Patents by Inventor Ying-Hsiang Chen
Ying-Hsiang Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240088027Abstract: An integrated circuit includes an inductor that includes a first set of conductors in at least a first metal layer, and a guard ring enclosing the inductor. The guard ring includes a first conductor extending in a first direction, a second conductor extending in a second direction, and a first set of staggered conductors coupled to a first end of the first conductor and a first end of the second conductor. The first set of staggered conductors includes a second set of conductors in a second metal layer, a third set of conductors in a third metal layer and a first set of vias coupling the second set of conductors with the third set of conductors. The third metal layer is above the second metal layer. All metal lines in the second metal layer that are part of the guard ring extend in the first direction.Type: ApplicationFiled: November 14, 2023Publication date: March 14, 2024Inventors: Chiao-Han LEE, Chi-Hsien LIN, Ho-Hsiang CHEN, Hsien-Yuan LIAO, Tzu-Jin YEH, Ying-Ta LU
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Publication number: 20240027845Abstract: An electrically controllable viewing angle switch device is provided with a first substrate, a second substrate, a liquid crystal layer, multiple spacers, and multiple light-shielding patterns. The first substrate and the second substrate are overlapped with each other. The liquid crystal layer and the multiple spacers are disposed between the first substrate and the second substrate. The multiple light-shielding patterns are disposed on the second substrate. The orthographic projection area of each spacer on the second substrate is less than or equal to the orthographic projection area of each light-shielding pattern on the second substrate. The orthographic projection of each spacer on the second substrate is located within the orthographic projection of each light-shielding pattern on the second substrate. A display apparatus using an electrically controllable viewing angle switch device is also provided, in which light leakage near the spacer is extremely slight.Type: ApplicationFiled: July 12, 2023Publication date: January 25, 2024Applicant: Coretronic CorporationInventors: Ping-Yen Chen, Ying-Hsiang Chen, Chung-Yang Fang
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Publication number: 20230305215Abstract: A backlight module includes a light guide element including first optical microstructures and second optical microstructures. An angle value of an angle of the first optical microstructures is V1. When the second optical microstructures are respectively recessed into or protrude from a bottom surface, a projection of each sub-optical microstructure on a reference plane has a peak point closest or to farthest from a light emitting surface and a first valley point and a second valley point farthest from or closest to the light emitting surface, a height difference between the peak point and the first valley point or the second valley point is ?H, a length difference between the peak point and the first valley point or the second valley point is ?L, and tan?1(?H/?L) is V2, where V2>0 and V2?0.5·V1.Type: ApplicationFiled: March 13, 2023Publication date: September 28, 2023Applicant: Coretronic CorporationInventors: Ying-Hsiang Chen, Cheng-Yi Tseng, Chung-Yang Fang, Ping-Yen Chen
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Patent number: 11693273Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.Type: GrantFiled: April 9, 2021Date of Patent: July 4, 2023Assignee: Coretronic CorporationInventors: Chih-Jen Tsang, Ying-Hsiang Chen, Chung-Wei Huang, Chun-Chi Hsu
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Patent number: 11403535Abstract: A model-based machine learning system for calculating optimum molding conditions includes a data storage device providing a set of training data; an injection molding process emulator producing a set of emulated sensing data according to molding conditions as inputted; an injection molding process state observation unit, determining an injection molding process state from molding conditions, sensing data and a quality state, wherein the quality state at least includes an acceptance state; and an injection molding process optimization unit including an injection molding condition optimizer, wherein a molding condition optimization model constructed in the injection molding condition optimizer is trained according to the injection molding process state as determined, and the molding condition optimization model after training is introduced into an injection molding production line.Type: GrantFiled: December 21, 2018Date of Patent: August 2, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Hsiang Chen, Cheng-Ying Liu, Tsung-Sheng Kuo
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Patent number: 11401159Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.Type: GrantFiled: March 23, 2021Date of Patent: August 2, 2022Assignee: FORMOSA MATERIAL INDUSTRIAL CORP.Inventors: Chun-Lung Huang, Ying-Hsiang Chen, Fu-Hsuan Yang
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Publication number: 20210325732Abstract: A light source module includes a substrate, a light-emitting element, an optical adhesive layer and a reflective structure. The light-emitting element is disposed on the substrate. The optical adhesive layer is disposed on the substrate and covers the light-emitting element. The reflective structure is disposed in the optical adhesive layer and located above the light-emitting element. A display device using the aforementioned light source module is also provided. The light source module provided by the invention has the function of protecting the light-emitting element and improves the problem of the large thickness of the direct-type backlight module in prior art.Type: ApplicationFiled: April 9, 2021Publication date: October 21, 2021Inventors: CHIH-JEN TSANG, YING-HSIANG CHEN, CHUNG-WEI HUANG, CHUN-CHI HSU
