Abstract: An overhead hoist transfer apparatus includes a rail assembly including a straight rail having an empty section, and a curved rail having a curved empty section; an engine including a first LSD having first and second wheels at two sides respectively; and a second LSD having third and fourth wheels at two sides respectively; a moving carriage driven by the engine and suspended from the rail assembly; first and second guide wheels disposed on the first LSD; third and fourth guide wheels disposed on the second LSD; and two guide boards disposed above a joining point of the straight rail and the curved rail. An elevation of the guide boards is equal to that of the guide wheels. The guide board includes a straight edge and a curved edge.

Abstract: A powered industrial truck includes a lateral movement assembly including four sliding members and four pivotal members both on a wheeled carriage, four links having a first end pivotably secured to the sliding member and a second end pivotably secured to either end of the pivotal member, a motor shaft having two ends pivotably secured to the pivotal members respectively, a first electric motor on one frame member, and four mounts attached to the sliding members respectively; two lift assemblies including a second electric motor, a shaft having two ends rotatably secured to the sliding members respectively, two gear trains at the ends of the shaft respectively, a first gear connected to the second electric motor, a second gear on the shaft, and a first roller chain on the first and second gears; two electric attachments on the platform and being laterally moveable, each attachment. The mount has rollers.

Abstract: A structure and a formation method of a semiconductor device are provided. The method includes forming a first semiconductor fin and a second semiconductor fin over a semiconductor substrate. The second semiconductor fin is wider than the first semiconductor fin. The method also includes forming a gate stack over the semiconductor substrate, and the gate stack extends across the first semiconductor fin and the second semiconductor fin. The method further includes forming a first source/drain structure on the first semiconductor fin, and the first source/drain structure is p-type doped. In addition, the method includes forming a second source/drain structure on the second semiconductor fin, and the second source/drain structure is n-type doped.

Abstract: A method for evaluating a risk of a subject getting a specific disease includes steps of: storing a reference database that contains original parameter sets; selecting target alleles from an SNP profile derived from genome sequencing data of a subject; selecting target parameter sets from among the original parameter sets; calculating, for each of the target parameter sets, a race factor based on a global risk allele frequency and a group-specific risk allele frequency included in the target parameter set; calculating a genetic factor based on statistics, global reference allele frequencies, the race factors for the target parameter sets, and numbers of chromosomes in homologous chromosome pairs included in the target parameter sets; calculating a citation factor based on numbers of citation times included in the target parameter sets; and calculating a risk score based on the genetic factor and the citation factor.

Abstract: A sunk-type package structure includes a substrate, an optical sensing chip, and a housing. The substrate has a cavity with a first depth. The optical sensing chip is disposed inside the cavity and electrically connected with the substrate. A surface of the optical sensing chip has a first sensing area for sensing light. The housing covers the substrate and the optical sensing chip. The housing has a light-permeable portion disposed above the first sensing area.

Abstract: An optical sensing device is provided. The optical sensing device includes a first optical sensor and a filter layer. The first optical sensor is configured to receive a first optical signal. The filter layer covers the first optical sensor, and is configured to filter out the first optical signal when the first optical signal is incident on the filter layer at an incident angle not within a specific range.

Abstract: An optical sensing module has a light source and an optical sensing integrated circuit device. The optical sensing integrated circuit device has an optical sensor and a grating. The optical sensor and the light source are arranged along a first direction. The grating is formed over the optical sensor and has multiple parallel wires. The multiple wires are perpendicular to the first direction.

Abstract: A display device comprises an organic light emitting diode (OLED) display panel, an upper linear polarizer, and an ambient light sensor. The upper linear polarizer is disposed over the OLED display panel. The ambient light sensor is disposed beneath the OLED display panel. The ambient light sensor includes a substrate, a first sensing element, a second sensing element, a first lower linear polarizer, and a second lower linear polarizer. The first sensing element senses light to generate a first sensing value. The first lower linear polarizer is disposed between the OLED display panel and the first sensing element. The second sensing element senses light to generate a second sensing value. The second lower linear polarizer is disposed between the OLED display panel and the second sensing element. The first sensing value and the second sensing value are used to calculate an ambient light intensity.

Abstract: Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.

Abstract: An optical sensing module has a light source and an optical sensing integrated circuit device. The optical sensing integrated circuit device has an optical sensor and a grating. The optical sensor and the light source are arranged along a first direction. The grating is formed over the optical sensor and has multiple parallel wires. The multiple wires are perpendicular to the first direction.

