Patents by Inventor Yi Yuan
Yi Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982866Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.Type: GrantFiled: December 15, 2022Date of Patent: May 14, 2024Assignee: TDK TAIWAN CORP.Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
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Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
Patent number: 11984261Abstract: Various embodiments of the present disclosure are directed towards an integrated chip including a dielectric structure sandwiched between a first electrode and a bottom electrode. A passivation layer overlies the second electrode and the dielectric structure. The passivation layer comprises a horizontal surface vertically below a top surface of the passivation layer. The horizontal surface is disposed above a top surface of the dielectric structure.Type: GrantFiled: August 25, 2021Date of Patent: May 14, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng, Yi Heng Tsai, You-Ru Lin, Yen-Wen Chen, Fu-Chun Huang, Fan Hu, Ching-Hui Lin, Yan-Jie Liao -
Patent number: 11983475Abstract: A semiconductor device includes: M*1st conductors in a first layer of metallization (M*1st layer) and being aligned correspondingly along different corresponding ones of alpha tracks and representing corresponding inputs of a cell region in the semiconductor device; and M*2nd conductors in a second layer of metallization (M*2nd layer) aligned correspondingly along beta tracks, and the M*2nd conductors including at least one power grid (PG) segment and one or more of an output pin or a routing segment; and each of first and second ones of the input pins having a length sufficient to accommodate at most two access points; each of the access points of the first and second input pins being aligned to a corresponding different one of first to fourth beta tracks; and the PG segment being aligned with one of the first to fourth beta tracks.Type: GrantFiled: February 7, 2023Date of Patent: May 14, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Pin-Dai Sue, Po-Hsiang Huang, Fong-Yuan Chang, Chi-Yu Lu, Sheng-Hsiung Chen, Chin-Chou Liu, Lee-Chung Lu, Yen-Hung Lin, Li-Chun Tien, Yi-Kan Cheng
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Publication number: 20240154215Abstract: An aluminum plastic film for a lithium battery and a method for manufacturing the same are provided. The method includes steps as follows: preparing a polyolefin adhesive; coating the polyolefin adhesive onto one surface of an aluminum foil layer; disposing an inner polyolefin layer onto the polyolefin adhesive; and drying the polyolefin adhesive, so that a polyolefin adhesive layer is formed between the aluminum foil layer and the inner polyolefin layer. Components of the polyolefin adhesive include a modified polyolefin polymer and a hardener. The modified polyolefin polymer has a modified group, a structure of the modified group contains maleic anhydride, and a molecular weight of the modified polyolefin polymer ranges from 100,000 g/mol to 200,000 g/mol.Type: ApplicationFiled: February 17, 2023Publication date: May 9, 2024Inventors: TE-CHAO LIAO, SHIOU-YEH SHENG, TENG-KO MA, CHING-YAO YUAN, Chao-Hsien Lin, CHIA-YU LIN, YUN-BIN HSI, HAN-YI LEE, SHUN-CHIEH YANG
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Patent number: 11976358Abstract: An atomic layer deposition system is provided, including: a main body, a platform, a gas distribution showerhead assembly and a first ring member. The main body defines a reaction chamber, and the platform is located in the reaction chamber. The gas distribution showerhead assembly is disposed on the main body and includes at least one gas inlet channel and at least one gas diffusion plate. Each of the at least one gas diffusion plate includes a plurality of through holes. The first ring member defines a radial direction and is disposed between the platform and the at least one gas diffusion plate. A region of the at least one gas diffusion plate distributed with the plurality of through holes defines an outermost distribution profile. An inner circumferential wall of the first ring member and the outermost distribution profile keep a distance in the radial direction.Type: GrantFiled: February 28, 2022Date of Patent: May 7, 2024Assignee: SYSKEY TECHNOLOGY CO., LTD.Inventors: Hsueh-Hsien Wu, Chih-Yuan Chan, Yi-Ting Lai
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Publication number: 20240139337Abstract: The present disclosure relates to a method for treating a cancer and/or cancer metastasis in a subject comprising administering to the subject irinotecan loaded in a mesoporous silica nanoparticle. The present disclosure also provides a conjugate comprising an agent loaded in a mesoporous silica nanoparticle (MSN) defining at least one pore and having at least one functional group on a sidewall of the at least one pore.Type: ApplicationFiled: November 2, 2022Publication date: May 2, 2024Inventors: Cheng-Hsun WU, SI-HAN WU, YI-PING CHEN, RONG-LIN ZHANG, CHUNG-YUAN MOU, Yu-Tse LEE
