Abstract: An image sensor unit is disclosed that includes an array of image sensing pixels, arranged in a plurality of rows and a plurality of columns, wherein each pixel is individually addressable. Each row of pixels is controlled via a row control in communication with the row of pixels in the array via a row addressing line, and capable of selectively addressing one or more of the plurality of rows. Each column of pixels is controlled by a column control in communication with each column of pixels in the array via a column addressing line, and capable of selectively addressing one or more of the plurality of columns. A unit controller is configured to specify selective readout of one or more pixel readout signals by instructing the row and column control to address one or more specific rows and columns of the array.

Abstract: Embodiments of the present disclosure relate to automated validation of medical data. Some embodiments of the present disclosure provide a method for medical data validation. The method comprises obtaining target medical data generated in a medical test and obtaining a machine learning model for validating medical data. The machine learning model represents an association between the medical data and validation results, the validation results indicating information about predetermined actions to be performed on the medical data. The method further comprises determining a target validation result for the target medical data by applying the target medical data to the machine learning model, the target validation result indicating information about a target action selected from the predetermined actions to be performed on the target medical data. Through the solution, it is possible to achieve automated medical data validation with high accuracy and efficiency as well as reduced manual efforts.

Abstract: A multipart connector for electrical connection to a conductor to convey AC power having a frequency greater than 60 Hz. The connector includes a plurality of metal plates. Each metal plate has opposing planar surfaces and includes a pair of legs separated by a space. A plurality of insulation layers adjoin the planar surfaces of the metal plates, respectively. The insulation layers include a pair of legs separated by a space. The metal plates and the insulation layers are arranged in a stack such that the spaces of the metal plates and the insulation layers are aligned to form a groove extending through the stack. The conductor is disposed in the groove.

Abstract: Half Quad Photodiode (QPD) for improving QPD channel imbalance. In one embodiment, an image sensor includes a plurality of pixels arranged in rows and columns of a pixel array that is disposed in a semiconductor material. Each pixel includes a plurality of subpixels. Each subpixel comprises a plurality of first photodiodes, a plurality of second photodiodes and a plurality of third photodiodes. The plurality of pixels are configured to receive incoming light through an illuminated surface of the semiconductor material. A plurality of small microlenses are individually distributed over individual first photodiodes and individual second photodiodes of each subpixel. A plurality of large microlenses are each distributed over a plurality of third photodiodes of each subpixel. A diameter of the small microlenses is smaller than a diameter of the large microlenses.

Abstract: The invention disclose a pixel in an image sensor capable of detecting infrared light and associated fabrication method. The image sensor includes a semiconductor substrate has a first photodiode and a second photodiode adjacent to the first photodiode. A planarized dielectric layer having a recessed region is disposed on a first side of the semiconductor substrate. A first color filter disposed on the planarized dielectric layer aligned with the first photodiode and configured to transmit light of a first wavelength range. A second color filter disposed in the recessed region and on the planarized dielectric layer. The second color filter is aligned with the second photodiode, and configured to transmit light of a second wavelength range that is different from the first wavelength range. A first depth-wise thickness of the first color filter is less than a second depth-wise thickness of the second color filter.

Abstract: A stacked image sensor includes a signal-processing circuitry layer, a pixel-array substrate, a heat-transport layer, and a thermal via. The signal-processing circuitry layer includes a conductive pad exposed on a circuitry-layer bottom surface of the signal-processing circuitry layer. The pixel-array substrate includes a pixel array and is disposed on a circuitry-layer top surface of the signal-processing circuitry layer. The circuitry-layer top surface is between the circuitry-layer bottom surface and the pixel-array substrate. The heat-transport layer is located between the signal-processing circuitry layer and the pixel-array substrate. The thermal via thermally couples the heat-transport layer to the conductive pad.

Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.

Abstract: A mechanism is provided for enhancing security access to a data processing system. Responsive to authenticating a first factor of the multi-factor authentication by matching a scanned fingerprint/thumbprint of a user to at least one previously scanned fingerprint/thumbprint in a set of previously scanned fingerprints/thumbprints, a determination is made as to whether a touch pressure level exerted by the user on a touch pressure sensor associated with the data processing system matches at least one previously stored touch pressure level in a set of previously stored touch pressure levels. Responsive to matching the touch pressure level exerted by the user to a previously stored touch pressure level in the set of previously stored touch pressure levels, a second factor of the multi-factor authentication is authenticated. Access is then granted for the user to the data processing system.

Abstract: An image sensor includes a photodiode array and a color filter array optically aligned with the photodiode array. The photodiode array includes a plurality of photodiodes disposed within respective portions of a semiconductor material. The color filter array includes a plurality of color filters arranged to form a plurality of tiled minimal repeating units. Each minimal repeating unit includes at least a first color filter with a red spectral photoresponse, a second color filter with a yellow spectral photoresponse, and a third color filter with a panchromatic spectral photoresponse.

Abstract: A semiconductor device that includes a metal pad buried in the semiconductor substrate that is electrically connected to a metal interconnection structure and electrically isolated from the semiconductor substrate. The semiconductor substrate forms an opening that extends from a back surface to the metal pad. A method for manufacturing a semiconductor device with buried metal pad including depositing, in a recess of a semiconductor substrate, a metal pad, isolating the pad from the substrate, electrically connecting the metal pad to the frontside of the substrate and connecting the metal pad to the backside of the substrate with an opening. A method for stabilizing through-silicon via connections in semiconductor device including electrically coupling a metal interconnection structure to a metal pad submerged in a semiconductor substrate and forming a through-silicon via into the semiconductor substrate that contacts the metal pad.

