Patents by Inventor Yin-Chao Huang
Yin-Chao Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8571229Abstract: A semiconductor device includes at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively connected between the plurality of bond pads and the plurality of conductive components. The plurality of bond pads respectively correspond to a plurality of signals, and include a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal. The plurality of conductive components include a first conductive component and a second conductive component. The first conductive component is bond-wired to the first bond pad, and the second conductive component is bond-wired to the second bond pad. The first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the first signal is asserted when the second signal is asserted.Type: GrantFiled: June 3, 2009Date of Patent: October 29, 2013Assignee: Mediatek Inc.Inventors: Chien-Sheng Chao, Tse-Chi Lin, Yin-Chao Huang
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Patent number: 8361757Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.Type: GrantFiled: September 23, 2011Date of Patent: January 29, 2013Assignee: Mediatek Inc.Inventors: Yin-Chao Huang, Shi-Bai Chen, Kang-Wei Hsueh, Hung-Sung Li
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Publication number: 20120009734Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.Type: ApplicationFiled: September 23, 2011Publication date: January 12, 2012Inventors: Yin-Chao Huang, Shi-Bai Chen, Kang-Wei Hsueh, Hung-Sung Li
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Patent number: 8049321Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.Type: GrantFiled: March 2, 2009Date of Patent: November 1, 2011Assignee: Mediatek Inc.Inventors: Yin-Chao Huang, Shi-Bai Chen, Kang-Wei Hsueh, Hung-Sung Li
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Publication number: 20110108974Abstract: A packaged integrated circuit is provided comprising a first semiconductor die, a second semiconductor die, and a bonding wire. The first semiconductor die has a first internal bonding pad electrically connected to the package. The second semiconductor die has a second internal bonding pad located in an internal portion of the second semiconductor die. The second internal bonding pad is electrically connected to the first internal bonding pad through the first bonding wire.Type: ApplicationFiled: November 6, 2009Publication date: May 12, 2011Applicant: MEDIATEK INC.Inventors: Yin-Chao Huang, Shi-Bai Chen
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Patent number: 7880540Abstract: An amplifying system includes an amplifier operated according to a supply voltage, and a detector coupled to the amplifier for generating a first control signal to the amplifier to disable an output stage of the amplifier when the supply voltage reaches a threshold.Type: GrantFiled: February 23, 2009Date of Patent: February 1, 2011Assignee: Mediatek Inc.Inventors: Chun-Chih Hou, Yin-Chao Huang
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Publication number: 20100308447Abstract: A semiconductor device includes at least a die carried by a substrate, a plurality of bond pads disposed on the die, a plurality of conductive components, and a plurality of bond wires respectively connected between the plurality of bond pads and the plurality of conductive components. The plurality of bond pads respectively correspond to a plurality of signals, and include a first bond pad configured for transmitting/receiving a first signal and a second bond pad configured for transmitting/receiving a second signal. The plurality of conductive components include a first conductive component and a second conductive component. The first conductive component is bond-wired to the first bond pad, and the second conductive component is bond-wired to the second bond pad. The first conductive component and the second conductive component are separated by at least a third conductive component of the plurality of conductive components, and the first signal is asserted when the second signal is asserted.Type: ApplicationFiled: June 3, 2009Publication date: December 9, 2010Inventors: Chien-Sheng Chao, Tse-Chi Lin, Yin-Chao Huang
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Publication number: 20100214023Abstract: An amplifying system includes an amplifier operated according to a supply voltage, and a detector coupled to the amplifier for generating a first control signal to the amplifier to disable an output stage of the amplifier when the supply voltage reaches a threshold.Type: ApplicationFiled: February 23, 2009Publication date: August 26, 2010Inventors: Chun-Chih Hou, Yin-Chao Huang
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Publication number: 20090294944Abstract: A semiconductor device assembly includes a first semiconductor die, a second semiconductor die, at least one semiconductor package component or another semiconductor die, a first conductive element and a second conductive element. The first semiconductor die includes at least one bonding pad. The second semiconductor die includes a bonding pad module. The first conductive element is coupled between the bonding pad module of the second semiconductor die and the bonding pad of the first semiconductor die, and the second conductive element is coupled between the bonding pad module of the second semiconductor die and the semiconductor package component or the another semiconductor die, wherein the first semiconductor die is coupled to the semiconductor package component or the another semiconductor die via the bonding pad and the bonding pad module and the first and second conductive elements.Type: ApplicationFiled: March 2, 2009Publication date: December 3, 2009Inventors: Yin-Chao Huang, Shi-Bai Chen, Kang-Wei Hsueh, Hung-Sung Li