Abstract: A method for managing emissions from a vehicle having an aftertreatment system is provided. The method includes: receiving, by a controller, information indicative of a temperature of an aftertreatment system of the vehicle and a power output of an engine of the vehicle; comparing, by the controller, the temperature of the aftertreatment system to a temperature threshold; comparing, by the controller, the power output to a power output threshold; and responsive to the comparisons, commanding, by the controller, an aftertreatment system heater to selectively engage and disengage to warm the aftertreatment system of the vehicle.

Abstract: A hybrid vehicle comprises an engine, an energy storage device, and an aftertreatment system comprising a SCR catalyst configured to treat constituents of an exhaust gas. A controller is operatively coupled to the engine, the energy storage device, and the after treatment system, and configured to estimate an exhaust gas temperature and flow rate of the exhaust gas based on a set of engine operating parameters. The controller determines an exhaust gas cooling rate based on the exhaust gas temperature, flow rate, and a SCR catalyst temperature, and an ambient cooling rate based on an ambient temperature, a vehicle speed and the catalyst temperature. The controller determines a SCR catalyst temperature change rate based on the exhaust gas and ambient cooling rates, and adjusts a load distribution between the engine and the energy storage device based on the SCR catalyst temperature change rate.

Abstract: An electrical connector includes an insulative front housing, an insulative rear housing and a plurality of contacts. The front housing forms a mating cavity. The contact includes a contacting section extending into the mating cavity, a retaining section retained to the front housing, and a connecting section connected with the wire. The rear housing includes a front receiving space and a rear receiving space communicating with each other. The rear portion of the front housing is assembled into the front receiving space of the rear housing to have the connecting sections of the contacts exposed in the front receiving space. The rear receiving space receives the corresponding wires therein with corresponding opening to allow the wires to extend therethrough.

Abstract: A system includes a catalyst for receiving and treating exhaust gas generated by an engine, a passive NOx adsorber (PNA) positioned upstream of the catalyst, a bypass valve positioned upstream of the catalyst and the PNA, and a controller. The controller is configured to, determine that the catalyst is operating under cold start conditions, control the bypass valve to direct exhaust gas to the PNA, determine that the catalyst is no longer operating under cold start conditions and continue to control the bypass valve to direct exhaust gas to the PNA for a predetermined duration, and after the elapse of the predetermined duration, control the bypass valve to direct exhaust gas to the catalyst bypassing the PNA. The controller is also configured to detect a high transient torque demand while the exhaust gas is provided to the PNA, and split the torque demand between the engine and an electric motor.

Abstract: The enclosed disclosure relates to vehicle systems in which an engine, a particulate filter fluidly coupled with the engine, a selective catalytic reduction (SCR) system fluidly coupled with the engine downstream of the particulate filter, an electrical heating device implemented with the particulate filter, and a controller operatively coupled with the engine and the electrical heating device, are implemented. The controller can detect, when the engine is turned off, a condition for turning on the engine, detect a temperature of the particulate filter of the SCR system, activate the electrical heating device in response to the detected temperature being below a lower temperature threshold, and turn on the engine in response to the detected temperature being at or above the lower temperature threshold.

Abstract: The present invention provides an application of a rifamycin-quinolizidone conjugate molecule shown in formula I and pharmaceutically acceptable salt thereof in preparation of a drug for treating or preventing infections caused by methicillin-resistant, quinolone-resistant, and methicillin and quinolone multidrug resistant Staphylococcus aureus. The rifamycin-quinolizidone conjugate molecule and pharmaceutically acceptable salt thereof provided by the present invention can effectively treat or prevent bacterial infections and diseases caused by methicillin-resistant, quinolone-resistant, and methicillin and quinolone multidrug resistant Staphylococcus aureus, and can reduce spontaneous resistance frequency as compared with a drug combination of rifamycin and quinolones.

Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

Abstract: An electrical connector includes an insulative front housing, an insulative rear housing and a plurality of contacts. The front housing forms a mating cavity. The contact includes a contacting section extending into the mating cavity, a retaining section retained to the front housing, and a connecting section connected with the wire. The rear housing includes a front receiving space and a rear receiving space communicating with each other. The rear portion of the front housing is assembled into the front receiving space of the rear housing to have the connecting sections of the contacts exposed in the front receiving space. The rear receiving space receives the corresponding wires therein with corresponding opening to allow the wires to extend therethrough.

Abstract: Novel iron chelating group conjugated penam derivatives described herein show antibacterial activity, and could be used as antibacterial agents or beta-lactamase inhibitors (BLIs) which are of value for application in combination with other antibacterial agents.

Abstract: Novel iron chelating group conjugated penam derivatives described herein show antibacterial activity, and could be used as antibacterial agents or beta-lactamase inhibitors (BLIs) which are of value for application in combination with other antibacterial agents.

Abstract: A power chip package module and a manufacturing method thereof are provided. In the manufacturing method, a temporary carrier having an alignment pattern is provided, in which the temporary carrier includes a base and a peelable adhesive material disposed on the base. Thereafter, a circuit board having an accommodating space passing therethrough is disposed on the temporary carrier according to the alignment pattern. Furthermore, a chip is disposed in the accommodating space with an active surface thereof facing the temporary carrier according to the alignment pattern, in which the chip is fixed on the temporary carrier by the peelable adhesive material. The accommodating space is filled with a molding material to form an initial package structure. The initial package structure is separated from the temporary carrier, and then an electrically and thermally conductive layer is formed on a bottom surface of the chip and is in contact therewith.

