Abstract: A package structure for welding powder has a casing and a casing cover. The casing cover is deposited on the cover. The casing and the casing cover are made of metallic copper. The casing cover has a protruding segment being cylindrical and formed on a bottom surface of the casing cover, and a mounting recess being round and formed in a top surface of the casing cover corresponding to the protruding segment for storing fine welding powder. The package structure has a fire strip deposited on the top surface of the casing cover and extending into the mounting recess via a top opening of the mounting recess, and a sealing sheet deposited on the top surface of the casing cover to hold the fire strip securely with the casing cover and seal the top opening of the mounting recess.

Abstract: A package structure for welding powder has a casing and a casing cover. The casing cover is deposited on the cover. The casing and the casing cover are made of metallic copper. The casing cover has a protruding segment being cylindrical and formed on a bottom surface of the casing cover, and a mounting recess being round and formed in a top surface of the casing cover corresponding to the protruding segment for storing fine welding powder. The package structure has a fire strip deposited on the top surface of the casing cover and extending into the mounting recess via a top opening of the mounting recess, and a sealing sheet deposited on the top surface of the casing cover to hold the fire strip securely with the casing cover and seal the top opening of the mounting recess.

Abstract: A method of operation for an input/output assignment tool is disclosed. The method generally includes the steps of (A) generating a graphic presentation to a user displaying (i) a circuit icon having a plurality of pin icons and (ii) a plurality of signal icons, (B) moving a first of the signal icons within the graphic presentation to a first of the pin icons in response to a move command from the user and (C) indicating an acceptance of an association between the first signal icon and the first pin icon in response to the association passing a rule.

Abstract: A method of operation for an input/output assignment tool is disclosed. The method generally includes the steps of (A) generating a graphic presentation to a user displaying (i) a circuit icon having a plurality of pin icons and (ii) a plurality of signal icons, (B) moving a first of the signal icons within the graphic presentation to a first of the pin icons in response to a move command from the user and (C) indicating an acceptance of an association between the first signal icon and the first pin icon in response to the association passing a rule.

Abstract: A method of operation for an input/output assignment tool is disclosed. The method generally includes the steps of (A) generating a graphic presentation to a user displaying (i) a circuit icon having a plurality of pin icons and (ii) a plurality of signal icons, (B) moving a first of the signal icons within the graphic presentation to a first of the pin icons in response to a move command from the user and (C) indicating an acceptance of an association between the first signal icon and the first pin icon in response to the association passing a rule.

Abstract: A method for defining valid placement of intellectual property (IP) blocks within a platform application specific integrated circuit comprising the steps of (A) extracting IP recorded information for an intellectual property (IP) block to be placed on a platform application specific integrated circuit, (B) extracting device data for the platform application specific integrated circuit and (C) determining one or more valid placement locations for the intellectual property (IP) block based upon the IP recorded information and the device data.

Abstract: A method for estimating resources during design planning is generally provided. A first step generally involves receiving design information for an integrated circuit design. A first portion of the integrated circuit design is generally complete, while a second portion of the integrated circuit design is generally incomplete. A second step generally involves receiving user input of estimated design information for the second portion of the integrated circuit design. A third step generally involves automatically generating one or more representative blocks representing the second portion of the integrated circuit design based on the user input. The one or more representative blocks may be generated having substantially equivalent size and characteristics to one or more actual blocks developed for the second portion of the integrated circuit design.

Abstract: A design tool for generating design views of a semiconductor chip is presented. The design tool includes an input module, a generation module, a first synthesis module, a user interface module and an extraction module. The input module may be configured to receive input including physical and logical resources and a custom chip specification. The generation module may be configured to generate Register Transfer Level (RTL) views for the semiconductor chip. The first synthesis module may be configured to perform logic synthesis using the RTL views. The user interface module may be configured to query a user whether re-usable intellectual property (IP) is to be generated. The extraction module may be configured to extract and package design information for the re-usable IP in response to a request from the user.

Abstract: A method for floorplan visualization comprising the steps of (A) receiving design information for an integrated circuit design comprising one or more subsystems, (B) generating one or more gate count estimates for the one or more subsystems of the integrated circuit design, (C) generating one or more gate density estimates for gates of the one or more subsystems mapped to one or more programmable areas of a programmable platform device and (D) generating a visual representation of one or more area estimations for each of the one or more subsystems based on the one or more gate count estimates and the one or more gate density estimates.