Patents by Inventor Yiliang Wu

Yiliang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240083994
    Abstract: Provided are a cell strain for producing a biosimilar drug of Ustekinumab and a production method therefor. Specifically, provided is a Chinese hamster ovary cell S cell strain. The cell strain expresses a full human monoclonal antibody directed against the P40 subunit shared by human IL-12 and human IL-23. The fully human monoclonal antibody directed against the P40 subunit shared by human IL-12 and human IL-23 is a biosimilar drug of Ustekinumab, which not only exhibits high consistency with Ustekinumab in pre-clinical research, but also passes pharmacokinetic bioequivalence and safety similarity evaluation in clinical research. The biosimilar drug of Ustekinumab is the first one that has entered clinical trials in China, is the only one that has completed the I stage clinical trial, and is also one of the biosimilar drugs of Ustekinumab, which has the fastest progress in new drug application in the world.
    Type: Application
    Filed: March 23, 2021
    Publication date: March 14, 2024
    Applicant: QYUNS THERAPEUTICS CO., LTD.
    Inventors: Zhengxue XU, Tao LI, Yin CHEN, Wenjun HUANG, Yi WANG, Huaiyao QIAO, Min FANG, Yiliang WU, Mengdan ZHANG
  • Publication number: 20230420164
    Abstract: A method for producing a surface finish on an electrically conductive substrate includes transferring an ink having a plurality of electrically conductive particles onto an area of a predetermined form and/or size on a surface of the electrically conductive substrate by gravure and/or flexo printing. The ink is heated to a temperature that is higher than a melting point of the electrically conductive particles to create a melt. The melt solidifies into the surface finish on the electrically conductive substrate.
    Type: Application
    Filed: June 23, 2023
    Publication date: December 28, 2023
    Applicants: TE Connectivity Germany GmbH, TE Connectivity Solutions GmbH
    Inventors: Shallu Soneja, Yiliang Wu, Gokce Gulsoy, Helge Schmidt, Soenke Sachs
  • Publication number: 20230399491
    Abstract: An bifunctional surface for antimicrobial applications is described. The bifunctional surface comprises a polymer composite comprising of a mixtures of a polymer, at least one antimicrobial additive and an optional hydrophobic additive.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 14, 2023
    Applicants: TE Connectivity Solutions GmbH, Tyco Electronics UK Ltd
    Inventors: Lei WANG, Yiliang WU, Ting GAO, Kaylie Jane SMITH
  • Publication number: 20230371520
    Abstract: An antimicrobial polymer composite is described. The antimicrobial polymer composite comprises a polymer, at least one antimicrobial additive, at least one flame retardant and at least one hydrophobic additive. An apparatus formed from an antimicrobial polymer composite is also described.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Applicants: TE Connectivity Solutions GmbH, Tyco Electronics UK Ltd
    Inventors: Lei WANG, Yiliang WU, Ting GAO, Kaylie Jane SMITH, Chun Kwan Tsang
  • Publication number: 20230374260
    Abstract: An antimicrobial product comprising an inner layer and an outer layer surrounding said inner layer wherein said inner layer is crosslinked. The outer layer includes at least one antimicrobial additive. A process of forming such antimicrobial product using extrusion is described.
    Type: Application
    Filed: May 23, 2022
    Publication date: November 23, 2023
    Applicants: TE Connectivity Solutions GmbH, Tyco Electronics UK Ltd
    Inventors: Kaylie Jane SMITH, Lei WANG, Yiliang WU, Ting GAO, Chun Kwan Tsang
  • Publication number: 20230295463
    Abstract: A method of manufacturing an electrical connector and an electrical connector with a layer or primer with a free radical initiator dissolved therein which is applied to the connector housing. An oil-bleeding liquid silicone is applied to the layer or primer. The layer or primer crosslinks with the oil-bleeding liquid silicone to adhere the oil-bleeding liquid silicone. The method includes applying a layer or primer with a free radical initiator dissolved therein to the housing; applying an oil-bleeding liquid silicone to the primer; and crosslinking the oil-bleeding liquid silicone to the layer or primer to adhere the oil-bleeding silicone.
    Type: Application
    Filed: January 18, 2023
    Publication date: September 21, 2023
    Inventors: Dejie Tao, Lei Wang, Yiliang Wu, Ting Gao, Zenggang Wu, Kaixuan Jiang
  • Patent number: 11509940
    Abstract: At least a computer program product comprising computing instructions stored on a non-transitory computer storage medium is provided. The computer program product is provided for efficiently encoding or decoding a video frame to smooth out or reduce visual distortions such as visual artifact between different video subsections encoded with different compression methods within a video frame. In addition, an improved memory storage is provided for applying a raster scan search strategy for finding a reference image for the input video frame by applying a shift-based input addressing scheme to write to the memory storage and a corresponding shift-based output addressing scheme to read from the memory storage.
