Patents by Inventor Ying-Ching Chen
Ying-Ching Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990351Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.Type: GrantFiled: March 26, 2021Date of Patent: May 21, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
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Patent number: 11979980Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.Type: GrantFiled: August 19, 2021Date of Patent: May 7, 2024Assignee: UNIFLEX Technology Inc.Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
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Publication number: 20240128211Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.Type: ApplicationFiled: April 27, 2023Publication date: April 18, 2024Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
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Publication number: 20240101784Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.Type: ApplicationFiled: September 5, 2023Publication date: March 28, 2024Inventors: Chien-Hsin Wu, Ying-Chi Huang, Ying-Feng Lin, Wen-Chang Chen, Ho-Ching Huang, Ru-Jong Jeng
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Publication number: 20240096732Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.Type: ApplicationFiled: January 13, 2023Publication date: March 21, 2024Inventors: Chih-Hao CHEN, Li-Hui CHENG, Ying-Ching SHIH
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Patent number: 11937370Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.Type: GrantFiled: September 1, 2021Date of Patent: March 19, 2024Assignee: UNIFLEX Technology Inc.Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
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Publication number: 20240071847Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Yi-Huan Liao, Ping-Yin Hsieh, Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
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Publication number: 20240071849Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Inventors: Jian-You Chen, Kuan-Yu Huang, Li-Chung Kuo, Chen-Hsuan Tsai, Kung-Chen Yeh, Hsien-Ju Tsou, Ying-Ching Shih, Szu-Wei Lu
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Publication number: 20130126714Abstract: A light energy testing device includes a light source emitting parallel light, a Fresnel lens concentrating the parallel light, a fiber array consisting of a plurality of optical fibers, and an energy detecting device. Each fiber includes a light incident and emitting surface. The light incident surfaces are coplanar to define a light receiving surface. The light emitting surfaces cooperatively define a light transmitting surface. The energy detecting device includes a plurality of sensor units optically coupled with the light transmitting surface and a testing device connected to the sensor units. The parallel light is focused by the Fresnel lens to irradiate the light receiving surface. The sensor units generate energy signals according to the light from the light transmitting surface. The energy detecting device calculates a light energy distribution according to the energy signals.Type: ApplicationFiled: November 21, 2011Publication date: May 23, 2013Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: YU-SHU CHEN, KUO-FENG CHIANG, YING-CHING CHEN, ZHENG-JAY HUANG, KUO-MANG LO, CHIEN-TING LU
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Patent number: 8328394Abstract: An LED bulb includes a heat sink, a circuit, an LED, and a driving module. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The circuit is formed on a second face of the base, and the LED is disposed on the second face of the base and electrically connected with the circuit. The LED bulb further includes a first lead and a second lead electrically connecting with the circuit and extending through the base. The driving module includes a first electrode, and a second electrode electrically insulated from the first electrode and surrounding the first electrode. The first electrode of the driving circuit contacts with the first lead, and the second electrode of the driving circuit contacts with the second lead.Type: GrantFiled: October 10, 2010Date of Patent: December 11, 2012Assignee: Foxsemicon Integrated Technology, Inc.Inventors: Ying-Chieh Lu, Kuo-Feng Chiang, Zheng-Jay Huang, Kuo-Mang Lo, Chien-Ting Lu, Ying-Ching Chen
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Patent number: 8246215Abstract: An LED bulb includes a connector for electrically connecting with a power supply, a heat sink disposed on the connector, and a plurality of LEDs mounted the heat sink. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The LEDs are attached on a second face of the base. The base defines a plurality of through tunnels extending through the base from the first face to the second face of the base.Type: GrantFiled: June 8, 2010Date of Patent: August 21, 2012Assignee: Foxsemicon Integrated Technology, Inc.Inventors: Ying-Chieh Lu, Kuo-Feng Chiang, Zheng-Jay Huang, Ying-Ching Chen
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Publication number: 20120085389Abstract: A light concentrator assembly includes a Fresnel lens, a plano-concave lens, and a CPC. The CPC is aligned with the Fresnel lens and the plano-concave lens. The Fresnel lens unit is configured for converging parallel light transmitted the Fresnel lens. The plano-concave lens is configured for further concentrating the light from the Fresnel lens before the light converged at a point. The CPC is configured for reflecting and directing the light beams from the plano-concave lens to exit through a light output opening of the CPC. The light concentrator assembly has a large incident acceptance angle.Type: ApplicationFiled: September 30, 2011Publication date: April 12, 2012Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: KUO-FENG CHIANG, YING-CHIEH LU, YU-SHU CHEN, CHIEN-TING LU, YING-CHING CHEN, ZHENG-JAY HUANG
