Patents by Inventor Ying-Chen Sun

Ying-Chen Sun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe with die pad
    Patent number: 7242077
    Abstract: A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
    Type: Grant
    Filed: March 11, 2005
    Date of Patent: July 10, 2007
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Kang-Wei Ma, Shu-Chen Yang, Ying-Chen Sun, Li-Ping Chen
  • Leadframe with die pad
    Publication number: 20050199986
    Abstract: A leadframe includes a die pad, a plurality of tie bars, a plurality of metal extrusions and a plurality of leads. The leads are arranged around the die pad. The tie bars are connected to the corners of the die pad, and the metal extrusions are connected to the sides of the die pad but separated from the tie bars. Each metal extrusion has a locking hole and a bonding surface, which is higher than the die pad. The metal extrusions are configured for improving ground connections by wire-bonding. When a bottom surface of the die pad is exposed from an encapsulant for a semiconductor package, the metal extrusions help to secure the die pad without stress transmission.
    Type: Application
    Filed: March 11, 2005
    Publication date: September 15, 2005
    Inventors: Kang-Wei Ma, Shu-Chen Yang, Ying-Chen Sun, Li-Ping Chen