Patents by Inventor Ying-Ching Wu
Ying-Ching Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990351Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes at least one semiconductor die, an interposer, an encapsulant, a protection layer and connectors. The interposer has a first surface, a second surface opposite to the first surface and sidewalls connecting the first and second surfaces. The semiconductor die is disposed on the first surface of interposer and electrically connected with the interposer. The encapsulant is disposed over the interposer and laterally encapsulating the at least one semiconductor die. The connectors are disposed on the second surface of the interposer and electrically connected with the at least one semiconductor die through the interposer. The protection layer is disposed on the second surface of the interposer and surrounding the connectors. The sidewalls of the interposer include slanted sidewalls connected to the second surface, and the protection layer is in contact with the slant sidewalls of the interposer.Type: GrantFiled: March 26, 2021Date of Patent: May 21, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Jiun-Ting Chen, Chih-Wei Wu, Szu-Wei Lu, Tsung-Fu Tsai, Ying-Ching Shih, Ting-Yu Yeh, Chen-Hsuan Tsai
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Patent number: 11990429Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.Type: GrantFiled: November 28, 2022Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu
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Publication number: 20240136293Abstract: Provided are a package structure having a joint structure and a method of forming the same. The package structure includes: a first under bump metallurgy (UBM) structure disposed on a first dielectric layer, wherein the first UBM structure at least comprises: a barrier layer embedded in the first dielectric layer; and an upper metal layer disposed over the barrier layer, wherein a sidewall of the barrier layer is laterally offset outward from a sidewall of the upper metal layer, and a portion of a top surface of the barrier layer is exposed by the first dielectric layer; and a solder layer disposed on the first UBM structure and contacting the upper metal layer.Type: ApplicationFiled: January 31, 2023Publication date: April 25, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Wei Wu, Wen-Chih Chiou, Ying-Ching Shih
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Patent number: 11967546Abstract: A semiconductor structure includes a first interposer; a second interposer laterally adjacent to the first interposer, where the second interposer is spaced apart from the first interposer; and a first die attached to a first side of the first interposer and attached to a first side of the second interposer, where the first side of the first interposer and the first side of the second interposer face the first die.Type: GrantFiled: July 21, 2022Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Shang-Yun Hou, Hsien-Pin Hu, Sao-Ling Chiu, Wen-Hsin Wei, Ping-Kang Huang, Chih-Ta Shen, Szu-Wei Lu, Ying-Ching Shih, Wen-Chih Chiou, Chi-Hsi Wu, Chen-Hua Yu
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Publication number: 20240128211Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.Type: ApplicationFiled: April 27, 2023Publication date: April 18, 2024Inventors: Chih-Wei WU, An-Jhih SU, Hua-Wei TSENG, Ying-Ching SHIH, Wen-Chih CHIOU, Chun-Wei CHEN, Ming Shih YEH, Wei-Cheng WU, Der-Chyang YEH
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Patent number: 11955459Abstract: A package structure is provided. The package structure includes a first die and a second die, a dielectric layer, a bridge, an encapsulant, and a redistribution layer structure. The dielectric layer is disposed on the first die and the second die. The bridge is electrically connected to the first die and the second die, wherein the dielectric layer is spaced apart from the bridge. The encapsulant is disposed on the dielectric layer and laterally encapsulating the bridge. The redistribution layer structure is disposed over the encapsulant and the bridge. A top surface of the bridge is in contact with the RDL structure.Type: GrantFiled: March 7, 2022Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Szu-Wei Lu, Ying-Ching Shih
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Publication number: 20240101784Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.Type: ApplicationFiled: September 5, 2023Publication date: March 28, 2024Inventors: Chien-Hsin Wu, Ying-Chi Huang, Ying-Feng Lin, Wen-Chang Chen, Ho-Ching Huang, Ru-Jong Jeng
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Publication number: 20240105701Abstract: A package structure and methods for forming the package structure are provided. The package structure includes a package component, an encapsulant disposed around the package component, and a redistribution structure disposed over the package component and the encapsulant. The package component includes a substrate, a protection structure, which includes an organic material, over a first surface of the substrate, and a multi-layered structure encapsulated by the protection structure. Sidewalls of the multi-layered structure are spaced apart from the encapsulant by the protection structure.Type: ApplicationFiled: January 11, 2023Publication date: March 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Wei Wu, Ying-Ching Shih, Wen-Chih Chiou
