Abstract: A wafer carrier comprises a supporting body having an opening therein, wherein said opening in said supporting body has a concave sidewall and a bottom surface in said supporting body which is curved in cross section; a plurality of vertical supporting rods configured to support and contact a wafer received in said opening and to displace said wafer from the bottom surface of the opening in said supporting body; wherein one of said supporting rods has an end for contacting and supporting said wafer; and wherein when viewing from a top view of the wafer carrier, one of said supporting rods has a base lining on the concave sidewall of said opening in said supporting body, a first concave side opposite to the base and two second concave sides connecting the base and the first concave side.

Abstract: A wafer carrier comprises a supporting body having a height and comprising an opening, wherein a bottom surface of the opening is a curved surface; and a plurality of supporting rods formed around a periphery of the supporting body. Another aspect of the present application provides a manufacturing method of the wafer carrier. The method comprises forming an epitaxial layer on a growth substrate to form a wafer structure; measuring a curvature radius of the wafer structure; and providing the wafer carrier described above in accordance with the curvature radius of the wafer structure.