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Publication number: 20240142344Abstract: In example implementations described herein, there are systems and methods enabling manufacturers to become more efficient by providing a digital tool to track, visualize, quantify, and notify production bottlenecks for quick actions. Some implementations include an apparatus including a processor configured to analyze time-stamp data collected associated with a plurality of elements of an industrial process. The processor may be configured to generate, based on the analyzed time-stamp data, a color coded visualization of the industrial process, where generating the color coded visualization includes associating each of the plurality of elements of the industrial process with a corresponding color indicating a state of an element in the plurality of elements of the industrial process. The processor may further be configured to present, via a display, the generated color coded visualization of the industrial process.Type: ApplicationFiled: October 28, 2022Publication date: May 2, 2024Inventors: Wei YUAN, Yi-chu CHANG, Lili ZHENG
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Patent number: 11972805Abstract: In a non-volatile memory, to achieve a shallow and tight erased threshold voltage distribution, a process is performed that includes erasing a group of non-volatile memory cells, identifying a first set of the bit lines that are connected to non-volatile memory cells of the group that are erased past a lower limit for erased non-volatile memory cells and identifying a second set of the bit lines that are connected to non-volatile memory cells of the group that are not erased past the lower limit for erased non-volatile memory cells, and applying programming to non-volatile memory cells connected to the first set of bit lines while inhibiting programming for non-volatile memory cells connected to the second set of bit lines.Type: GrantFiled: August 5, 2022Date of Patent: April 30, 2024Assignee: SanDisk Technologies LLCInventors: Yi Song, Yanjie Wang, Jiahui Yuan
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Patent number: 11973895Abstract: Embodiments of this application disclose a call method and an apparatus. In the call method, when a user does not actively select an audio device as a voice pickup device and a voice play device, after establishing a call connection to another electronic device, an electronic device selects, from available audio devices, an audio device that meets a user expectation as the voice pickup device and the voice play device. According to technical solutions provided in the embodiments of this application, user experience in a call process can be improved.Type: GrantFiled: April 21, 2023Date of Patent: April 30, 2024Assignee: Huawei Technologies Co., Ltd.Inventors: Fusheng Li, Shengfeng Zhou, Yi Yu, Wei Yuan
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Patent number: 11974479Abstract: An electrical connection structure is provided. The electrical connection structure includes a through hole, a first pad, a second pad and a conductive bridge. The through hole has a first end and a second end. The first pad at least partially surrounds the first end of the through hole and is electrically connected to a first circuit. The second pad is located at the second end of the through hole and is electrically connected to a second circuit. The conductive bridge is connected to the first pad and second pad through the through hole, thereby making the first and second circuits electrically connected to each other.Type: GrantFiled: December 11, 2020Date of Patent: April 30, 2024Assignee: INNOLUX CORPORATIONInventors: Shun-Yuan Hu, Chin-Lung Ting, Li-Wei Mao, Ming-Chun Tseng, Kung-Chen Kuo, Yi-Hua Hsu, Ker-Yih Kao
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Patent number: 11972812Abstract: A memory system identifies memory cells connected to a common word line that have had their threshold voltage unintentionally drift lower than programmed by determining whether memory cells meet two criteria: (1) the memory cells have threshold voltages within an offset of a read compare voltage of a data state; and (2) adjacent memory cells (connected to word lines that are adjacent to the common word line) are in one or more low data states. For those memory cells meeting the two criteria, the memory system performs some amount of programming on the memory cells to refresh the data stored in those memory cells to be as originally intended.Type: GrantFiled: December 13, 2021Date of Patent: April 30, 2024Assignee: SanDisk Technologies LLCInventors: Yi Song, Jiahui Yuan, Jun Wan, Deepanshu Dutta
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Publication number: 20240129012Abstract: A wearable device includes a frame element and a dielectric substrate. The frame element includes a first metal element, a second metal element, and a third metal element. A first gap is provided between the first metal element and the second metal element. A second gap is provided between the second metal element and the third metal element. A third gap is provided between the third metal element and the first metal element. The dielectric substrate is surrounded by the first metal element, the second metal element, and the third metal element. A first antenna element is formed by the first metal element. A second antenna element is formed by the second metal element. A third antenna element is formed by the third metal element.Type: ApplicationFiled: December 6, 2022Publication date: April 18, 2024Inventors: Jing-Yao XU, Chung-Ting HUNG, Chun-Yuan WANG, Chu-Yu TANG, Yi-Chih LO, Yu-Chen ZHAO, Chih-Tsung TSENG