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Publication number: 20120088074Abstract: A workpiece with three-dimensional pattern having a three-dimensional surface and suitable for an electronic device is provided. A multiple three-dimensional micro patterns formed on the three-dimensional surface reflects an environment light to form images with a visual effect. The workpiece with three-dimensional pattern includes a workpiece and an adhesive layer. The adhesive layer is disposed on the workpiece and impressed to form the multiple three-dimensional micro patterns, and the workpiece is punched to form the three-dimensional surface. A first part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a first reflecting light beam. A second part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a second reflecting light beam.Type: ApplicationFiled: December 19, 2011Publication date: April 12, 2012Applicant: COMPAL ELECTRONICS, INC.Inventors: Wan-Li Chuang, Chien-Min Chang, Li-Jung Yu, Yung-Ching Chang, Ying-Ching Chen, Tsung-Sheng Chuang
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Publication number: 20120073653Abstract: A light concentration element assembly includes a Fresnel lens unit and a compound parabolic concentrator. The Fresnel lens unit includes a first Fresnel lens and a second Fresnel lens arranged parallel with each other, and configured for converging light transmitted therethrough. The compound parabolic concentrator includes at least two paraboloidal reflecting surfaces. The parabolic concentrator includes a light incident opening facing the Fresnel lens unit and a light output opening, and the paraboloidal reflecting surfaces are configured for reflecting the converged light from the Fresnel lens unit and outputting the reflected light through the light output opening. A solar cell apparatus using the light concentration element assembly is provided.Type: ApplicationFiled: September 20, 2011Publication date: March 29, 2012Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: KUO-FENG CHIANG, YING-CHIEH LU, YU-SHU CHEN, ZHENG-JAY HUANG, YING-CHING CHEN, KUO-MANG LO
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Publication number: 20120073626Abstract: A light concentrator assembly includes a first Fresnel lens, a second Fresnel lens, and a compound parabolic concentrator. The first Fresnel lens includes a first flat surface and an opposite first Fresnel lens surface. The second Fresnel lens includes a second flat surface and an opposite second Fresnel lens surface facing the first Fresnel lens surface. A first focal point of the first Fresnel lens and a second focal point of the second Fresnel lens coincide. The compound parabolic concentrator is located opposite the second flat surface. Light beams are converged by the first and second Fresnel lenses, and exit through the compound parabolic concentrator.Type: ApplicationFiled: September 22, 2011Publication date: March 29, 2012Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: YU-SHU CHEN, KUO-FENG CHIANG, CHIEN-TING LU, KUO-MANG LO, YING-CHING CHEN, ZHENG-JAY HUANG
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Publication number: 20120038271Abstract: An LED bulb includes a heat sink, a circuit, an LED, and a driving module. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The circuit is formed on a second face of the base, and the LED is disposed on the second face of the base and electrically connected with the circuit. The LED bulb further includes a first lead and a second lead electrically connecting with the circuit and extending through the base. The driving module includes a first electrode, and a second electrode electrically insulated from the first electrode and surrounding the first electrode. The first electrode of the driving circuit contacts with the first lead, and the second electrode of the driving circuit contacts with the second lead.Type: ApplicationFiled: October 10, 2010Publication date: February 16, 2012Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: YING-CHIEH LU, KUO-FENG CHIANG, ZHENG-JAY HUANG, KUO-MANG LO, CHIEN-TING LU, YING-CHING CHEN
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Publication number: 20110291542Abstract: An LED bulb includes a connector for electrically connecting with a power supply, a heat sink disposed on the connector, and a plurality of LEDs mounted the heat sink. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The LEDs are attached on a second face of the base. The base defines a plurality of through tunnels extending through the base from the first face to the second face of the base.Type: ApplicationFiled: June 8, 2010Publication date: December 1, 2011Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: YING-CHIEH LU, KUO-FENG CHIANG, ZHENG-JAY HUANG, YING-CHING CHEN
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Publication number: 20100271823Abstract: An exemplary heat dissipation device includes an elongated main body, a number of heat sinks, and a number of airflow channels. The main body has a central axis, and includes a first portion and a second portion. The second portion has an end distant from the first portion which is configured for supporting at least one item selected from the group consisting of a solid-state light source and a circuit board having a solid-state light source mounted thereon. The heat sinks are arranged around the first portion in sequence along the central axis of the main body, and spaced from one another. Each heat sink includes a number of fins extending out from the first portion radially. The airflow channel is defined between each two neighboring heat sinks.Type: ApplicationFiled: February 4, 2010Publication date: October 28, 2010Applicant: FOXSEMICON INTEGRATED TECHNOLOGY, INC.Inventors: HSIN-FEI HUANG, ZHENG-JAY HUANG, CHIEN-TING LU, YING-CHING CHEN, YU-PIN LIU
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Patent number: D608876Type: GrantFiled: June 10, 2009Date of Patent: January 26, 2010Assignee: Foxsemicon Integrated Technology, Inc.Inventors: Hsin-Fei Huang, Zheng-Jay Huang, Chien-Ting Lu, Ying-Ching Chen, Yu-Pin Liu