Patents by Inventor Yk Hsiao

Yk Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency
    Patent number: 8174114
    Abstract: A semiconductor package structure with a heat dissipating stiffener and method of fabricating the same are provided. In one embodiment, the package structure comprises a substrate having a front side and a back side; a semiconductor chip mounted on the front surface of the substrate; a thermally-conductive stiffener mounted over the front surface of the substrate and surrounding the chip, the stiffener having a first portion and a second portion, wherein the first portion is wider than the second portion so as to allow for easy egress of a dispenser into a gap between the chip and the substrate; an underfill layer filled and cured in the gap; and a plurality of solder balls mounted on the back surface of the substrate.
    Type: Grant
    Filed: December 15, 2005
    Date of Patent: May 8, 2012
    Assignee: Taiwan Semiconductor Manufacturing Go. Ltd.
    Inventors: Chien-Hsiun Lee, Yk Hsiao
  • Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency
    Publication number: 20070145571
    Abstract: A semiconductor package structure with a heat dissipating stiffener and method of fabricating the same are provided. In one embodiment, the package structure comprises a substrate having a front side and a back side; a semiconductor chip mounted on the front surface of the substrate; a thermally-conductive stiffener mounted over the front surface of the substrate and surrounding the chip, the stiffener having a first portion and a second portion, wherein the first portion is wider than the second portion so as to allow for easy egress of a dispenser into a gap between the chip and the substrate; an underfill layer filled and cured in the gap; and a plurality of solder balls mounted on the back surface of the substrate.
    Type: Application
    Filed: December 15, 2005
    Publication date: June 28, 2007
    Inventors: Chien-Hsiun Lee, Yk Hsiao