Patents by Inventor Yi-Hui Wang

Yi-Hui Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11957064
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: April 9, 2024
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 11955401
    Abstract: A package structure includes a semiconductor device and an adhesive pattern. The adhesive pattern surrounds the semiconductor device, wherein an angle ? is formed between a sidewall of the semiconductor device and a sidewall of the adhesive pattern, 0°<?<90° wherein the adhesive layer has a first opening misaligned with a corner of the semiconductor device closest to the first opening.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: April 9, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shih-Hui Wang, Der-Chyang Yeh, Shih-Peng Tai, Tsung-Shu Lin, Yi-Chung Huang
  • Patent number: 11928038
    Abstract: An approach for managing data set access based on data set relevance. The approach monitors data set access activities associated with a user. The approach detects access of a first data set by the user. The approach determines a group of data sets associated with the first data set based on a data set mapping associated with the user. The approach recalls one or more data sets of the group of data sets from a slower storage device to a faster storage device.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 12, 2024
    Assignee: International Business Machines Corporation
    Inventors: Jing Wen Chen, Zhao Yu Wang, Peng Hui Jiang, Jing BJ Ren, Yi Jie Ma, Wen Zhong Liu
  • Publication number: 20240081157
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: March 7, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Patent number: 8172486
    Abstract: An engineering-purpose netted vegetation blanket including a plurality of mesh units arrayed and interwoven into rows. The mesh units each have borders loop-knitted using threads to form a double-layer structure including an upper and a lower thread layer, and a plurality of curved threads that are so woven to locate between the upper and the lower thread layer and be sequentially arrayed and extended between two adjacent ones of the borders while protruding from a plane defined by the borders. The mesh units are so arrayed that the mesh units in any two adjacent rows are in staggered relation, such that a void is formed between any two adjacent mesh units.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: May 8, 2012
    Assignee: Seven States Enterprise Co., Ltd.
    Inventor: Yi-Hui Wang
  • Publication number: 20110064528
    Abstract: An engineering-purpose netted vegetation blanket includes a plurality of mesh units arrayed and interwoven into rows. The mesh units each have borders loop-knitted using thick threads to form a double-layer structure including an upper and a lower thick-thread layer, and a plurality of curved thin threads that are so woven to locate between the upper and the lower thick-thread layer and be sequentially arrayed and extended between two adjacent ones of the borders while protruding from a plane defined by the borders. The mesh units are so arrayed that the mesh units in any two adjacent rows are in staggered relation, such that a void is formed between any two adjacent mesh units. With these arrangements, the netted vegetation blanket is flexible and can be wound into roll, and helps in easy growth of grass and plants, preventing soil erosion and retaining compost to achieve the purpose of greening environment.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 17, 2011
    Inventor: Yi-Hui Wang