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Publication number: 20210300748Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.Type: ApplicationFiled: March 23, 2021Publication date: September 30, 2021Inventors: Chun-Lung HUANG, Ying-Hsiang CHEN, Fu-Hsuan YANG
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Publication number: 20200202235Abstract: A model-based machine learning system for calculating optimum molding conditions includes a data storage device providing a set of training data; an injection molding process emulator producing a set of emulated sensing data according to molding conditions as inputted; an injection molding process state observation unit, determining an injection molding process state from molding conditions, sensing data and a quality state, wherein the quality state at least includes an acceptance state; and an injection molding process optimization unit including an injection molding condition optimizer, wherein a molding condition optimization model constructed in the injection molding condition optimizer is trained according to the injection molding process state as determined, and the molding condition optimization model after training is introduced into an injection molding production line.Type: ApplicationFiled: December 21, 2018Publication date: June 25, 2020Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Ying-Hsiang CHEN, Cheng-Ying LIU, Tsung-Sheng KUO
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Patent number: 6604257Abstract: The present invention discloses an apparatus and method for cleaning an exhaust conduit that has chemical substances deposited on its inside wall by utilizing a shaft that has a plurality of scraping elements mounted thereto capable of making vertically or radially oscillating motions inside the exhaust conduit such that the chemical substances can be dislodged from the inside wall and the exhaust conduit can be effectively cleaned. The apparatus may optionally include fluid nozzles provided in the shaft for dispensing a cleaning fluid during the cleaning process to further enhance the efficiency. The apparatus may further include a vacuum device for effectively removing the debris dislodged from the inside wall during such cleaning process.Type: GrantFiled: May 10, 1999Date of Patent: August 12, 2003Assignee: Taiwan Semiconductor Manufacturing Co., LtdInventors: Ming-Yi Lee, Ying-Hsiang Chen
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Patent number: 6499222Abstract: A template for measuring the edge width on a disk that is not covered by a coating layer on a top surface of the disk and a method for using such template are disclosed. The template is made of a substantially transparent sheet that has a contour substantially the same as the contour of the disk to be measured. A series of marks are provided on a top surface of the sheet along a peripheral edge of the sheet at numerous predetermined distances from the peripheral edge. The marks may be provided in scribed thin lines, or the marks may be provided in scribed thin lines that are color coded for easier identification purpose. The present invention novel template can be most suitably used on a silicon wafer of any size. However, it can also be used on a disk of any shape or contour to produce the same desirable result.Type: GrantFiled: January 29, 1999Date of Patent: December 31, 2002Assignee: Taiwan Semiconductor Manufacturing Company, LtdInventors: Hung-Ju Chien, Ying-Hsiang Chen, Wen-Kung Cheng, Yin-Lang Wang
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Patent number: 5954078Abstract: A buffer tank and pre-wetting apparatus prevent a liquid chemical waste from crystalizing on the inside walls of a drain pipe that carries the waste to a waste tank. The pre-wetting apparatus includes a pre-wetting tank with an overflow pipe that leads to the waste tank drain pipe. A water supply is connected to fill the pre-wetting tank to the rim of the overflow pipe and then overflow to wet the inside walls of the drain pipe before waste from the buffer tank is transferred through the overflow pipe and to the drain pipe and the waste tank.Type: GrantFiled: March 20, 1997Date of Patent: September 21, 1999Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Lien-Hsiang Chiang, Ying-Hsiang Chen
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Patent number: 5915398Abstract: A cleaning station for cleaning parts from apparatus that itself uses a water spray to clean a toxic gas. The cleaning station has a tray and a sink for holding a part to be spray cleaned and the sink is connected to drain the spray water into the drain system of the gas cleaning apparatus.Type: GrantFiled: June 16, 1997Date of Patent: June 29, 1999Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ying-Hsiang Chen, Chwan-Der Lee
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Patent number: 5697839Abstract: An apparatus for venting hazardous effluents from process equipment used in the manufacture of semiconductors, which is part of a larger ventilating system, is a "see-thru" transparent chamber which performs the function of a hood, and can be mounted on any one of the conventional semiconductor processing equipment. Because it is transparent, the operator can easily determine when to clean the hood. This is important from the point of view of not exposing the work piece in the processing equipment to effluent contaminants. Usually, the effluents are hazardous to health. Hence, the apparatus is equipped with a pair of gloves which are an integral part of an access door to the hood, and is used to manipulate remotely cleaning tools that are kept inside said hood: remote in the sense that the operator is never exposed to the hazardous effluents inside the chamber hood, and yet is easily capable of using the cleaning tools inside the hood by means of the pair gloves that are an integral part of the hood.Type: GrantFiled: July 15, 1996Date of Patent: December 16, 1997Assignee: Taiwan Semiconductor Manufacturing Company Ltd.Inventors: Ying-Hsiang Chen, Wei-Yao Chien, Deh-Hsiung Peng, Yung-Mao Hsu