Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: The present disclosure provides a light-emitting package. The light-emitting package includes a main body, a cavity disposed in the cavity, a base plane in the cavity and a light-emitting element. The light-emitting element is disposed in the cavity and connected to the base plane. The light-emitting element includes a substrate and a semiconductor stack on the substrate. The substrate includes a side wall, and the side wall incudes a first cutting trace. The main body includes a step portion disposed in the cavity and it surrounds the light-emitting element. The step portion comprises a first height relative to base plane, and the first cutting trace comprises a second height relative to the base plane. The second height is greater than the first height.

Abstract: A compound metal lid for semiconductor chip package is provided. The compound metal lid includes a first cover and a second cover. The first cover has a first frame body, a plurality of riveting holes, and an upper opening. The riveting holes penetrate through the first frame body and are distributed symmetrically on the first frame body. The upper opening is formed at an inner part of the first frame body, and the riveting holes surround the upper opening. The second cover has a second frame body, a plurality of riveting protrusions, and a lower opening. The riveting protrusions are formed on the upper surface of the second frame body. The lower opening penetrates through the second frame body. The first cover is disposed on an upper surface of the second cover, and the riveting protrusions are correspondingly riveted in the riveting holes.

Abstract: A fault detection method comprises the following steps. Receiving a first original sequence comprising a plurality of first data. Receiving a second original sequence comprising a plurality of second data. Aligning the first original sequence with the second original sequence according to trends of value changing of the first data and the second data. Performing an average operation on the aligned first original sequence and second original sequence to establish a standard sequence. Performing a difference operation between the first original sequence and the standard sequence to obtain a first total difference value. Performing a difference operation between the second original sequence and the standard sequence to obtain a second total difference value. When the first total difference value and/or the second total difference value is greater than an upper limit value, determining that the first original sequence and/or the second total difference value is abnormal.

Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Abstract: Memory systems with flexible erase suspend-resume operations are described herein. In one embodiment, a memory device is configured to receive an erase suspend command while a first erase pulse of an erase operation is at a flattop voltage. In response, the memory device suspends the erase operation. The memory device further resumes the erase operation such that a second erase pulse of the erase operation is ramped to the flattop voltage. Absent intervening erase suspend operations, erase operations of the memory device can include a single erase pulse that remains at the flattop voltage for a total duration. A first total duration plus a second total duration the first and second erase pulses, respectively, remain at the flattop voltage remains less than or equal to the total duration the single erase pulse remains at the flattop voltage.

Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

Abstract: A process apparatus including a chamber, a pump, and a transportation system set between the chamber and the pump is provided. The transportation system has a pipe, a pressure control valve, and a shielding unit. The pipe has an input end connected to the chamber and an output end connected to the pump to pump fluids out of the chamber through the pipe. The pressure control valve between the input and output ends is disposed on the pipe and has a valve plate to adjust a fluid flow in the pipe. The shielding unit between the input end and the pressure control valve is disposed on the pipe and has a shielding plate to be switched between an original position and a shielding position. The shielding plate at the shielding position permits conveyance of fluids in the pipe and prevents certain liquid particles of the fluids floating in the pipe.

Abstract: A process apparatus including a chamber, a pump, and a transportation system set between the chamber and the pump is provided. The transportation system has a pipe, a pressure control valve, and a shielding unit. The pipe has an input end connected to the chamber and an output end connected to the pump to pump fluids out of the chamber through the pipe. The pressure control valve between the input and output ends is disposed on the pipe and has a valve plate to adjust a fluid flow in the pipe. The shielding unit between the input end and the pressure control valve is disposed on the pipe and has a shielding plate to be switched between an original position and a shielding position. The shielding plate at the shielding position permits conveyance of fluids in the pipe and prevents certain liquid particles of the fluids floating in the pipe.

Abstract: A utilization of visual auxiliary inspection devices for vehicle servicing system and method, with an image take-up and recorder sensing head of a visual inspection device to display the image on a liquid crystal display, capable of using a digital multimedia audiovisual storage facility and the Internet or directly providing the servicing personnel or the customer with the inspection results, to make servicing easier, more efficient servicing and inspection operation, the servicing system includes: a braking system, an air conditioning circulation system, an engine cooling system, a steering control system, a chassis carrier system, a car parts system, a fuel intake system, and an engine exterior system.

Abstract: A multi-level pulse width modulation (MPWM) digital-to-analog converter for receiving a n-bit pulse code modulation (PCM) signal and then outputting a m-level analog signal is provided. The MPWM DAC comprises a converter circuit, 2m first output drivers, 2m second output drivers and a control circuit. The converter circuit is used for converting (n-m) most significant bits (MSB) of the n-bit PWM signal into a PWM waveform, and then generating a first input signal and a second input signal. Each of the 2m first output drivers is used for receiving the first input signal, and then generating a first output current, wherein the first output currents of the 2m first output drivers can be equal or not. Each of the 2m second output drivers is used for receiving the second input signal, and then generating a second output current, wherein the second output currents of the 2m first output drivers can be equal or not.

Abstract: ABSTRACT OF THE DISCLOSURE A multi-level pulse width modulation (MPWM) digital-to-analog converter for receiving a n-bit pulse code modulation (PCM) signal and then outputting a m-level analog signal is provided. The MPWM DAC comprises a converter circuit, 2m first output drivers, 2m second output drivers and a control circuit. The converter circuit is used for converting (n-m) most significant bits (MSB) of the n-bit PWM signal into a PWM waveform, and then generating a first input signal and a second input signal. Each of the 2m first output drivers is used for receiving the first input signal, and then generating a first output current, wherein the first output currents of the 2m first output drivers can be equal or not. Each of the 2m second output drivers is used for receiving the second input signal, and then generating a second output current, wherein the second output currents of the 2m first output drivers can be equal or not.

Abstract: The coating of a RF active material on a non-RF active substrate material of typical thickness for packaging purposes, can generate sufficient thermal energy to effect strong bonding of the substrate materials. The RF active material may be-deposited on less than the entire inner surface area of the substrate material, preferably, at or near the portion of the substrate surface which represents the heat seal interface. In this manner of application, additional coating or printing of other substances on the substrate surface can be achieved without hampering the heat sealing process. Flexible medical containers capable of containing a product which is maintained and removed under sterile conditions, can be constructed on commercial production machines from these coated non-RF active substrate materials.

Abstract: A baby walker including a seat, an annular base frame, two pairs of wheels symmetrically mounted on the base frame, two links connected in parallel between the two pairs of wheels above the base frame, and two crossed supports connected between the links and the seat, wherein the base frame is comprised of an annular upper plate and an annular bottom plate; each wheel is comprised of a circular bottom shell fixedly coupled to the annular upper plate of the base frame and moved with it along the annular bottom plate of the base frame, and an upper shell pivoted to the circular bottom shell and having an arm pivoted to one end of one link.

Abstract: The coating of a RF active material on a non-RF active substrate material of typical thickness for packaging purposes, can generate sufficient thermal energy to effect strong bonding of the substrate materials. The RF active material may be deposited on less than the entire inner surface area of the substrate material, preferably, at or near the portion of the substrate surface which represents the heat seal interface. In this manner of application, additional coating or printing of other substances on the substrate surface can be achieved without hampering the heat sealing process. Flexible medical containers capable of containing a product which is maintained and removed under sterile conditions, can be constructed on commercial production machines from these coated non-RF active substrate materials.