    Type: Grant
    Filed: July 27, 2022
    Date of Patent: November 22, 2022
    Inventors: Yiliang Wu, Yendo Hu
  • Patent number: 11438631
    Abstract: At least a method and an apparatus are provided for efficiently encoding or decoding a video frame, and more particularly, to a method or an apparatus for efficiently providing an improved slice based pipelined coding/decoding with low latency. In particular, each video frame of a sequence of video frames are segmented into equal number of slices, with only one slice per video frame. In addition, the position of the only I slice changes sequentially for the each video frame of the sequence of video frames over time, forming a sawtooth pattern.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: September 6, 2022
    Inventors: Yendo Hu, Yiliang Wu
  • Patent number: 11425423
    Abstract: At least a method and an apparatus are provided for efficiently encoding or decoding a video frame to smooth out or reduce visual distortions such as visual artifact between different video subsections encoded with different compression methods within a video frame. In addition, an improved memory storage is provided for applying a raster scan search strategy for finding a reference image for the input video frame by applying a shift-based input addressing scheme to write to the memory storage and a corresponding shift-based output addressing scheme to read from the memory storage.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: August 23, 2022
    Inventors: Yendo Hu, Yiliang Wu
  • Publication number: 20220235271
    Abstract: A hybrid silicone composite for high temperature insulation applications is disclosed. The hybrid silicone composite is formed of a mixture of liquid high consistency silicone rubber and solid high consistency silicone rubber and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, over molded, compression molded, cast, laminated, extruded, calendered, adhered or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.
    Type: Application
    Filed: January 28, 2021
    Publication date: July 28, 2022
    Inventors: Dejie TAO, Yiliang WU, Lananh PHAM, Lei WANG, Ting GAO, Andre Martin DRESSEL, Frank SCHABERT
  • Patent number: 11359094
    Abstract: A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.
    Type: Grant
    Filed: January 8, 2020
    Date of Patent: June 14, 2022
    Assignees: TE CONNECTIVITY SERVICES GMBH, TE CONNECTIVITY GERMANY GMBH
    Inventors: Dejie Tao, Lei Wang, Yiliang Wu, Ting Gao, Andre Martin Dressel, Marco Wolf, Mei Dong
  • Publication number: 20220073631
    Abstract: Provided are antibodies and fragments against human interleukin-4 receptor alpha (hIL-4R?) and uses thereof. The antibodies and fragments preferably have heavy chain complementary determining regions as set forth in SEQ ID NOs: 1-3 or 14-16 and light chain complementary determining regions as set forth in SEQ ID NOs: 4-6 or 17-19.
    Type: Application
    Filed: December 25, 2019
    Publication date: March 10, 2022
    Applicant: QYUNS THERAPEUTICS CO., LTD.
    Inventors: Jiwan QIU, Wei CHEN, Zhihua QIU, Huaiyao QIAO, Yiliang WU
  • Publication number: 20210230264
    Abstract: Disclosed by the present invention are an anti-human interleukin 17A monoclonal antibody and an application thereof. The epitope of the monoclonal antibody binding to human interleukin 17A comprises 78th asparagine (N78). The antibody may be used to treat rheumatoid arthritis, psoriasis, multiple sclerosis, psoriatic arthritis, plaque psoriasis and/or ankylosing spondylitis.
    Type: Application
    Filed: May 17, 2018
    Publication date: July 29, 2021
    Applicant: JIANGSU QYUNS THERAPEUTICS CO., LTD.
    Inventors: Jiwan QIU, Zhihua QIU, Wei CHEN, Tao CHEN, Yong KONG, Yiliang WU
  • Publication number: 20210206971
    Abstract: A silicone composite for high temperature insulation applications is disclosed. The composite is formed of a silicone and a thermally decomposable inorganic filler which are compounded together. The compounded material is then injection molded, overmolded, compression molded, cast, laminated, extruded, or dispensed. When the silicone composite is exposed to a high temperature, it forms an inorganic composite and maintains its insulating properties and dimensional stability.