Abstract: An optical sensing device is provided. The optical sensing device includes a first optical sensor and a filter layer. The first optical sensor is configured to receive a first optical signal. The filter layer covers the first optical sensor, and is configured to filter out the first optical signal when the first optical signal is incident on the filter layer at an incident angle not within a specific range.

Abstract: Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: An optical sensor module is provided. The optical sensor module includes a light source, a first lens and a sensor device. The light source is arranged for generating a light signal. The first lens has a first optical center axis. The sensor device is disposed in correspondence with one side of the first lens. The sensor device includes a light sensitive area, and a center of the light sensitive area deviates from the first optical center axis. The sensor device is arranged for receiving a reflected signal reflected from an object in response to the light signal, and accordingly generating a sensing result.

Abstract: A fabric with level gradient effect contains: at least one yarn Y1, at least one yarn Y2, at least one yarn Y3. At least one of Y2 is knitted between Y1 and Y3. Y1, Y2, and Y3 is obtained by one of the conditions: (1) Each of Y1, Y2, and Y3 is dope dyed and has at least an identical pigment with three different content and account for X1, X2, and X3 wt % of fiber, and 1.03*X1?X2?0.97*X3, the fabric is further bath dyed to obtain level gradient color effect; (2) Each of Y1, Y2, and Y3 is cationic dyeable polyester yarn having the same sulfonic acid group with three different content of the sulfonic acid group and account for X1, X2, and X3 mol. % of fiber, and 1.03*X1?X2?0.97*X3, the fabric is further bath dyed to obtain level gradient color effect.

Abstract: An optical component includes a substrate and two optical lenses, and the substrate and the two optical lenses are an integrated and inseparable structure. A groove that can accommodate a required collimating optical element is provided on the substrate, or a collimating optical element and the substrate are integrated. Because fabrication of optical elements is completed during fabrication of the optical component, the number of elements to fabricate and time and cost of fabricating the elements can be reduced. Also, during assembly of an image capturing device, it is only required that the optical component is locked to a body of the image capturing device to complete arrangement of a front panel and the optical elements, which can greatly simplify an assembly procedure and shorten assembly time.

Abstract: A dope-dyed core-sheath type composite fiber contains a core layer (A) and a sheath layer (B) which entirely covering the core layer (A). The core layer (A) contains at least one or a plurality of dye materials with at least 0.1% wt in the core part, composites of the core layer (A) and the sheath layer (B) are both dye-soluble polymers. The fineness of the core-sheath type composite fiber is more than 0.5 Denier-per-filament, and a cross-sectional area ratio of the sheath layer X(B) and X(B) 20%.

Abstract: A light harvesting lens module for collecting an ambient light includes a plurality of annular lenses. The annular lenses are arranged in order from center to outside to form a disc-structure. Each annular lens has a light-input curved surface and a light-output curved surface. The light-input curved surface is in opposition to the center. The light-output curved surface is in opposition to the light-input curved surface, and faces the center. The light is incident on the light-input curved surface, and is refracted and tend to concentrate by the light-input curved surface. Then, the light is emitted from the annular lens, and is refracted to the direction of the center by the light-output curved surface. The ambient light is able to be compressed into a point light by the lens module, so as to increase the concentration ratio and the compression ratio to further get the effective advantage.

Abstract: An optical component includes a substrate and two optical lenses, and the substrate and the two optical lenses are an integrated and inseparable structure. A groove that can accommodate a required collimating optical element is provided on the substrate, or a collimating optical element and the substrate are integrated. Because fabrication of optical elements is completed during fabrication of the optical component, the number of elements to fabricate and time and cost of fabricating the elements can be reduced. Also, during assembly of an image capturing device, it is only required that the optical component is locked to a body of the image capturing device to complete arrangement of a front panel and the optical elements, which can greatly simplify an assembly procedure and shorten assembly time.

Abstract: A traffic signal system with dual light sources includes a signal displaying module, an ambient light module and a supplementary light module. The ambient light from environment is assembled by the ambient light module for generating a first light beam. A second light beam is provided by the supplementary light module disposed near the ground for easy maintaining and avoiding danger. The supplementary light module includes a sensor and a control circuit. The sensor senses the brightness of the first light beam passing through the signal displaying module and generates a photosensitive signal. The brightness of the second light beam is regulated by the control circuit according to the photosensitive signal. The brightness of the first light beam is supplied by regulating the brightness of the second light beam, so the signal displaying module has high-brightness light source and achieves the energy conservation.