Patents by Inventor Yiyao WU

Yiyao WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230289263
    Abstract: A storage cluster may dynamically select a data transport mode for supporting a backup or export job. The storage cluster may receive a trigger indication to create, a backup of data of a source virtual machine. The storage cluster may select a data transport mode to use for reading the data from the source virtual machine to create the backup at the storage cluster. The selection may be from a set of data transport modes that includes a proxy virtual machine mode and a direct-to-host mode. The storage cluster may transmit, to a host for the source virtual machine, a request to activate the selected data transport mode, and receive the data from the source virtual machine via the selected data transport mode. The storage cluster may use the data to create the backup.
    Type: Application
    Filed: March 14, 2022
    Publication date: September 14, 2023
    Inventors: Yang Yang, Hao Zhou, Li Ding, Yiyao Wu
  • Patent number: 11432398
    Abstract: One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.
    Type: Grant
    Filed: November 25, 2020
    Date of Patent: August 30, 2022
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yiyao Wu, Xinbo Ma, Zhiqiang Liao
  • Publication number: 20210084753
    Abstract: One example printed circuit board transmission line includes a substrate layer, a metal line, at least one first welding point, at least one first transmission medium, and a metal component that is configured to implement a grounding function. The metal line is plated on a surface of the substrate layer. The at least one first welding point is a welding point at which the metal line is connected to the at least one first transmission medium. The at least one first welding point is welded to the metal line and welded to the at least one first transmission medium. The metal component is welded to the at least one first transmission medium. At least one groove is provided on one side of the at least one first welding point.
    Type: Application
    Filed: November 25, 2020
    Publication date: March 18, 2021
    Inventors: Yiyao WU, Xinbo MA, Zhiqiang LIAO