Abstract: An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere.

Abstract: An apparatus includes a substrate having a surface and a plurality of solder balls arranged on the surface to form a ball grid array. A portion of the plurality of solder balls is arranged to have a pitch between adjacent solder balls. The adjacent solder balls having the pitch have a shape of a truncated sphere. At least one solder ball of the plurality of solder balls is included in a solder island on the surface having a shape that is different than the shape of the truncated sphere.

Abstract: A chip package (101) and a lens module (103) mounted on the chip package are provided. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.

Abstract: A digital camera module (10) includes a chip package (101) and a lens module (103) mounted on the chip package. The chip package includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip.

Abstract: A stacked chip packaging structure (10) includes a substrate (20), a first chip (40), a second chip (70), and a cover (80). The first chip is mounted on the substrate and is electrically connected with the substrate via a first plurality of wires (50a). The second chip is mounted above the first chip and above the wires connected with the first chip and is electrically connected with the substrate via a second plurality of wires (50b). The cover is mounted above the second chip and the wires connected with the second chip. The mounting of the second chip and the cover in such a manner is facilitated through the use of an adhesive/glue (60a, 60b) that is able to function both as an adherent and as a spacer.

Abstract: A clamping device (100) for clamping a digital camera module (300) includes a base (12) and two legs (14). Two legs extend from two sides of the base. Each leg has at least one foot (18). The at least one foot defines an arcuate surface (180). The arcuate surfaces cooperatively define a space for receiving the digital camera module.