Abstract: An arrangement of a microlithographic optical imaging device includes first and supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device configured to measure the position and/or orientation of the optical element in relation to a reference in at least one degree of freedom and up to all six degrees of freedom in space. A creep compensation device compensates a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: An optical imaging arrangement includes an optical element and a piezoelectric device. The optical element includes an optical element body carrying an optical surface on a front side of the optical element body. The piezoelectric device includes a first electrode and at least one piezoelectric element. The first electrode is configured to cooperate with the at least one piezoelectric element and at least one second electrode, when the at least one second electrode is located on a rear side of the optical element body and the at least one piezoelectric element is located between the first electrode and the at least one second electrode, the rear side of the optical element body being opposite to the front side of the optical element body. The first electrode is located on the front side of the optical element body, and the at least one piezoelectric element is formed by at least one piezoelectric section of the optical element body.

Abstract: An arrangement of a microlithographic optical imaging device includes first and supporting structures. The first supporting structure supports an optical element of the imaging device. The first supporting structure supports the second supporting structure via supporting spring devices of a vibration decoupling device. The supporting spring devices act kinematically parallel to one another between the first and second supporting structures. Each supporting spring device defines a supporting force direction and a supporting length along the supporting force direction. The second supporting structure supports a measuring device configured to measure the position and/or orientation of the optical element in relation to a reference in at least one degree of freedom and up to all six degrees of freedom in space. A creep compensation device compensates a change in a static relative situation between the first and second supporting structures in at least one correction degree of freedom.

Abstract: An optical imaging arrangement includes an optical element and a piezoelectric device. The optical element includes an optical element body carrying an optical surface on a front side of the optical element body. The piezoelectric device includes a first electrode and at least one piezoelectric element. The first electrode is configured to cooperate with the at least one piezoelectric element and at least one second electrode, when the at least one second electrode is located on a rear side of the optical element body and the at least one piezoelectric element is located between the first electrode and the at least one second electrode, the rear side of the optical element body being opposite to the front side of the optical element body. The first electrode is located on the front side of the optical element body, and the at least one piezoelectric element is formed by at least one piezoelectric section of the optical element body.

Abstract: An optical imaging arrangement includes an optical element and a piezoelectric device. The optical element includes an optical element body carrying an optical surface on a front side of the optical element body. The piezoelectric device includes a first electrode and at least one piezoelectric element. The first electrode is configured to cooperate with the at least one piezoelectric element and at least one second electrode, when the at least one second electrode is located on a rear side of the optical element body and the at least one piezoelectric element is located between the first electrode and the at least one second electrode, the rear side of the optical element body being opposite to the front side of the optical element body. The first electrode is located on the front side of the optical element body, and the at least one piezoelectric element is formed by at least one piezoelectric section of the optical element body.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: An optical module includes: a first holding device with a circumference extending in a first circumferential direction; and a plurality of first supporting devices configured to support a first optical element, the first supporting devices being fixed at the circumference of the first holding device. Along the first circumferential direction, at least one of the first supporting devices is located in a non-equidistant manner between two neighboring first supporting devices. The optical module is configured to be used in a microlithography objective.

Abstract: The disclosure pertains to an optical apparatus, in particular for microlithography, that includes an optical module, a support structure and a connection apparatus. The connection apparatus includes at least one connection unit which includes a first connector part and a second connector part. The first connector part is connected to the optical module, and the second connector part is connected to the support structure.

Abstract: Disclosed is an optical module for a lens, especially a microlithographic apparatus, comprising a first holding device (2) with an inner circumference (2.1) that extends in a first circumferential direction (2.2), and at least one first supporting device (3.1) which is fastened to the inner circumference (2.1) of said first holding device (2) and is used for supporting a first optical element (5.1), an annular circumferential first assembly space (3.18) being defined by displacing the first supporting device (3.1) once in a revolving manner along the first circumferential direction (2.2). At least one second supporting device (3.2) which is fixed to the inner circumference (2.1) of the first holding device (2) is provided for supporting a second optical element (5.2), an annular circumferential second assembly space (3.28) being defined by displacing the second supporting device (3.2) once in a revolving manner along the first circumferential direction (2.2). The first assembly space (3.

