Abstract: The present disclosure relates to a high-precision and high-efficiency laser polishing method oriented to a large-size ultra-thin mask plate, and belongs to the technical field of advanced laser manufacturing. A high-precision and high-efficiency laser polishing technology is applied to the surface smoothness improvement of the large-size ultra-thin mask plate. The high-precision and high-efficiency laser polishing method specifically comprises the four following steps: step one, selecting and placing an ultra-thin invar alloy mask plate on a five-axis machining platform; step two, adopting a nanosecond continuous laser, and setting a laser incident angle; step three, setting N laser polishing areas; and step four, performing laser polishing continuous splicing. Compared with the prior art, the surface smoothness of the mask plate is improved, the polishing efficiency is high, the precision is high, and the influence on the geometrical characteristic size of the appearance of an original mask plate is low.

Abstract: The present disclosure relates to laser machining equipment for grinding semiconductor wafers, and belongs to the field of laser machining equipment. The laser machining equipment mainly comprises a special fixture, laser measuring meters, a laser emission module, an X-axis movement system, a Y-axis movement system, a Z-axis movement system, a liftable laser machining workbench, data transmission cables, an industrial personal computer and a human-computer interface.

Abstract: The present disclosure relates to a high-precision and high-efficiency laser polishing method oriented to a large-size ultra-thin mask plate, and belongs to the technical field of advanced laser manufacturing. A high-precision and high-efficiency laser polishing technology is applied to the surface smoothness improvement of the large-size ultra-thin mask plate. The high-precision and high-efficiency laser polishing method specifically comprises the four following steps: step one, selecting and placing an ultra-thin invar alloy mask plate on a five-axis machining platform; step two, adopting a nanosecond continuous laser, and setting a laser incident angle; step three, setting N laser polishing areas; and step four, performing laser polishing continuous splicing. Compared with the prior art, the surface smoothness of the mask plate is improved, the polishing efficiency is high, the precision is high, and the influence on the geometrical characteristic size of the appearance of an original mask plate is low.

Abstract: A method of preparing antimicrobial surface on medical devices: first, producing multi-functional surface with bacterial anti-adhesion and self-cleaning functions through single-stop ultrafast laser fabrication approach for development of micro/nano patterns, then producing bactericidal thin film through depositing metal nanoparticles on those micro/nano patterned surfaces. The combination of bacterial anti-adhesion and bactericidal film can inhibit initial bacterial adhesion and release heavy metal ions to kill the bacteria simultaneously. Meanwhile, the multi-functional surface with self-cleaning function can prevent the killed bacteria from accumulating at the substrate surface, thereby obtaining long-lasting antibacterial effect.

Abstract: A method of preparing antimicrobial surface on medical devices: first, producing multi-functional surface with bacterial anti-adhesion and self-cleaning functions through single-stop ultrafast laser fabrication approach for development of micro/nano patterns, then producing bactericidal thin film through depositing metal nanoparticles on those micro/nano patterned surfaces. The combination of bacterial anti-adhesion and bactericidal film can inhibit initial bacterial adhesion and release heavy metal ions to kill the bacteria simultaneously. Meanwhile, the multi-functional surface with self-cleaning function can prevent the killed bacteria from accumulating at the substrate surface, thereby obtaining long-lasting antibacterial effect.

Abstract: The present invention disclosed a method for fabrication of fluorescence-Raman dual enhanced modal biometal substrate. The method comprises the steps of grinding surface of the substrate with different types of sandpapers to remove an oxide layer and smooth the surface of the substrate; wherein a roughness of the surface is less than 0.1 ?m; cleaning the grinded substrate in an ultrasonic bath to remove any impurity; placing the specimen on the stage of an ultrashort laser system; processing the specimen at a certain laser processing parameters by a galvanometer; finally, three-dimensional micro-nano structure is fabricated on the specimen. The technique of the present invention is promising for large-scale commercial application because it is simple and economical, while the enhanced Raman and fluorescence signal is stable and high reproducibility.