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Publication number: 20240107780Abstract: A system on chip (SoC) die package is attached to a redistribution structure of a semiconductor device package such that a top surface of the SoC die package is above a top surface of an adjacent memory die package. This may be achieved through the use of various attachment structures that increase the height of the SoC die package. After encapsulating the memory die package and the SoC die package in an encapsulation layer, the encapsulation layer is grinded down. The top surface of the SoC die package being above the top surface of the adjacent memory die package results in the top surface of the SoC die package being exposed through the encapsulation layer after the grinding operation. This enables heat to be dissipated through the top surface of the SoC die package.Type: ApplicationFiled: January 5, 2023Publication date: March 28, 2024Inventors: Chih-Wei WU, Ying-Ching SHIH, Wen-Chih CHIOU, An-Jhih SU, Chia-Nan YUAN
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Publication number: 20240071855Abstract: A package structure including a semiconductor die, a redistribution circuit structure, a backside dielectric layer, conductive terminals, an electronic device, and an underfill is provided. The semiconductor die laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes redistribution conductive layers and thermal enhancement structures electrically insulated from the redistribution conductive layers, and the thermal enhancement structures are thermally coupled to the semiconductor die. The backside dielectric layer is disposed on the redistribution circuit structure. The conductive terminals penetrate through the backside dielectric layer. The electronic device is disposed over the backside dielectric layer and electrically connected to the redistribution circuit structure through the conductive terminals.Type: ApplicationFiled: August 26, 2022Publication date: February 29, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chih-Wei Wu, Ying-Ching Shih, Wen-Chih Chiou
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Publication number: 20210016133Abstract: An exerciser includes an object rotatable about a longitudinal axis. The object includes an outer surface and an inner surface opposite to the outer surface. The inner surface includes an axle seat extending along the longitudinal axis. A receiving space is defined between the inner surface and the axle seat. An axle is rotatably coupled to the axle seat of the object. The axle includes two ends extending beyond the outer surface of the object. Two jackets are mounted around the two ends of the axle. At least one weight is removably received in the receiving space of the object for increasing an overall weight of the exerciser.Type: ApplicationFiled: March 2, 2020Publication date: January 21, 2021Inventor: Ying-Ching Wu
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Patent number: 9089409Abstract: An adjustable waist pad (2) includes first and second bands (20, 30). An abutment face (36) at a free end (28) of the first band (20) is detachably engaged with an engagement face (38) of the second band (30). Two positioning members (44, 70) are detachably engaged with the engagement faces (24, 38) at engagement ends (26, 32) of the first and second bands (20, 30), respectively. A string (90) is extended through inner ends (46, 72) of two positioning member (44, 70) in a crisscross manner. Two elastic straps (62, 85) are fixed to the positioning members (44, 70) and detachably engaged with the first and second bands (20, 30). Two fixing members (96, 98) are fixed to two ends of the string (90). A tightening force of the waist pad (2) can be increased by pulling the elastic straps (62, 85).Type: GrantFiled: October 26, 2012Date of Patent: July 28, 2015Inventor: Ying-Ching Wu
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Publication number: 20140121578Abstract: An adjustable waist pad (2) includes first and second bands (20, 30). An abutment face (36) at a free end (28) of the first band (20) is detachably engaged with an engagement face (38) of the second band (30). Two positioning members (44, 70) are detachably engaged with the engagement faces (24, 38) at engagement ends (26, 32) of the first and second bands (20, 30), respectively. A string (90) is extended through inner ends (46, 72) of two positioning member (44, 70) in a crisscross manner. Two elastic straps (62, 85) are fixed to the positioning members (44, 70) and detachably engaged with the first and second bands (20, 30). Two fixing members (96, 98) are fixed to two ends of the string (90). A tightening force of the waist pad (2) can be increased by pulling the elastic straps (62, 85).Type: ApplicationFiled: October 26, 2012Publication date: May 1, 2014Inventor: Ying-Ching Wu
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Patent number: 8696521Abstract: An exerciser includes a suspension member having an extension strap. A connecting ring is fixed to a first end of the extension strap. A second end of the extension strap is wound around a positioning rod slideable on a linking ring to allow adjustment of an overall length of the extension strap. A hook is fixed to a looped attachment member and releasably engaged with one of the connecting ring and a first ring on the extension strap. A handle is slideably mounted around the attachment member. A connecting strap has an end fixed to the linking ring. A stop is fixed to the other end of the connecting strap. A second ring can be fixed to the connecting strap, and an attachment belt can be attached to the second ring. Two handles of two suspension members can be attached to two ends of a bar.Type: GrantFiled: April 25, 2011Date of Patent: April 15, 2014Inventor: Ying-Ching Wu