Abstract: The invention relates to an optical imaging device, in particular an objective 1 for microlithography in the field of EUVL for producing semiconductor components, having a beam path 2, a plurality of optical elements 3 and a diaphragm device 7 with an adjustable diaphragm opening shape. The diaphragm device has a diaphragm store 7a, 7b with a plurality of different diaphragm openings 6 with fixed shapes in each case, which can be introduced into the beam path 2.

Abstract: A semiconductor lithography projection exposure apparatus includes a projection lens which includes a manipulator. The manipulator includes an optical element; a base frame; a sensor frame arranged on the base frame; and a sensor arranged on the sensor frame. The manipulator is configured to correct wavefront aberrations of used optical radiation that pass through the optical element during the operation of the projection lens. The manipulator is arranged directly after an object plane of the apparatus along a path of the used optical radiation. The sensor is configured to measure a deformation or a deflection of the optical element. A coefficient of thermal expansion of the sensor frame is within 16 ppm/K of a coefficient of thermal expansion of the base frame.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: A vibration-compensated optical system for a lithography apparatus includes an optical element, a carrying element, an actuator for actuating the optical element relative to the carrying element, a first elastic element which directly couples the optical element to the carrying element, a reaction mass, and a second elastic element. The actuator couples the optical element to the reaction mass. The second elastic element directly couples the reaction mass to the carrying element. For a mass (m1) of the optical element, a stiffness (k1) of the first elastic element, a mass (m2) of the reaction mass and a stiffness (k2) of the second elastic element the following holds true: m 1 m 2 = k 1 k 2 .

Abstract: An optical apparatus includes an interchange mechanism and an optical assembly of an illumination system or a projection objective. At least one of the plurality of optical elements of the optical assembly is selected from among a plurality of ones selectable from the interchange mechanism which facilitates exchange of one for another in the beam path. To reduce transmission of vibration from the interchange mechanism to the optical assembly, the interchange mechanism is mounted on a structure which is substantially dynamically decoupled from the housing, and a selected selectable optical element is located at an operating position at which it is separate from the interchange mechanism.

Abstract: Microlithographic illumination system includes individually drivable elements to variably illuminate a pupil surface of the system. Each element deviates an incident light beam based on a control signal applied to the element. The system also includes an instrument to provide a measurement signal, and a model-based state estimator configured to compute, for each element, an estimated state vector based on the measurement signal. The estimated state vector represents: a deviation of a light beam caused by the element; and a time derivative of the deviation. The illumination system further includes a regulator configured to receive, for each element: a) the estimated state vector; and b) target values for: i) the deviation of the light beam caused by the deviating element; and ii) the time derivative of the deviation.

Abstract: A projection lens of an EUV-lithographic projection exposure system with at least two reflective optical elements each comprising a body and a reflective surface for projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light, wherein the bodies of at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at respective zero cross temperatures, and wherein the absolute value of the difference between the zero cross temperatures is more than 6K.

Abstract: An optical imaging arrangement includes an optical element and a piezoelectric device. The optical element includes an optical element body carrying an optical surface on a front side of the optical element body. The piezoelectric device includes a first electrode and at least one piezoelectric element. The first electrode is configured to cooperate with the at least one piezoelectric element and at least one second electrode, when the at least one second electrode is located on a rear side of the optical element body and the at least one piezoelectric element is located between the first electrode and the at least one second electrode, the rear side of the optical element body being opposite to the front side of the optical element body. The first electrode is located on the front side of the optical element body, and the at least one piezoelectric element is formed by at least one piezoelectric section of the optical element body.

Abstract: An optical module is configured to be used in a microlithography objective. The optical module includes a first holding device with a circumference extending in a first circumferential direction and a first supporting device configured to support a first optical element. The first supporting device is fixed at the circumference of the first holding device. The optical module also includes a plurality of second supporting devices configured to support a second optical element, the second supporting devices being fixed at the circumference of the first holding device. The first supporting device does not contact the second supporting devices. The first optical element is separate from the second optical element. Along the first circumferential direction, the first supporting device is located in a non-equidistant manner between two neighboring second supporting devices.