Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.

Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: The multiple lamp circuit for minimizing lamp current imbalance comprises at least one transformer comprising primary windings and secondary windings. Multiple lamps are coupled in serial to the secondary windings of the transformer. Multiple separated lamp drive circuits are spliced from the transformer's secondary windings. A current balancing resistance is connected at a common node of the multiple lamps and other terminal of the current balancing resistance is connected to ground. The impedance of the current balancing resistance is relatively high compared to the ones of the multiple lamps to generate a balancing current for one of the multiple lamps, thereby resulting a current that flows through the multiple lamps is approximately equal.

Abstract: The multiple lamp circuit for minimizing lamp current imbalance comprises at least one transformer comprising primary windings and secondary windings. Multiple lamps are coupled in serial to the secondary windings of the transformer. Multiple separated lamp drive circuits are spliced from the transformer's secondary windings. A current balancing resistance is connected at a common node of the multiple lamps and other terminal of the current balancing resistance is connected to ground. The impedance of the current balancing resistance is relatively high compared to the ones of the multiple lamps to generate a balancing current for one of the multiple lamps, thereby resulting a current that flows through the multiple lamps is approximately equal.