Abstract: Aspects of the methods, apparatus, non-transitory computer readable medium, and systems include obtaining a noise map and a global image code encoded from an original image and representing semantic content of the original image; generating a plurality of image patches based on the noise map and the global image code using a diffusion model; and combining the plurality of image patches to produce an output image including the semantic content.

Abstract: A circuit board includes a flexible circuit board layer, a rigid circuit board layer, a chip connection portion, and a bending portion. The chip connection portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion is connected to the chip connection portion in an invertible manner, after the bending portion is inverted to the rear side of the chip connection portion, a part of the flexible circuit board layer of the bending portion and a part of the flexible circuit board layer of the chip connection portion are arranged face-to-face.

Abstract: The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area.

Abstract: A circuit board includes a flexible circuit board layer, a rigid circuit board layer, a chip connection portion, and a bending portion. The chip connection portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion includes at least part of the flexible circuit board layer and at least part of the rigid circuit board layer overlapping the flexible circuit board layer. The bending portion is connected to the chip connection portion in an invertible manner, after the bending portion is inverted to the rear side of the chip connection portion, a part of the flexible circuit board layer of the bending portion and a part of the flexible circuit board layer of the chip connection portion are arranged face-to-face.

Abstract: The technology described herein is directed to engineered endonucleases whose activity is restricted to certain phases of the cell cycle. Provided herein are compositions and methods relating to such engineered endonucleases.