Abstract: A method and an apparatus for the measurement and inspection of integrated circuit. Such an apparatus includes a camera for sensing an image of the integrated circuit (IC), an oblique light source, and a reflector. The camera has an optical axis passing through the IC normal to the plane of the IC. The oblique light source radiates light on the IC obliquely to the plane of the IC such that at least a portion of the oblique light source is positioned on one side of the optical axis. The reflector is positioned on the opposite side of the optical axis relative the portion of the oblique light source for reflecting light that crosses the optical axis from the oblique light source to the camera, such that at least a portion of the IC interposes between the portion of the oblique light source and the reflector. As a result, the shape of that portion of the IC is imaged on the camera by backlighting. The leads on the IC can be inspected in this manner.