Abstract: A multipart connector for electrical connection to a conductor to convey AC power having a frequency greater than 60 Hz. The connector includes a plurality of metal plates. Each metal plate has opposing planar surfaces and includes a pair of legs separated by a space. A plurality of insulation layers adjoin the planar surfaces of the metal plates, respectively. The insulation layers include a pair of legs separated by a space. The metal plates and the insulation layers are arranged in a stack such that the spaces of the metal plates and the insulation layers are aligned to form a groove extending through the stack. The conductor is disposed in the groove.

Abstract: A semiconductor device that includes a metal pad buried in the semiconductor substrate that is electrically connected to a metal interconnection structure and electrically isolated from the semiconductor substrate. The semiconductor substrate forms an opening that extends from a back surface to the metal pad. A method for manufacturing a semiconductor device with buried metal pad including depositing, in a recess of a semiconductor substrate, a metal pad, isolating the pad from the substrate, electrically connecting the metal pad to the frontside of the substrate and connecting the metal pad to the backside of the substrate with an opening. A method for stabilizing through-silicon via connections in semiconductor device including electrically coupling a metal interconnection structure to a metal pad submerged in a semiconductor substrate and forming a through-silicon via into the semiconductor substrate that contacts the metal pad.

Abstract: A computer-implemented method includes determining that a first time point in a video has been reached during playback of the video. A dynamic relationship graph is displayed in association with the first time point, where the dynamic relationship graph illustrates one or more relationships among two or more characters in the video, responsive to the first time point being reached. The relationship graph includes two or more nodes and one or more edges. The nodes include a respective node representing each character of the two or more characters in the video, and the edges include a respective edge representing each relationship of the one or more relationships among the characters. It is determined that a second time point is reached in the video. The dynamic relationship graph is updated to represent a change in the one or more relationships between the first time point and the second time point.

Abstract: An image sensor pixel array comprises a plurality of image pixel units to gather image information and a plurality of phase detection auto-focus (PDAF) pixel units to gather phase information. Each of the PDAF pixel units includes two of first image sensor pixels covered by two micro-lenses, respectively. Each of the image pixel units includes four of second image sensor pixels adjacent to each other, wherein each of the second image sensor pixels is covered by an individual micro-lens. A coating layer is disposed on the micro-lenses and forms a flattened surface across the whole image sensor pixel array. A PDAF micro-lens is formed on the coating layer to cover the first image sensor pixels.

Abstract: An image sensor includes a photodiode array and a color filter array optically aligned with the photodiode array. The photodiode array includes a plurality of photodiodes disposed within respective portions of a semiconductor material. The color filter array includes a plurality of color filters arranged to form a plurality of tiled minimal repeating units. Each minimal repeating unit includes at least a first color filter with a red spectral photoresponse, a second color filter with a yellow spectral photoresponse, and a third color filter with a panchromatic spectral photoresponse.

Abstract: A flip-chip sample imaging device with self-aligning lid includes an image sensor chip, a fan-out substrate, and a lid. The image sensor chip includes (a) a pixel array sensitive to light incident on a first side of the image sensor chip and (b) first electrical contacts disposed on the first side and electrically connected to the pixel array. The fan-out substrate is disposed on the first side, is electrically connected to the first electrical contacts, forms an aperture over the pixel array to partly define a sample chamber over the pixel array, and forms a first surface facing away from the first side. The lid is disposed on the first surface of the fan-out substrate, facing away from the first side, to further define the chamber. The lid includes an inner portion protruding into the aperture to align the lid relative to the fan-out substrate.

Abstract: An image sensor unit is disclosed that includes an array of image sensing pixels, arranged in a plurality of rows and a plurality of columns, wherein each pixel is individually addressable. Each row of pixels is controlled via a row control in communication with the row of pixels in the array via a row addressing line, and capable of selectively addressing one or more of the plurality of rows. Each column of pixels is controlled by a column control in communication with each column of pixels in the array via a column addressing line, and capable of selectively addressing one or more of the plurality of columns. A unit controller is configured to specify selective readout of one or more pixel readout signals by instructing the row and column control to address one or more specific rows and columns of the array.

Abstract: An image sensor with embedded wells for accommodating light emitters includes a semiconductor substrate including an array of doped sensing regions respectively corresponding to an array of photosensitive pixels of the image sensor. The semiconductor substrate forms an array of wells. Each well is aligned with a respective doped sensing region to facilitate detection, by the photosensitive pixel that includes said respective doped sensing region, of light emitted to the photosensitive pixel by a light emitter disposed in the well. The image sensor further includes, between adjacent doped sensing regions, a light-blocking barrier to reduce propagation of light to the doped sensing-region of each photosensitive pixel from wells not aligned therewith.

Abstract: A method, computer system, and computer program product for processing a media content is provided. The present invention may include receiving a request from a user to render a media content, identifying one or more features of the media content, obtaining a profile of the user, and generating a progressive rendering plan for the media content, based on the user's profile and the one or more features of the media content.

Abstract: Techniques are described herein for transmitting subgroup messages and displaying such subgroup messages within a group-based message interface. The subgroup message includes both a message intended for the subgroup and a subgroup command indicating that the message is sent to a subgroup of a group participating in a group-based message interface. The subgroup members are then determined from the subgroup command and the subgroup message is displayed to the subgroup members.