Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: The present invention discloses an organic polymer film and a manufacturing method thereof. The organic polymer film is mainly manufactured by the following steps. Firstly, the step (A) provides a xylene precursor and a substrate, and the step (B) places the substrate inside of a plasma equipment. After that, the step (C) evacuates the plasma equipment while introducing a carrier gas which carries vapor of the xylene precursor, and the step (D) turns on a pulse power supply system of the plasma equipment, generating a short pulse for plasma ignition. Finally, the step (E) forms the organic polymer film on the substrate. In the aforementioned steps, the frequency of the short pulse plasma is between 1 Hz˜10,000 Hz, and the pulse period of the short pulse plasma is between 1 ?s˜60 ?s.

Abstract: Embodiments disclosed herein relate to using an implantation process and a melting anneal process performed on a nanosecond scale to achieve a high surface concentration (surface pile up) dopant profile and a retrograde dopant profile simultaneously. In an embodiment, a method includes forming a source/drain structure in an active area on a substrate, the source/drain structure including a first region comprising germanium, implanting a first dopant into the first region of the source/drain structure to form an amorphous region in at least the first region of the source/drain structure, implanting a second dopant into the amorphous region containing the first dopant, and heating the source/drain structure to liquidize and convert at least the amorphous region into a crystalline region, the crystalline region containing the first dopant and the second dopant.

Abstract: A method includes forming a gate stack on a first portion of a semiconductor substrate, removing a second portion of the semiconductor substrate on a side of the gate stack to form a recess, growing a semiconductor region starting from the recess, implanting the semiconductor region with an impurity, and performing a melt anneal on the semiconductor region. At least a portion of the semiconductor region is molten during the melt anneal.

Abstract: A test circuit coupled to a memory device and configured to read data stored in the memory device during a memory dump, includes a dump controller and a pattern generator. The dump controller triggers the pattern generator to start a pattern generating operation in response to a setting of memory dump mode by a processor. The pattern generator generates multiple control signals in the pattern generating operation and provides the control signals to the memory device. The control signals include an address signal, a memory enable signal and a read enable signal. The address signal includes multiple memory addresses arranged in multiple consecutive clock cycles of the processor. The consecutive clock cycles of the processor is provided to read the data stored in the memory addresses.

Abstract: The present application discloses a calibration data generation circuit and an associated method. The calibration data generation circuit includes: a first delay unit, having a first delay amount; and a first scan path, including: a first scan flip-flop, including: a scan data input terminal; a clock input terminal, arranged for receiving a clock signal; and an output terminal; and a second scan flip-flop, including: a scan data input terminal, coupled to the output terminal of the first scan flip-flop; a clock input terminal, arranged for receiving a delayed clock signal formed by the clock signal passing through the first delay unit; and an output terminal; wherein when the calibration data generation circuit operates, the first scan flip-flop and the second scan flip-flop are configured in a scan shift mode.

Abstract: A scan chain designing method includes: obtaining test points according to a gate-level netlist; determining integers M and N, wherein M and N are no greater than an amount X of the test points; selecting M and N test points to be a first and second set test points according to a priority; obtaining a first test coverage and a first test pattern count according to the first set test points and obtaining a second test coverage and a second test pattern count according to the second set test points; obtaining a predicted test coverage curve according to the first and second test coverages; determining an optimum amount O according to the predicted test coverage curve, the first and second test pattern counts, wherein O is no greater than X; and selecting O test points to arrange a scan chain according to the priority and the optimum amount O.

Abstract: Disclosed is a device for detecting the margin of a circuit operating at an operating speed. The device includes: a signal generating circuit generating an input signal including predetermined data; a first adjustable delay circuit delaying the input signal by a first delay amount and thereby generating a delayed input signal; a circuit under test performing a predetermined operation based on a predetermined operation timing and thereby generating a to-be-tested signal according to the delayed input signal; a second adjustable delay circuit delaying the to-be-tested signal by a second delay amount and thereby generating a delayed to-be-tested signal; a comparison circuit comparing the data included in the delayed to-be-tested signal with the predetermined data based on the predetermined operation timing and thereby generating a comparison result; and a calibration circuit determining whether the circuit under test passes a speed test according to the comparison result.

Abstract: A reliability detection device includes a control circuit, oscillator circuits, and an output circuit. The control circuit is configured to generate enable signals according to a mode signal. The oscillator circuits output oscillating signals, in which each of the oscillator circuits is configured to generate a corresponding oscillating signal in the oscillating signals according to a switching signal when the mode signal has a first logic value, and generate the corresponding oscillating signal according to a corresponding enable signal in the enable signals when the mode signal has a second logic value, and the switching signal is associated with a functional circuit. The output circuit is configured to output a detection signal according to the oscillating signals when the mode signal has the second logic value, in which the detection signal is to indicate a reliability of the functional circuit.

Abstract: A reliability detection device includes a control circuit, oscillator circuits, and an output circuit. The control circuit is configured to generate enable signals according to a mode signal. The oscillator circuits output oscillating signals, in which each of the oscillator circuits is configured to generate a corresponding oscillating signal in the oscillating signals according to a switching signal when the mode signal has a first logic value, and generate the corresponding oscillating signal according to a corresponding enable signal in the enable signals when the mode signal has a second logic value, and the switching signal is associated with a functional circuit. The output circuit is configured to output a detection signal according to the oscillating signals when the mode signal has the second logic value, in which the detection signal is to indicate a reliability of the functional circuit.

