Abstract: A LED lamp includes a substrate, which has through holes cut through the top wall and bottom wall thereof and electric contacts fixedly provided at the top wall corresponding to the through holes for connection to power source, metal locating blocks respectively fixedly mounted in the through holes inside the substrate and carry a respective LED (light emitting diode) chips in each through hole of the substrate, and lead wires respectively electrically coupled between the LED chips at the locating blocks and the contacts at the substrate for guiding electric current from the contacts to the LED chips.

Abstract: A light emitting diode (LED) is a sealed and packaged structure for elevating heat dissipation efficiency of the LED; and is characterized that, a light emitting chip is placed at an area defined by fingers of the LED, and the light emitting diode has a lower portion thereof utilizing an inorganic material as a part of a sealed housing. According to the aforesaid structure, heat energy generated by the LED when a large electric current is inputted is rapidly conducted to an exterior via the inorganic material to offer all-round heat dissipation effects, thereby preventing the light emitting chip from damages caused by quantitative change due to high temperature as well as lengthening usage lifespan of the LED.

Abstract: A stacked light emitting diode structure includes a light emitting chip fixed at a stand and stacked thereon with one or more than one smaller light emitting chip. Wherein, the light emitting chips have different illumination wavelengths. The invention is characterized that, a lower-layer light emitting chip is a light-transmissive or opaque chip, a second or a third light emitting chip stacked thereon is necessarily a light-transmissive chip, and between the stacked chips is a light-transmissive insulating material for fixing the chips. When putting the aforesaid structure to use, efficacies as better blended light effects and intensity as well as a reduced occupied area are obtained.

Abstract: A light emitting diode mounting structure includes a metal plate provided with a plurality of openings and at least one fixed plastic base according to requirements. The plate is also disposed with a pillar wire holder at a lower portion thereof, and a column having a recess at a center of an upper portion thereof. The recess is placed with a chip. Another pillar wire holder is provided parallel to the aforesaid wire holder, and has one end thereof penetrated through the fixed plastic base, and the penetrated end thereof is connected to the chip via a metal wire. Epoxy is filled into a mold, and the metal plate is placed into the mold for encapsulation. Or, epoxy is filled into an outer housing, and the metal plate is placed into the outer housing for forming a light emitting diode.

Abstract: A light emitting diode mounting structure includes a metal plate provided with a plurality of openings and at least one fixed plastic base according to requirements. The plate is also disposed with a pillar wire holder at a lower portion thereof, and a column having a recess at a center of an upper portion thereof. The recess is placed with a chip. Another pillar wire holder is provided parallel to the aforesaid wire holder, and has one end thereof penetrated through the fixed plastic base, and the penetrated end thereof is connected to the chip via a metal wire. Epoxy is filled into a mold, and the metal plate is placed into the mold for encapsulation. Or, epoxy is filled into an outer housing, and the metal plate is placed into the outer housing for forming a light emitting diode.