Abstract: The present invention provides a use of a rifamycin-nitroimidazole coupling molecule, or a stereoisomer, hydrate, deuterium-substituted form, ester, solvate, crystal form, metabolite, pharmaceutically acceptable salt or prodrug thereof in resisting nontuberculous mycobacteria. The rifamycin-nitroimidazole coupling molecule has a structure shown in formula (I) below. The rifamycin-nitroimidazole coupling molecule, or the stereoisomer, hydrate, deuterium-substituted form, ester, solvate, crystal form, metabolite, pharmaceutically acceptable salt or prodrug thereof may effectively against nontuberculous mycobacteria, and then may be used for treating infection caused by nontuberculous mycobacteria.

Abstract: The present invention provides a use of a rifamycin-quinolizidone coupling molecule, or a stereoisomer, hydrate, deuterium-substituted form, ester, solvate, crystal form, metabolite, pharmaceutically acceptable salt or prodrug thereof in resisting nontuberculous mycobacteria. The rifamycin-quinolizidone coupling molecule has a structure shown in formula (I) The rifamycin-quinolizidone coupling molecule, or the stereoisomer, hydrate, deuterium, ester, solvate, crystal form, metabolite, pharmaceutically acceptable salt or prodrug thereof may effectively against nontuberculous mycobacteria, and then may be used for treating infection caused by human nontuberculous mycobacteria.

Abstract: A method of inhibiting anaerobic bacteria includes administering to a patient in need thereof a rifamycin-nitroimidazole conjugate molecule shown in formula I. The rifamycin-nitroimidazole conjugate molecule shown in formula I of the present invention has broad-spectrum antibacterial activity against anaerobic bacteria, including activity against most pathogenic bacteria associated with bacterial vaginosis, in vitro antibacterial activity stronger than that of drugs against bacterial vaginosis such as metronidazole and clindamycin, and potential use in prevention and treatment of bacterial vaginosis or other related diseases caused by anaerobic bacteria.

Abstract: A method of inhibiting gastrointestinal ammonia-producing bacteria includes administering to a patient in need thereof a rifamycin-quinolizidone dual-action molecule shown in formula I. The rifamycin-quinolizidone dual-action molecule shown in formula I of present invention has an antibacterial spectrum similar to that of rifaximin, stronger antibacterial activity against the gastrointestinal common ammonia-producing bacteria, low frequency for resistance development, and potential use in prevention and treatment of hepatic encephalopathy and related bacterial infections.

Abstract: A internal combustion engine system includes a gasoline internal combustion engine having a set of donor cylinders and a set of non-donor cylinders. The donor cylinders provide a proportion of the exhaust gas to an exhaust gas recirculation system and the remainder of the exhaust gas to an exhaust gas aftertreatment system including a particulate filter. The non-donor cylinders also provide exhaust gas to exhaust gas aftertreatment system. An engine controller can determine whether the particulate filter needs regeneration, and in response, retard a spark timing of the non-donor cylinders by an amount that is different from an amount or retardation of the donor cylinders.

Abstract: A process for recovering performance of a component of an aftertreatment system. The component includes an inlet and an outlet. The inlet is positioned upstream relative to an exhaust gas flow through the aftertreatment system, and the outlet is positioned downstream relative to the exhaust gas flow through the aftertreatment system. The process includes removing the component from the aftertreatment system. The process also includes regenerating the component, such as subjecting the component to an acid wash and/or heat treating the component. The process further includes reinstalling the component into the aftertreatment system with the inlet positioned downstream relative to the exhaust gas flow through the aftertreatment system and the outlet positioned upstream relative to the exhaust gas flow through the aftertreatment system.

Abstract: A internal combustion engine system includes a gasoline internal combustion engine having a set of donor cylinders and a set of non-donor cylinders. The donor cylinders provide a proportion of the exhaust gas to an exhaust gas recirculation system and the remainder of the exhaust gas to an exhaust gas aftertreatment system including a particulate filter. The non-donor cylinders also provide exhaust gas to exhaust gas aftertreatment system. An engine controller can determine whether the particulate filter needs regeneration, and in response, retard a spark timing of the non-donor cylinders by an amount that is different from an amount or retardation of the donor cylinders.

Abstract: Provided is an embedded substrate package structure, including, from top to bottom, a fourth dielectric layer, a second substrate, a chip with a fifth dielectric layer, a third dielectric layer, a second dielectric layer, a first substrate and a first dielectric layer; wherein the substrates are disposed respectively with wire layers and through holes, and each of dielectric layers is disposed with openings, conductive bumps or conductive pads, wire layers, through holes, and chip to collectively form electrical connection. The chip is electrically connected to the substrate in a flip-chip manner, and the back of the chip interfaces a dielectric layer. Compared to the prior art which chip bonding is in face-up mode, the packaging structure with the face-down chip of the present invention can simplify the manufacturing process by the flip-chip method.

Abstract: Provided is an embedded substrate package structure, including, from top to bottom, a fourth dielectric layer, a second substrate, a chip with a fifth dielectric layer, a third dielectric layer, a second dielectric layer, a first substrate and a first dielectric layer; wherein the substrates are disposed respectively with wire layers and through holes, and each of dielectric layers is disposed with openings, conductive bumps or conductive pads, wire layers, through holes, and chip to collectively form electrical connection. The chip is electrically connected to the substrate in a flip-chip manner, and the back of the chip interfaces a dielectric layer. Compared to the prior art which chip bonding is in face-up mode, the packaging structure with the face-down chip of the present invention can simplify the manufacturing process by the flip-chip method.