Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract: An electronic device having a heat-dissipating structure for a socket is disclosed. The electronic device comprises a case, a plurality of electronic components disposed in the case, an airflow inlet disposed at a first side of the case, a socket disposed at a second side of the case, wherein the second side is opposite to the first side and the electronic components are disposed between the first side and the second side, and an airflow directing plate disposed between the case and the electronic components and forming an airflow channel with the case for directing a portion of air at the airflow inlet to the socket through the airflow channel so as to dissipate heat of the socket. Through the design of the present invention, the heat of the socket of the electronic device can be dissipated efficiently to conform to the safety standard of the socket temperature.

Abstract: A heat sink assembly for use in an electrical apparatus having a printed circuit board having an electromagnetic device is disclosed. The heat sink assembly comprises a first heat-dissipating piece disposed between the electromagnetic device and the printed circuit board for transferring the heat generated from the electromagnetic device away the printed circuit board, and a second heat-dissipating piece disposed on the edge of the printed circuit board and contacting with the first heat-dissipating piece for transferring the heat from the first heat-dissipating piece away the printed circuit board.

Abstract: A temperature-homogenizing device for uniformly dissipating heat generated from electronic components in an electronic device to a housing of the electronic device includes a first and a second higher thermally conductive layers and a first lower thermally conductive layer. The first lower thermally conductive layer is disposed between the first and the second higher thermally conductive layers, and made of a material or a medium having a lower thermal conductivity than each of the first and the second higher thermally conductive layers. By means of this temperature-homogenizing device, the heat is homogeneously distributed throughout the first and the second higher thermally conductive layers at a higher thermal conduction rate and transferred through the first lower thermally conductive layer at a lower thermal conduction rate so as to maintain homogeneous temperature distribution on the housing.

Abstract: A heat sink assembly for use in an electrical apparatus having a printed circuit board having an electromagnetic device is disclosed. The heat sink assembly comprises a first heat-dissipating piece disposed between the electromagnetic device and the printed circuit board for transferring the heat generated from the electromagnetic device away the printed circuit board, and a second heat-dissipating piece disposed on the edge of the printed circuit board and contacting with the first heat-dissipating piece for transferring the heat from the first heat-dissipating piece away the printed circuit board.

Abstract: A transformer with an associated heat-dissipating plastic element is provided. The transformer includes a hollow main body, a core, a coil and a heat-dissipating plastic element. The core is installed inside the hollow main body while the coil wraps around the core. The heat-dissipating plastic element is also installed inside the hollow main body. The heat-dissipating plastic element encloses the core and the coil. Alternatively, the heat-dissipating plastic element encloses the hollow main body, the core and the coil so that heat generated by the coil may be directly conducted away to the exterior through the heat-dissipating plastic element.

Abstract: A transformer with an associated heat-dissipating plastic element is provided. The transformer includes a hollow main body, a core, a coil and a heat-dissipating plastic element. The core is installed inside the hollow main body while the coil wraps around the core. The heat-dissipating plastic element is also installed inside the hollow main body. The heat-dissipating plastic element encloses the core and the coil. Alternatively, the heat-dissipating plastic element encloses the hollow main body, the core and the coil so that heat generated by the coil may be directly conducted away to the exterior through the heat-dissipating plastic element.

Abstract: A method for determining a plurality of fluid flow characteristic curves of a heat-dissipating system, wherein each fluid flow characteristic curve is a relationship curve of one of an air pressure and an air flow and the air pressure and a rotating speed of the heat-dissipating system.

Abstract: A method for determining a plurality of fluid flow characteristic curves of a heat-dissipating system, wherein each fluid flow characteristic curve is a relationship curve of one of an air pressure and an air flow and the air pressure and a rotating speed of the heat-dissipating system.