Patents by Inventor Yin Bong

Yin Bong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190070239
    Abstract: An edible herbal formulation which raises the alkalinity of the human body in a short period of time is disclosed. The major ingredient in the formulation is Camptotheca. Additional ingredients that may be included are poria cocos, astragalus membranacaus, ostrea vivularis gould, prunella vulgaris, bombyx mori and phellodendron amurense Rupr. While the herbal formulation may be a mixture containing Camptotheca and all or some of the above ingredients, it is most preferred that the herbal formulation include the three ingredients of Camptotheca, poria cocos and astragalus membranacaus.
    Type: Application
    Filed: March 3, 2017
    Publication date: March 7, 2019
    Applicant: Cheng Lab & Company, LLC
    Inventor: Yin Bong Cheng
  • Publication number: 20060097346
    Abstract: A structure for high quality factor inductor operation formed on a semiconductor chip is disclosed. The structure comprises a plurality of pillars displaced from the semiconductor chip for forming an inductor. The plurality of pillar is arranged in an electrically inductive formation and at least one of the plurality of pillars is electrically coupled to the semiconductor chip, wherein each of the plurality of pillars abuts at least one and no more than two adjacent pillars and is electrically communicable with the at least one and no more than two adjacent pillars.
    Type: Application
    Filed: November 10, 2004
    Publication date: May 11, 2006
    Applicant: Advanpack Solutions Pte Ltd
    Inventor: Yin Bong
  • Publication number: 20050167797
    Abstract: Wireless devices use protruding antennas for transmitting and receiving data signals. These protruding antennas govern the size and dimensions of these wireless devices. Perpetual reduction in the size of these wireless devices has resulted in an increasing need and desire to eliminate the protruding antennas. Solutions such as reducing the protruding antenna to a stub or using retractable antennas have limitations. The antenna stub sacrifices performance for size reduction. Additionally, the retractable antennas are usually physically separated from the integrated circuit. Electrical connectors interconnecting the external antenna and the integrated circuit can mechanically fail due to connector flexure.
    Type: Application
    Filed: January 29, 2004
    Publication date: August 4, 2005
    Applicant: Advanpack Solutions Pte Ltd
    Inventor: Yin Bong
  • Publication number: 20050077624
    Abstract: A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
    Type: Application
    Filed: October 9, 2003
    Publication date: April 14, 2005
    Inventors: Kim Tan, Ch'ng Shen, Rosemarie Tagapulot, Yin Bong, Ma Htoi, Lim Soon, Liu Shikui, Balasubramanian Sivagnanam