096998
    Abstract: The present disclosure describes a method for forming metallization layers that include a ruthenium metal liner and a cobalt metal fill. The method includes depositing a first dielectric on a substrate having a gate structure and source/drain (S/D) structures, forming an opening in the first dielectric to expose the S/D structures, and depositing a ruthenium metal on bottom and sidewall surfaces of the opening. The method further includes depositing a cobalt metal on the ruthenium metal to fill the opening, reflowing the cobalt metal, and planarizing the cobalt and ruthenium metals to form S/D conductive structures with a top surface coplanar with a top surface of the first dielectric.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shuen-Shin LIANG, Chij-chien CHI, Yi-Ying LIU, Chia-Hung CHU, Hsu-Kai CHANG, Cheng-Wei CHANG, Chein-Shun LIAO, Keng-chu LIN, KAi-Ting HUANG
  • Publication number: 20230387955
    Abstract: A method for adjusting a transmitting (TX) power ratio of a radio module includes: separating multiple radio modules into multiple radio groups according to a radiofrequency (RF) regulation, wherein the multiple radio modules comprise the radio module; mapping an RF exposure limit to a TX power limit; interacting with at least one other radio module for adjusting the TX power ratio, to obtain at least one adjusted TX power ratio, wherein the radio module and the at least one other radio module are comprised in a same radio group of the multiple radio groups; and adjusting the TX power limit according to the at least one adjusted TX power ratio, to generate an adjusted TX power limit of the radio module.
    Type: Application
    Filed: April 18, 2023
    Publication date: November 30, 2023
    Applicant: MEDIATEK INC.
    Inventors: Fu-Tse Kao, Yi-Hsuan Lin, Han-Chun Chang, Yi-Ying Huang
  • Publication number: 20220369246
    Abstract: A method for improving transmission power management with compliance to regulations of radiofrequency exposure, which may comprise: at a current time, estimating whether a window average power, which may reflect average power transmitted using a radio technology during a moving time window, will exceed a power limit after the current time; if true, proceeding to at least one of a first handling subroutine and a second handling subroutine to set a power cap, and causing power transmitted to be capped by the power cap after the current time. The first handling subroutine may comprise: scheduling to set the power cap lower at a scheduled time. Estimating whether the window average power will exceed the power limit may involve discarding one of a plurality of power records. The second handling subroutine may comprise: setting the power cap not higher than the discarded one of the plurality of power records.
    Type: Application
    Filed: April 11, 2022
    Publication date: November 17, 2022
    Inventors: Yi-Hsuan LIN, Han-Chun CHANG, Chih-Yuan LIN, Yi-Ying HUANG