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Publication number: 20240124447Abstract: The present invention is directed to inhibitors of the interaction of menin with MLL and MLL fusion proteins, pharmaceutical compositions containing the same, and their use in the treatment of cancer and other diseases mediated by the menin-MLL interaction.Type: ApplicationFiled: May 18, 2023Publication date: April 18, 2024Applicant: Vitae Pharmaceuticals, LLCInventors: Salvacion CACATIAN, David A. CLAREMON, Chengguo DONG, Yi FAN, Lanqi JIA, Stephen D. LOTESTA, Suresh B. SINGH, Shankar VENKATRAMAN, Jing YUAN, Yajun ZHENG, Linghang ZHUANG
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Publication number: 20240126633Abstract: A method for responding to a command is adapted for a storage device. The method for responding to a command includes following steps of: sequentially receiving a first command and a second command by a bridge of the storage device from a host; executing the first command and the second command to generate a status completion signal or a status error signal by the bridge; and detecting an error state of at least one of the first command and the second command to execute a response mode or an idle mode by the bridge according to the error state so as to respond to the host.Type: ApplicationFiled: August 14, 2023Publication date: April 18, 2024Inventors: Yi Cheng TSAI, Sung-Kao LIU, Cheng-Yuan HSIAO, Po-Hao CHEN
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Publication number: 20240130140Abstract: A semiconductor device includes a substrate having a magnetic tunneling junction (MTJ) region and a logic region, a magnetic tunneling junction (MTJ) on the MTJ region and a first metal interconnection on the MTJ. Preferably, a top view of the MTJ includes a circle and a top view of the first metal interconnection includes an ellipse overlapping the circle.Type: ApplicationFiled: December 26, 2023Publication date: April 18, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Ting-Hsiang Huang, Yi-Chung Sheng, Sheng-Yuan Hsueh, Kuo-Hsing Lee, Chih-Kai Kang
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Patent number: 11961714Abstract: A substrate processing apparatus comprises a chamber member that defines an interior volume that has an aspect ratio. The chamber member comprises a pair of laterally opposing inlet walls and a loading port. Each of the pair of laterally opposing inlet walls has an inlet port configured to receive output from a remote plasma source. The loading port is arranged between the pair of inlet walls, configured to allow passage of a substrate into the interior volume.Type: GrantFiled: May 31, 2021Date of Patent: April 16, 2024Assignee: LINCO TECHNOLOGY CO., LTD.Inventors: Yi-Yuan Huang, Yi-Cheng Liu
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Patent number: 11961808Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: GrantFiled: October 14, 2021Date of Patent: April 16, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Jen Wang, Po-Jen Cheng, Fu-Yuan Chen, Yi-Hsin Cheng
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Publication number: 20240120203Abstract: A method includes forming a dummy gate over a semiconductor fin; forming a source/drain epitaxial structure over the semiconductor fin and adjacent to the dummy gate; depositing an interlayer dielectric (ILD) layer to cover the source/drain epitaxial structure; replacing the dummy gate with a gate structure; forming a dielectric structure to cut the gate structure, wherein a portion of the dielectric structure is embedded in the ILD layer; recessing the portion of the dielectric structure embedded in the ILD layer; after recessing the portion of the dielectric structure, removing a portion of the ILD layer over the source/drain epitaxial structure; and forming a source/drain contact in the ILD layer and in contact with the portion of the dielectric structure.Type: ApplicationFiled: March 8, 2023Publication date: April 11, 2024Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Te-Chih HSIUNG, Yun-Hua CHEN, Bing-Sian WU, Yi-Hsuan CHIU, Yu-Wei CHANG, Wen-Kuo HSIEH, Chih-Yuan TING, Huan-Just LIN
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Publication number: 20240120639Abstract: A 3D IC package is provided. The 3D IC package includes: a first IC die comprising a first substrate at a back side of the first IC die; a second IC die stacked at the back side of the first IC die and facing the first substrate; a TSV through the first substrate and electrically connecting the first IC die and the second IC die, the TSV having a TSV cell including a TSV cell boundary surrounding the TSV; and a protection module fabricated in the first substrate, wherein the protection module is electrically connected to the TSV, and the protection module is within the TSV cell.Type: ApplicationFiled: August 10, 2023Publication date: April 11, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Po-Hsiang Huang, Fong-Yuan Chang, Tsui-Ping Wang, Yi-Shin Chu
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Publication number: 20240115435Abstract: Disclosed is an absorbent body for an absorbent article comprising 1) a water permeable topsheet; 2) a water impermeable backsheet; 3) an absorbent core disposed between the topsheet and the backsheet; and 4) a composite isolation sheet bonded to the wearer facing side of the topsheet.Type: ApplicationFiled: September 26, 2023Publication date: April 11, 2024Inventors: Yoichiro YAMAMOTO, Fengchun YE, Hiroshi FUJIKAWA, Jiale HUANG, Yi YUAN