Patents by Inventor Yigit Yilmaz

Yigit Yilmaz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Two-stage expanded beam optical coupling
    Patent number: 11886014
    Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.
    Type: Grant
    Filed: November 9, 2021
    Date of Patent: January 30, 2024
    Assignee: Imec VZW
    Inventors: Junwen He, Joris Van Campenhout, Geert Van Steenberge, Jeroen Missinne, Yigit Yilmaz, Do Won Kim, Douglas Charles La Tulipe
  • TWO-STAGE EXPANDED BEAM OPTICAL COUPLING
    Publication number: 20220146756
    Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.
    Type: Application
    Filed: November 9, 2021
    Publication date: May 12, 2022
    Inventors: Junwen He, Joris Van Campenhout, Geert Van Steenberge, Jeroen Missinne, Yigit Yilmaz, Do Won Kim, Douglas Charles La Tulipe