    Type: Application
    Filed: January 8, 2020
    Publication date: July 8, 2021
    Inventors: Dejie TAO, Lei WANG, Yiliang WU, Ting GAO, Andre Martin DRESSEL, Marco WOLF, Mei DONG
  • Publication number: 20210129181
    Abstract: A process for ultrasonically consolidating particulates in an ink onto a substrate at ambient temperatures in less than 5 seconds to form a completely dense, well adhered functional coatings is disclosed. The coating can be used for electronic components. The process is applicable to various substrates such as metals, plastics and ceramics.
    Type: Application
    Filed: November 5, 2019
    Publication date: May 6, 2021
    Inventors: Gokce GULSOY, Yiliang WU, Soenke SACHS, Christian Walter GREGOR, Shallu SONEJA, Helge SCHMIDT, Felix GREINER
  • Patent number: 10933675
    Abstract: A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: March 2, 2021
    Assignees: TE Connectivity Corporation, TE Connectivity Germany GmbH, Tyco Electronics (Shanghai) Co. Ltd.
    Inventors: Shallu Soneja, Gokce Gulsoy, Yiliang Wu, Xiao Zhou, Helge Schmidt, Soenke Sachs, Felix Greiner
  • Patent number: 10819008
    Abstract: A lighting device includes a base, a transparent cover, an electronic circuit mounted to the base, and an antenna. The electronic circuit is connectable with a light emitting element adapted to emit a light through the transparent cover and/or a light receiving element adapted to receive a light through the transparent cover. The antenna has a radiating patch following a contour of an inner surface of the transparent cover and connected to the electronic circuit.
    Type: Grant
    Filed: May 24, 2019
    Date of Patent: October 27, 2020
    Assignees: Tyco Electronics UK Ltd., TE Connectivity Nederland BV, TE Connectivity Corporation
    Inventors: Jonathan Catchpole, Wijnand Van Gils, Leonard Henry Radzilowski, Yiliang Wu, Luc Van Dommelen
  • Publication number: 20200294684
    Abstract: The present invention relates to an enhanced performance ultraconductive copper composite structure. The ultraconductive copper composite structure comprises at least two composite layers in which the interface between the two composite layers is sufficiently close to the surface of the ultraconductive copper composite so as to enhance the RF conductivity of the ultraconductive copper composite. The present invention also provides for method of forming such a ultraconductive copper composite structure.
    Type: Application
    Filed: March 12, 2020
    Publication date: September 17, 2020
    Inventors: Martin W. BAYES, Tobias BECKER, Marco WOLF, Shahrokh SANATI, Gokce GULSOY, Yiliang WU
  • Patent number: 10619067
    Abstract: Processes for preparing stabilized metal-containing nanoparticles comprising silver and/or a silver alloy composite by reacting a silver compound with a reducing agent comprising a hydrazine compound at a temperature between about 20° C. and about 60° C. The reaction being carried out by incrementally adding the silver compound or a mixture of the silver compound and a stabilizer to a solution comprising the reducing agent, a stabilizer, and a solvent. Conductive ink compositions containing stabilized metal-containing nanoparticles prepared by such processes.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: April 14, 2020
    Assignee: XEROX CORPORATION
    Inventors: Ping Liu, Mahya Mokhtari, Tila Tahmoures-Zadeh, Roger Gaynor, Yiliang Wu, Nan-Xing Hu
  • Publication number: 20200093002
    Abstract: A method of forming a conductive trace that includes steps of A) selecting a substrate, B) providing a jet dispenser, C) selecting a conductive ink, D) measuring the ink's viscosity (Vm), E) using Vm to select one of criteria (i)-(iv), F) applying the selected criteria to the dispenser, and G) applying the ink onto the substrate; and drying, curing, or annealing the ink to form the conductive trace having ?4B adhesion. The criteria (i)-(iv) include: (i) (Vm) >2.0 Pa-s, then (1) add a fluid—repeat D)-E) or (2) repeat C)-E); (ii) 2.0 Pa-s?Vm>0.35 Pa-s, use needle diameter ?3.0 mm & nozzle diameter (d) ?0.15 mm with ratio of nozzle length (L) to nozzle diameter (d) ?30; (iii) Vm<0.25 Pa-s, use a needle diameter ?1.0 mm and <3.0 mm & nozzle diameter ?0.15 mm with L/d ?30; or (iv) 0.25 Pa-s?Vm?0.35 Pa-s, use criteria (ii) or (iii).
    Type: Application
    Filed: February 15, 2018
    Publication date: March 19, 2020
    Applicant: TE Connectivity
    Inventors: Leonard H. Radzilowski, Miguel A. Morales, Michael A. Oar, Anthony B. Idem, Yiliang Wu, Barry C. Mathews