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Patent number: 8696527Abstract: An exerciser includes two straps and a handle mounted to an end of each strap by an adjusting member having a movable rod movable between two positions respectively allowing and not allowing adjustment of the length of the strap. A connecting member is mounted to the other end of each strap. A stop is engaged with an end of an inelastic strap on a suspension member. A retaining ring is engaged with the other end of the inelastic strap. A plurality of rings is fixed to the inelastic strap. The retaining ring is releasably engageable with one of the rings, so that the inelastic strap forms a loop. The connecting member is releasably engaged with one of the rings. The inelastic strap is mounted around a rod or extended through a gap between a door and a door frame, allowing user to perform exercises resisting the weight of the user.Type: GrantFiled: January 10, 2012Date of Patent: April 15, 2014Inventor: Ying-Ching Wu
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Patent number: 8544119Abstract: A cloth assembly for making a protective pad for sports includes a plurality of supporting fibers extending between and supporting first and second knitted cloths, providing an elastic air-permeable cloth. A knitted cloth includes a first side having a plurality of loops and a second side bonded to an outer face of the first knitted cloth. A hook tape includes a plurality of hooks on a face thereof. The hook tape is fixed to the first side of the knitted cloth or an outer surface of the second knitted cloth according to the type of the protective pad to be made. When the hook tape is fixed to the knitted cloth, the face of the hook tape having the hooks faces the first side of the knitted cloth having loops. Only a portion of the hook tape overlaps and is fixed to an end of the knitted cloth.Type: GrantFiled: November 1, 2011Date of Patent: October 1, 2013Inventor: Ying-Ching Wu
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Publication number: 20130178345Abstract: An exerciser includes two straps and a handle mounted to an end of each strap by an adjusting member having a movable rod movable between two positions respectively allowing and not allowing adjustment of the length of the strap. A connecting member is mounted to the other end of each strap. A stop is engaged with an end of an inelastic strap on a suspension member. A retaining ring is engaged with the other end of the inelastic strap. A plurality of rings is fixed to the inelastic strap. The retaining ring is releasably engageable with one of the rings, so that the inelastic strap forms a loop. The connecting member is releasably engaged with one of the rings. The inelastic strap is mounted around a rod or extended through a gap between a door and a door frame, allowing user to perform exercises resisting the weight of the user.Type: ApplicationFiled: January 10, 2012Publication date: July 11, 2013Inventor: Ying-Ching Wu
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Publication number: 20130104301Abstract: A cloth assembly for making a protective pad for sports includes a plurality of supporting fibers extending between and supporting first and second knitted cloths, providing an elastic air-permeable cloth. A knitted cloth includes a first side having a plurality of loops and a second side bonded to an outer face of the first knitted cloth. A hook tape includes a plurality of hooks on a face thereof. The hook tape is fixed to the first side of the knitted cloth or an outer surface of the second knitted cloth according to the type of the protective pad to be made. When the hook tape is fixed to the knitted cloth, the face of the hook tape having the hooks faces the first side of the knitted cloth having loops. Only a portion of the hook tape overlaps and is fixed to an end of the knitted cloth.Type: ApplicationFiled: November 1, 2011Publication date: May 2, 2013Inventor: Ying-Ching Wu
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Publication number: 20120270706Abstract: An exerciser includes a suspension member having an extension strap. A connecting ring is fixed to a first end of the extension strap. A second end of the extension strap is wound around a positioning rod slideable on a linking ring to allow adjustment of an overall length of the extensions strap. A hook is fixed to a looped attachment member and releasably engaged with one of the connecting ring and a first ring on the extension strap. A handle is slideably mounted around the attachment member. A connecting strap has an end fixed to the linking ring. A stop is fixed to the other end of the connecting strap. A second ring can be fixed to the connecting strap, and an attachment belt can be attached to the second ring. Two handles of two suspension members can be attached to two ends of a bar.Type: ApplicationFiled: April 25, 2011Publication date: October 25, 2012Inventor: Ying-Ching Wu
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Patent number: 8272093Abstract: A cloth disc assembly for a mop includes a disc having engaging holes. A fixing member is mounted to each engaging hole and includes a cylinder having a longitudinal hole. The cylinder further includes an engaging section formed on an outer periphery thereof and engaged in one of the engaging holes. A fixing hole extends from the outer periphery of the cylinder through an inner periphery of the longitudinal hole. A cleaning unit is extended through the longitudinal hole of the cylinder of each fixing member and includes a plurality of cleaning strips each having two ends extending out of the cylinder. A positioning member is mounted to each fixing member and includes a shank extending through the fixing hole of the cylinder of each fixing member into the longitudinal hole of the cylinder and pressing the cleaning strips against the inner periphery of the longitudinal hole of the cylinder.Type: GrantFiled: April 22, 2010Date of Patent: September 25, 2012Inventor: Ying-Ching Wu