Patents by Inventor Ying-Chi Peng

Ying-Chi Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9184077
    Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: November 10, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Sung-Chun Yang, Ying-Chi Peng, Yao-Pin Yang
  • Publication number: 20150090630
    Abstract: Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element.
    Type: Application
    Filed: September 30, 2013
    Publication date: April 2, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Sung-Chun YANG, Ying-Chi PENG, Yao-Pin YANG
  • Patent number: 8857619
    Abstract: Embodiments of mechanisms of a wafer pod including a pod door are provided. The pod lock includes a rotating element pivoted on the pod housing and having an anchor element disposed on the rotating body. The pod lock further includes a locking element including a locking body slidably disposed on the pod housing. The pod lock also includes an elastic element disposed on the locking body, and adjacent to the anchor element. When the rotating element is rotated, the rotating element pushes the locking element to move, and the elastic element applies an elastic force on the anchor element.
    Type: Grant
    Filed: September 30, 2013
    Date of Patent: October 14, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Sung-Chun Yang, Ying-Chi Peng, Yao-Pin Yang