Abstract: Disclosed is a device for detecting the margin of a circuit operating at an operating speed. The device includes: a signal generating circuit generating an input signal including predetermined data; a first adjustable delay circuit delaying the input signal by a first delay amount and thereby generating a delayed input signal; a circuit under test performing a predetermined operation based on a predetermined operation timing and thereby generating a to-be-tested signal according to the delayed input signal; a second adjustable delay circuit delaying the to-be-tested signal by a second delay amount and thereby generating a delayed to-be-tested signal; a comparison circuit comparing the data included in the delayed to-be-tested signal with the predetermined data based on the predetermined operation timing and thereby generating a comparison result; and a calibration circuit determining whether the circuit under test passes a speed test according to the comparison result.

Abstract: An electronic device test database generating method, comprising: (a) acquiring cell layout information of a target electronic device; (b) generating possible defect location information of the target electronic device according to the cell layout information, wherein the possible defect location information comprises at least one possible defect location of the target electronic device; (c) testing the target electronic device according to the possible defect location information to generate a testing result; and (d) generating an electronic device test database according to the testing result.

Abstract: A wafer testing machine and a method for training an artificial intelligence (AI) model to test wafers are provided. The wafer contains multiple dies. The method includes the following steps of: determining a target die from the dies; selecting multiple reference dies close to the target die based on the target die and a preset range; generating a main training data which includes a measured value of the target die and the measured value of each reference die; generating an auxiliary training data which indicates whether each reference die is a passed die or a failed die; and training the AI model using the main training data and the auxiliary training data.

Abstract: A circuit having multiple scan modes is disclosed. The circuit includes a first circuit block and a second circuit block. The first circuit block corresponds to a first scan mode of the multiple scan modes, and the first circuit block includes at least one first scan chain for receiving a test signal from an external automatic test equipment. The second circuit block corresponds to a second scan mode of the multiple scan modes, and the second circuit block includes at least one second scan chain for receiving another test signal from the external automatic test equipment. The second scan chain includes at least one specific flip-flop positioned in the first circuit block, and the specific flip-flop is configured to drive the second circuit block.

Abstract: The present disclosure relates to a circuit testing system, including a control circuit and an I/O interface circuit. The control circuit is electrically connected to a test machine, and is configured to receive a scan control signal. The I/O interface circuit is electrically connected to the control circuit, the test machine, the scan chain circuit and a circuit under test. When the scan control signal is at a first level, the control circuit is configured to control the I/O interface circuit to propagate a scan test signal sended from the test machine to the scan chain circuit. When the scan control signal is at a second level, the control circuit is configured to control the I/O interface circuit to propagate a response signal generated by the circuit under test to the test machine.

Abstract: The present disclosure relates to a circuit testing system, including a control circuit and an interface circuit. The control circuit is electrically connected to a test machine, and configured to receive a scan control signal. The I/O interface circuit is electrically connected to the control circuit, the test machine, the scan chain circuit and a circuit under test. When the scan control signal is at a first level, the control circuit is configured to control the I/O interface circuit to conduct the scan chain circuit to the test machine. When the scan control signal is at a second level, the control circuit is configured to control the I/O interface circuit to conduct the circuit under test to the test machine so as to propagate a response signal generated by the circuit under test to the test machine.

Abstract: A test pattern generating method for generating a test pattern for a circuit under test. The test pattern generating method comprises: (a) computing a plurality of signal delay values which a plurality of cells have due to different defects; (b) comparing the signal delay values and signal path delay information of a target circuit to generate a fault model; and (c) generate at least one test pattern according to the fault model.

Abstract: Disclosed is a measuring circuit for quantizing variations in the operating speed of a target circuit. The measuring circuit includes: a signal generator configured to generate a predetermined signal; an adjustable delay circuit configured to generate a first and second delay signals according to the predetermined signal respectively; a signal detector configured to detect the first and second delay signals respectively and thereby generate a first and second detection results respectively; and a calibrating circuit configured to enable a first and second numbers of delay units of the adjustable delay circuit according to the first and second detection results respectively so as to make each of the delays respectively caused by the first and second numbers of delay units be less than a delay threshold, in which the first and second numbers relate to the operating speed of the target circuit operating in the first and second conditions respectively.

Abstract: The present disclosure relates to a circuit testing system, including a control circuit and an interface circuit. The control circuit is electrically connected to a test machine, and configured to receive a scan control signal. The I/O interface circuit is electrically connected to the control circuit, the test machine, the scan chain circuit and a circuit under test. When the scan control signal is at a first level, the control circuit is configured to control the I/O interface circuit to conduct the scan chain circuit to the test machine. When the scan control signal is at a second level, the control circuit is configured to control the I/O interface circuit to conduct the circuit under test to the test machine so as to propagate a response signal generated by the circuit under test to the test machine.

Abstract: The present disclosure relates to a circuit testing system, including a control circuit and an I/O interface circuit. The control circuit is electrically connected to a test machine, and is configured to receive a scan control signal. The I/O interface circuit is electrically connected to the control circuit, the test machine, the scan chain circuit and a circuit under test. When the scan control signal is at a first level, the control circuit is configured to control the I/O interface circuit to propagate a scan test signal sended from the test machine to the scan chain circuit. When the scan control signal is at a second level, the control circuit is configured to control the I/O interface circuit to propagate a response signal generated by the circuit under test to the test machine.